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quality Encapsulated NTC thermistor STE SMDNTC2522N07002MK0 designed for communication and consumer devices factory
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quality Encapsulated NTC thermistor STE SMDNTC2522N07002MK0 designed for communication and consumer devices factory
>
Specifications
Operating Temperature:
-40℃~+175℃
Tolerance:
±20%
Mfr. Part #:
SMDNTC2522N07002MK0
Package:
SMD,6x5.6mm
Key Attributes
Model Number: SMDNTC2522N07002MK0
Product Description

Product Overview

The SMD-2522 Series is a series of encapsulated surface mount NTC thermistors designed for various electronic applications. These thermistors feature advanced encapsulation technology with UL94-V0 rated materials, offering a compact size, small volume, and excellent space-saving capabilities. They provide superior performance in high temperature and high humidity environments, along with strong surge suppression capabilities. Packaged in SMD tape reels, they are suitable for lead-free reflow and wave soldering automated assembly. Key applications include circuit protection, industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

  • Brand: Songtian ()
  • Series: SMD-2522
  • Encapsulation Material: Meets UL94-V0
  • Packaging: SMD Tape Reel
  • Soldering Compatibility: Lead-free reflow/wave soldering
  • Foot Shape: Inner Fold (N)

Technical Specifications

Model R25 () Max. Steady Current @25 (A) Max. Residual Resistance @ Max. Steady Current () B Value (K) 10% Thermal Time Constant (S) Dissipation Factor (mW/) Operating Temperature Range ()
SMDNTC2522N2R504** 2.5 4 0.113 2600 <35 >11 -40 to 175
SMDNTC2522N03004** 3 4 0.100 2600 <35 >11 -40 to 175
SMDNTC2522N04003** 4 3 0.150 2600 <35 >11 -40 to 175
SMDNTC2522N05003** 5 3 0.156 2800 <34 >11 -40 to 175
SMDNTC2522N06002** 6 2 0.240 2800 <34 >11 -40 to 175
SMDNTC2522N6R802** 6.8 2 0.245 2800 <34 >11 -40 to 175
SMDNTC2522N07002** 7 2 0.2824 2800 <34 >11 -40 to 175
SMDNTC2522N08002** 8 2 0.255 2800 <32 >11 -40 to 175
SMDNTC2522N10002** 10 2 0.275 2800 <32 >11 -40 to 175
SMDNTC2522N12001** 12 1 0.462 2800 <32 >11 -40 to 175
SMDNTC2522N13001** 13 1 0.465 2800 <32 >11 -40 to 175
SMDNTC2522N15001** 15 1 0.468 2800 <30 >11 -40 to 175
SMDNTC2522N16001** 16 1 0.470 2800 <30 >11 -40 to 175
SMDNTC2522N18001** 18 1 0.495 3000 <30 >11 -40 to 175
SMDNTC2522N20001** 20 1 0.512 3000 <30 >11 -40 to 175
SMDNTC2522N22001** 22 1 0.563 3000 <30 >11 -40 to 175
SMDNTC2522N25001** 25 1 0.623 3000 <30 >11 -40 to 175
SMDNTC2522N30001** 30 1 0.667 3000 <30 >11 -40 to 175
SMDNTC2522N33001** 33 1 0.734 3000 <30 >11 -40 to 175
SMDNTC2522N47001** 47 1 1.002 3000 <30 >11 -40 to 175
SMDNTC2522N50001** 50 1 1.021 3000 <30 >11 -40 to 175
SMDNTC2522N600X8** 60 0.8 1.215 3000 <30 >11 -40 to 175
SMDNTC2522N800X8** 80 0.8 1.656 3200 <30 >11 -40 to 175
SMDNTC2522N101X8** 100 0.8 2.053 3200 <30 >11 -40 to 175
SMDNTC2522N121X8** 120 0.8 2.253 3200 <30 >11 -40 to 175
SMDNTC2522N201X5** 200 0.5 4.121 3200 <32 >11 -40 to 175
Product Dimensions (mm) Pad Dimensions (mm)
Parameter Value Parameter Value
L 6.0 0.1 a 5.5 Min
L1 7.0 0.15 b 2.2 0.1
W 5.55 0.1 c 3.6 0.2
L2 6.0 0.15
H 2.38 0.1
L3 0.5 0.1
W1 2.5 0.02
Reliability Testing
No. Item Test Method Standard Resistance Change Rate Visual Inspection
1 Vibration Frequency: 10~55Hz, Amplitude: 0.75mm, Axis: X, Y, Z (2 hours each) 10% No visible damage
2 Solderability Temperature: 2455, Time: 30.5s Uniform tinning, 95% area
3 Resistance to Soldering Heat Immersion in 2605 solder for 101s 10%
4 High Temperature Storage 1252 for 1000+48 hours, then 2 hours rest 20%
5 Humidity Resistance 1) 402, 90-95% RH for 1000 hours
2) 402, 90-95% RH with 1/20 max. dissipation voltage (0.5V) for 500 hours
20%
6 Thermal Shock -40 (30min) 25 (5min) 125 (30min) 25 (5min), 5 cycles 20%
7 Endurance Test 1) 255, Imax, 1000h
2) 255, Imax, (1min ON /5min OFF) * 1000 cycles
20% No visible damage
8 Insulation Voltage Proof 750Vac applied for 1 minute between coil and leads No external damage

Soldering Instructions

Lead-Free Reflow Soldering Curve
  • Welding Temperature: 230260
  • Welding Time: 1030s
  • Preheating Temperature: 170 max.
Wave Soldering Curve

(Curve data not provided in source)

Soldering Iron Rework Conditions
  • Soldering Iron Tip Temperature: 400 (max.)
  • Soldering Time: 3.5 sec (max.)
  • Soldering Iron Power: 50W (max.)

Storage Environment

  • Storage Conditions: Temperature: 10~30, Relative Humidity: 60% max.
  • Use within 6 months of delivery.
  • Solder NTC within 168 hours after opening moisture-proof packaging. Store in moisture-proof packaging with desiccant and HIC card.
  • If storage exceeds 6 months or HIC card indicator changes color, bake at 60 for 168 hours before soldering.
  • Refer to baking data for products exposed beyond shelf life or exceeding temperature/humidity requirements before reflow soldering.
  • Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent lead oxidation and reduced solderability.
  • Store on shelves to avoid moisture and dust.
  • Avoid thermal shock, vibration, and direct sunlight in storage.

Usage Precautions

  • Ensure operating ambient temperature is within technical specifications.
  • Install away from heat-generating or flammable components (minimum 3mm spacing recommended).
  • Wear gloves when handling leads.
  • This specification guarantees the quality of the product as a single unit. Ensure your product is effectively evaluated and confirmed according to your company's specifications when integrating our product.
  • Songtian is not responsible for failures arising from the use of our products beyond the scope of this test specification.
  • In case of NTC damage, failure may result in a short circuit. Implement fail-safe functions using components like fuses to prevent fire hazards.

2508261540_STE-SMDNTC2522N07002MK0_C50751526.pdf

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