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Specifications
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC3225N4R504MK0
Package:
SMD,8.1x6mm
Key Attributes
Model Number:
SMDNTC3225N4R504MK0
Product Description
Product Overview
The SMD-3225 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and various electronic applications. Featuring advanced encapsulation technology meeting UL94-V0 standards, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape reels for automated mounting via lead-free reflow/wave soldering.
Product Attributes
- Brand: Songtian ()
- Product Type: Encapsulated Surface Mount NTC Thermistor
- Series: SMD-3225
- Encapsulation Material: Meets UL94-V0 standard
- Packaging: SMD tape reel
- Soldering Compatibility: Lead-free reflow/wave soldering
- Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.
Technical Specifications
Part Number Coding Principle:
SMD NTC 3225 N 2R5 05 M 0
- NTC: Negative Temperature Coefficient Thermistor
- Model: SMD
- Size: 3225 (approx. 8.1*6.0mm)
- Lead Shape: N (Internal Fold), W (External Fold)
- Zero-Power Resistance @ 25C: e.g., 020: 2.0, 2R5: 2.5, 201: 200
- Max. Steady Current: e.g., S5: 1.5A, 05: 5.0A
- Resistance Tolerance: L: 15%, M: 20%
Product Markings (Example):
- Songtian Logo
- NTC Negative Temperature Coefficient Thermistor
- 3225 (Size: approx. 8.1*6.0mm)
- 050 (Zero-Power Resistance @ 25C: 5.0)
- M (Capacity Tolerance: M (20%))
Dimensions (mm)
External Fold (W)
| Parameter | Value |
|---|---|
| L | 8.1 0.3 |
| L1 | 10.0 0.3 |
| W | 6.0 0.3 |
| L2 | 11.4 0.3 |
| H | 2.5 0.3 |
| L3 | 0.5 0.3 |
| W1 | 2.5 0.3 |
| T | 0.15 0.01 |
Internal Fold (N)
| Parameter | Value |
|---|---|
| L | 8.1 0.3 |
| L1 | 8.5 0.3 |
| W | 6.0 0.3 |
| L2 | 6.0 Min |
| H | 2.5 0.3 |
| L3 | 1.1 0.3 |
| W1 | 2.5 0.3 |
Electrical Performance
| Model | Zero-Power Resistance @ 25C () | Max. Steady Current @ 25C (A) | Max. Steady Current Residual Resistance @ 25C () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/) | Operating Temperature Range (C) |
|---|---|---|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 0.065 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*02005** | 2 | 5 | 0.085 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*2R505** | 2.5 | 5 | 0.095 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*03005** | 3 | 5 | 0.100 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*04004** | 4 | 4 | 0.150 | 2600 | <44 | >13 | -40 to 175 |
| SMDNTC3225*05004** | 5 | 4 | 0.156 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*06003** | 6 | 3 | 0.240 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*6R803** | 6.8 | 3 | 0.245 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*07003** | 7 | 3 | 0.2824 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*08003** | 8 | 3 | 0.255 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*10003** | 10 | 3 | 0.275 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*12002** | 12 | 2 | 0.462 | 2800 | <48 | >14 | -40 to 175 |
| SMDNTC3225*13002** | 13 | 2 | 0.465 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*15002** | 15 | 2 | 0.468 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*16002** | 16 | 2 | 0.470 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*18002** | 18 | 2 | 0.495 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*20002** | 20 | 2 | 0.512 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*22002** | 22 | 2 | 0.563 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*25002** | 25 | 2 | 0.623 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*300S5** | 30 | 1.5 | 0.667 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*330S5** | 33 | 1.5 | 0.734 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*470S5** | 47 | 1.5 | 1.002 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*500S5** | 50 | 1.5 | 1.021 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*600S5** | 60 | 1.5 | 1.215 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*800S2** | 80 | 1.2 | 1.656 | 3200 | <52 | >15 | -40 to 175 |
| SMDNTC3225*101S1** | 100 | 1.1 | 2.053 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*121S1** | 120 | 1.1 | 2.253 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*20101** | 200 | 1 | 4.121 | 3200 | <50 | >13 | -40 to 175 |
Reliability Experiments
| No. | Item | Test Method | Standard |
|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Direction and Time: X, Y, and Z axes for 2 hours each | No visible damage, Resistance change rate: 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning and area 95% |
| 3 | Resistance to Soldering Heat | Immerse product leads in 2605 solder liquid for 101 seconds, then remove | Resistance change rate: 10% |
| 4 | High Temperature Storage | Stored at 1252 for 1000+48 hours, tested after 2 hours of standing | Resistance change rate: 20% |
| 5 | Humidity Resistance | 1. Placed in an environment of 402 and 90-95% humidity for 1000 hours. 2. Placed in an environment of 402 and 90-95% humidity with 1/20 of the maximum dissipation voltage applied (not less than 0.5V) for 500 hours. | Resistance change rate: 20% |
| 6 | Thermal Shock | -4030min 255min 12530min 255min, 5 cycles | Resistance change rate: 20% |
| 7 | Endurance Test | 1. 255, Imax, 1000h; 2. 255, Imax, (1min ON /5min OFF) * 1000 times. | No visible damage, Resistance change rate: 20% |
| 8 | Insulation Withstand Voltage | Apply 750Vac voltage for 1 minute between the coil wound on the product surface and the leads. | No external damage |
Packaging Instructions
Taping Specifications (Unit: mm)
| SPEC | Internal Fold (N) | External Fold (W) | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A0 | B0 | K0 | P | P0 | P2 | T | A0 | B0 | K0 | P | P0 | P2 | T | |
| Dimensions | 6.350.1 | 8.450.1 | 3.250.1 | 8.00.1 | 4.00.1 | 2.00.1 | 0.30.05 | 6.160.1 | 11.900.15 | 3.100.1 | 8.00.15 | 4.00.15 | 2.00.15 | 0.30.05 |
Component per Reel
| SPEC | Internal Fold (N) | External Fold (W) | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| W | E | F | D0 | D1 | W | E | F | D0 | D1 | |
| Dimensions | 16.00.3 | 1.750.1 | 7.50.1 | 1.5+0.1/-0 | 1.5+0.1/-0 | 24.00.3 | 1.750.15 | 11.50.15 | 1.5+0.15/-0 | 1.5+0.15/-0 |
| Pieces | 4000pcs | 4000pcs | ||||||||
15-inch Reel Dimensions (Unit: mm)
| SPEC | Internal Fold (N) | External Fold (W) | ||
|---|---|---|---|---|
| Dimensions | Hole Diameter | Dimensions | Hole Diameter | |
| A+0/-2 | 380 | 100 | 380 | 100 |
| D0.3 | 13.3 | 13.3 | 13.3 | 13.3 |
| E0.5 | 2.3 | 2.3 | 2.3 | 2.3 |
| F0.5 | 10.75 | 10.75 | 10.75 | 10.75 |
| N3.0 | 16.4 | 24.4 | 16.4 | 24.4 |
| T10.3 | 2.2 | 2.2 | 2.2 | 2.2 |
| T20.3 | 2.2 | 2.2 | 2.2 | 2.2 |
| W0.2 | 16 | 16 | 24 | 24 |
Soldering Instructions
Lead-Free Reflow Soldering Curve
When reflow soldering thermistors, it should be performed under the following conditions:
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max.
Wave Soldering Curve
(Curve data not provided in the source text)
Soldering Iron Rework Conditions
| Item | Condition |
|---|---|
| Soldering Iron Tip Temperature | 400 (max.) |
| Soldering Time | 3.5 sec (max.) |
| Soldering Iron Power | 50W (max.) |
Storage Environment
- Store products under the following conditions and use within 6 months after delivery.
- Temperature: 10~30, Relative Humidity: 60% max.
- Solder NTC within 168 hours after opening the moisture-proof packaging. After opening the moisture-proof packaging, store the NTC in the moisture-proof packaging with a desiccant and HIC card, and maintain the above state.
- If the storage period exceeds 6 months, or the indicator color of the accompanying HIC card changes after the package is opened, bake the product (60 * 168hr) before soldering.
- Reference data for baking when product humidity exceeds requirements before reflow soldering, or when exposure time exceeds shelf life (shelf life after baking starts from zero):
- Do not store products in corrosive substances such as sulfur, chlorine gas, or acid, as this will cause lead oxidation and reduce solderability.
- To avoid the influence of moisture, dust, etc., products should be stored on shelves.
- Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.
Usage Precautions
- The working environment temperature should be within the range specified by the technical conditions.
- Do not install near heat-generating or combustible components; maintain a clearance of more than 3 mm to avoid damaging the components.
- Wear gloves before touching the leads.
- This specification guarantees the quality of our products as individual units. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
- If your company's trial use of our products exceeds the product functions defined in this test specification, we will not be responsible for any failures caused thereby.
- When the NTC is damaged, the failure may lead to a short circuit. To prevent dangerous situations such as ignition, smoking, or fire during a short circuit, please use components such as fuses in the circuit to set up an automatic failsafe function.
Applications
- Circuit Protection
- Industrial Equipment
- Communication Equipment
- Consumer Electronics
- Automotive Electronics
Features
- Advanced encapsulation process, encapsulation material meets UL94-V0.
- Compact structure, small size, space-saving.
- Superior high-temperature and high-humidity performance.
- Strong surge suppression capability.
- SMD tape reel packaging, suitable for lead-free reflow/wave soldering automatic mounting.
2508261540_STE-SMDNTC3225N4R504MK0_C50751510.pdf
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