<
>
Specifications
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC3225N08003MK0
Package:
SMD,8.1x6mm
Key Attributes
Model Number:
SMDNTC3225N08003MK0
Product Description
Product Overview
The SMD-3225 Series is a series of encapsulated surface mount thermistors designed for circuit protection and various electronic applications. These thermistors feature advanced encapsulation technology meeting UL94-V0 standards, offering a compact size, superior high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape reels for automatic placement using lead-free reflow/wave soldering.
Product Attributes
- Brand: Songtian ()
- Series: SMD-3225
- Type: Encapsulated Surface Mount Thermistor (NTC)
- Encapsulation Material: Meets UL94-V0
- Packaging: SMD Tape Reel
- Manufacturing Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.
Technical Specifications
Part Number Coding Principle:
SMD NTC 3225 [Foot Shape] [Resistance at 25C] [Max Steady Current] [Resistance Tolerance]
- NTC: Negative Temperature Coefficient Thermistor
- Model: SMD
- Size: 3225 (approx. 8.1*6.0mm)
- Foot Shape: N (Internal Fold), W (External Fold)
- Resistance at 25C (Zero Power): e.g., 020 (2.0), 2R5 (2.5), 201 (200)
- Max Steady Current: e.g., S5 (1.5A), 05 (5.0A)
- Resistance Tolerance: L (15%), M (20%)
Product Marking Example:
- Songtian Logo
- NTC (Negative Temperature Coefficient Thermistor)
- 3225 (Size: approx. 8.1*6.0mm)
- 050 (Resistance at 25C: 5.0)
- M (Tolerance: M (20%))
Dimensions:
| Product Dimensions (mm) - External Fold (W) | Pad Dimensions (mm) - External Fold (W) | ||
|---|---|---|---|
| Parameter | Value | Parameter | Value |
| L | 8.1 0.3 | a | 10.0 0.2 |
| L1 | 10.0 0.3 | b | 2.2 0.2 |
| W | 6.0 0.3 | c | 3.6 0.2 |
| L2 | 11.4 0.3 | ||
| H | 2.5 0.3 | ||
| L3 | 0.5 0.3 | ||
| W1 | 2.5 0.3 | ||
| T | 0.15 0.01 | ||
| Product Dimensions (mm) - Internal Fold (N) | Pad Dimensions (mm) - Internal Fold (N) | ||
|---|---|---|---|
| Parameter | Value | Parameter | Value |
| L | 8.1 0.3 | a | 5.7 0.2 |
| L1 | 8.5 0.3 | b | 1.65 0.2 |
| W | 6.0 0.3 | c | 3.0 0.2 |
| L2 | 6.0 Min | ||
| H | 2.5 0.3 | ||
| L3 | 1.1 0.3 | ||
| W1 | 2.5 0.3 | ||
| Model | Rated Zero Power Resistance @25 () | Max Steady Current @25 (A) | Residual Resistance @ Max Steady Current @25 () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/) | Operating Temperature Range () |
|---|---|---|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 0.065 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*02005** | 2 | 5 | 0.085 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*2R505** | 2.5 | 5 | 0.095 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*03005** | 3 | 5 | 0.100 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*04004** | 4 | 4 | 0.150 | 2600 | <44 | >13 | -40 to 175 |
| SMDNTC3225*05004** | 5 | 4 | 0.156 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*06003** | 6 | 3 | 0.240 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*6R803** | 6.8 | 3 | 0.245 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*07003** | 7 | 3 | 0.2824 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*08003** | 8 | 3 | 0.255 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*10003** | 10 | 3 | 0.275 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*12002** | 12 | 2 | 0.462 | 2800 | <48 | >14 | -40 to 175 |
| SMDNTC3225*13002** | 13 | 2 | 0.465 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*15002** | 15 | 2 | 0.468 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*16002** | 16 | 2 | 0.470 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*18002** | 18 | 2 | 0.495 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*20002** | 20 | 2 | 0.512 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*22002** | 22 | 2 | 0.563 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*25002** | 25 | 2 | 0.623 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*300S5** | 30 | 1.5 | 0.667 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*330S5** | 33 | 1.5 | 0.734 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*470S5** | 47 | 1.5 | 1.002 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*500S5** | 50 | 1.5 | 1.021 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*600S5** | 60 | 1.5 | 1.215 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*800S2** | 80 | 1.2 | 1.656 | 3200 | <52 | >15 | -40 to 175 |
| SMDNTC3225*101S1** | 100 | 1.1 | 2.053 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*121S1** | 120 | 1.1 | 2.253 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*20101** | 200 | 1 | 4.121 | 3200 | <50 | >13 | -40 to 175 |
Usage:
- Circuit Protection
- Industrial Equipment
- Communication Equipment
- Consumer Electronics
- Automotive Electronics
Features:
- Advanced encapsulation process, encapsulation material meets UL94-V0.
- Compact structure, small size, space-saving.
- Superior high-temperature and high-humidity performance.
- Strong surge suppression capability.
- SMD tape packaging, suitable for lead-free reflow/wave soldering automatic placement.
Reliability Testing:
| No. | Item | Test Method | Standard |
|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Direction & Time: X, Y, Z axes each 2 hours | No visible damage, Resistance change rate: 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning and area 95% |
| 3 | Resistance to Soldering Heat | Immerse product leads in 2605 solder liquid for 101 seconds, then remove. | Resistance change rate: 10% |
| 4 | High Temperature Storage | Store at 1252 for 1000+48 hours, test after 2 hours of static state. | Resistance change rate: 20% |
| 5 | Humidity Resistance | 1. Place product in 402, 90-95% humidity environment for 1000 hours. 2. Place product in 402, 90-95% humidity environment, applying 1/20 of max. dissipation voltage, not less than 0.5V, for 500 hours. | Resistance change rate: 20% |
| 6 | Thermal Shock | -4030min 255min 12530min 255min, 5 cycles total. | Resistance change rate: 20% |
| 7 | Endurance Test | 1. 255, Imax, 1000h; 2. 255, Imax, (1min ON /5min OFF) * 1000 times. | No visible damage, Resistance change rate: 20% |
| 8 | Insulation Withstand Voltage | Apply 750Vac voltage for 1 minute to the encapsulated surface of the product, wound with metal wire in a tight coil, between coil terminals and leads. | No external damage |
Packaging Description:
| Tape Packaging Specification (mm) | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| SPEC | A0 | B0 | K0 | P | P0 | P2 | T | N(Internal Fold) | W(External Fold) |
| Value | 6.350.1 | 8.450.1 | 3.250.1 | 8.00.1 | 4.00.1 | 2.00.1 | 0.30.05 | ||
| Value | 6.160.1 | 11.900.15 | 3.100.1 | 8.00.15 | 4.00.15 | 2.00.15 | 0.30.05 | ||
| Component/Reel | ||||||
|---|---|---|---|---|---|---|
| SPEC | W | E | F | D0 | D1 | |
| N(Internal Fold) | 16.00.3 | 1.750.1 | 7.50.1 | 1.5+0.1/-0 | 1.5+0.1/-0 | 4000pcs |
| W(External Fold) | 24.00.3 | 1.750.15 | 11.50.15 | 1.5+0.15/-0 | 1.5+0.15/-0 | 4000pcs |
| 15-inch Reel Dimensions (mm) | ||
|---|---|---|
| SPEC | N(Internal Fold) | W(External Fold) |
| E0.5 | 2.3 | 2.3 |
| F0.5 | 10.75 | 10.75 |
| W0.2 | 16.4 | 24.4 |
| T10.3 | 2.2 | 2.2 |
| T20.3 | 2.2 | 2.2 |
| A+0/-2 | 380 | 380 |
| N3.0 | 100 | 100 |
| D0.3 | 13.3 | 13.3 |
Soldering Instructions:
Lead-Free Reflow Soldering Curve:
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max.
Wave Soldering Curve: (Details not provided in source text)
Soldering Iron Rework Conditions:
| Item | Condition |
|---|---|
| Soldering Iron Tip Temperature | 400 (max.) |
| Soldering Time | 3.5 sec (max.) |
| Soldering Iron Power | 50W (max.) |
Storage Environment:
- Store under the following conditions and use within 6 months after delivery.
- Temperature: 10~30, Relative Humidity: 60% max.
- Solder NTC within 168 hours after opening the moisture-proof packaging. After opening, store NTC in the moisture-proof packaging with desiccant and HIC card, maintaining the above conditions.
- If the storage period exceeds 6 months, or the indicator color of the accompanying HIC card changes after the package is opened, baking (60 * 168hr) is required before soldering.
- Reference data for baking when product humidity exceeds requirements before reflow soldering, or when exposure time exceeds shelf life, or when temperature/humidity conditions exceed requirements (shelf life after baking starts from zero): (Details not provided in source text)
- Do not store products in corrosive substances such as sulfur, chlorine gas, or acids, as this may cause lead oxidation and reduce solderability.
- To avoid the influence of moisture, dust, etc., products should be stored on shelves.
- Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.
Usage Precautions:
- The working environmental temperature should be within the specified range of technical conditions.
- Do not install near heat-generating or combustible components; maintain a gap of more than 3 mm to avoid damaging the component.
- Wear gloves before touching the leads.
- This specification guarantees the quality of our products as individual components. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
- If your company's trial use of our products exceeds the product functions defined in this test specification, we will not be responsible for failures caused by this.
- When an NTC is damaged, the failure may result in a short circuit. To prevent dangerous situations such as overheating, smoking, or fire in case of a short circuit, please use components like fuses in the circuit to set up an automatic fail-safe function.
2508261540_STE-SMDNTC3225N08003MK0_C50751514.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
