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Specifications
Mfr. Part #:
YLLCGQ-01-2718-DA1
Package:
SMD-4P,2.7x1.8mm
Key Attributes
Model Number:
YLLCGQ-01-2718-DA1
Product Description
Product Overview
YLLCGQ-01-2718-DA1 is a MEMS airflow switch sensor designed for detecting micro air pressure differences. Its compact 2.7x1.8mm SMT-compatible package allows for efficient automated production and reflow soldering. The sensor utilizes a MEMS chip to convert air pressure changes into capacitance variations, which are then interpreted by an integrated ASIC chip. This ASIC design eliminates the risk of MCU-related freezing or reset failures due to low voltage. The sensor is ideal for portable devices such as electronic cigarettes, offering a low static current of 5uA in power-saving mode and a simple peripheral circuit.Product Attributes
- Brand: Not specified
- Origin: Not specified
- Material: RoHS compliant (EU Directive 2011/65/EC as amended), Halogen-free (IEC 61249-2-21:2003)
- Color: Not specified
- Certifications: RoHS, IEC 61249-2-21:2003
Technical Specifications
| Parameter | Symbol | Minimum | Typical | Maximum | Unit | Conditions |
|---|---|---|---|---|---|---|
| Power Voltage | VDD | 2.4 | 3.7 | 4.2 | V | TA=25 |
| Quiescent Current | Iq | 2.5 | 5 | uA | VDD=3.7V, TA=25 | |
| Pressure Threshold | PTH | -100 | Pa | VDD=3.7V, TA=25 | ||
| Over-suction Protection | TMAX | 12 | s | VDD=3.7V, TA=25 | ||
| Output Enable Time | T-EN | 30 | ms | VDD=3.7V, TA=25 | ||
| Operating Temperature | Top | -20 | 85 | VDD=3.7V, TA=25 | ||
| Storage Temperature | TSTG | -40 | 150 | |||
| Operating Temperature | TOPR | -20 | 150 | |||
| ESD (HBM) | 2000 | V |
Product Details
- Model: YLLCGQ-01-2718-DA1
- Package Size: 2.7x1.8mm
- Packaging: Tape & Reel (13 inch reel, 12000 pcs/reel)
- Dimensions: 0.15mm tolerance (unless otherwise specified)
- Pin Definitions:
- 1: TM (NC) - Test Pin (No Connection)
- 2: GATE - Switch Output
- 3: VDD - Power Voltage
- 4: GND - Ground
Reflow Curve Recommendations (Pb-free)
| Stage | Symbol | Parameter | Value | Unit |
|---|---|---|---|---|
| Preheat | Average ramp rate (TL to TP) | 3 max | C/sec | |
| Minimum temperature | TSMIN | 150 | C | |
| Maximum temperature | TSMAX | 200 | C | |
| Time (TSMIN to TSMAX) | tS | 60 to 180 | sec | |
| Ramp-up | Ramp-up rate (TSMAX to TL) | 1.5~2 | C/sec | |
| Time maintained above liquidus temperature | tL | 60 to 150 | sec | |
| Liquidus temperature | TL | 217 | C | |
| Peak | Peak temperature | TP | 260 max | C |
| Time within 5C of actual peak temperature | tP | 20 to 40 | sec | |
| Ramp-down | Ramp-down rate (TL to TP) | 6 max | C/sec | |
| Cooling | Time 25 C to peak temperature | t | 8 max | minutes |
Storage and Handling
- Store in a warehouse with humidity below 75%, avoiding sudden temperature changes, acidic air, other harmful air, or strong magnetic fields.
- Recommended exposure time after unpacking: not exceeding 4 weeks.
- Transport via ordinary means is permitted for standard packaging. Protect from moisture, shock, sunburn, and pressure during transit.
2506181720_YTL-YLLCGQ-01-2718-DA1_C49230424.pdf
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