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Specifications
Tolerance:
±20%
Mfr. Part #:
SMDNTC2522N14001MK0
Package:
SMD,6x5.6mm
Key Attributes
Model Number:
SMDNTC2522N14001MK0
Product Description
Product Overview
The SMD-2522 Series is a series of encapsulated surface mount NTC thermistors designed for circuit protection and temperature sensing applications. These thermistors feature advanced encapsulation technology with UL94-V0 rated materials, offering a compact and space-saving design. They provide superior high-temperature and high-humidity performance, strong surge suppression capabilities, and are supplied in tape and reel packaging for automated lead-free reflow/wave soldering processes. Ideal for use in industrial equipment, communication devices, consumer electronics, and automotive electronics.
Product Attributes
- Brand: Songtian ()
- Series: SMD-2522
- Encapsulation Material: UL94-V0 rated
- Packaging: Tape and reel
- Soldering Compatibility: Lead-free reflow/wave soldering
- Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.
Technical Specifications
| Model | R @ 25 () | Max Steady Current @ 25 (A) | Max Residual Resistance @ 25 () | B Value (K) 10% | Thermal Time Constant (S) | Dissipation Factor (mW/) | Operating Temperature Range () |
|---|---|---|---|---|---|---|---|
| SMD NTC 2522 N 2R5 04** | 2.5 | 4 | 0.113 | 2600 | <35 | >11 | -40 to 175 |
| SMD NTC 2522 N 030 04** | 3 | 4 | 0.100 | 2600 | <35 | >11 | -40 to 175 |
| SMD NTC 2522 N 040 03** | 4 | 3 | 0.150 | 2600 | <35 | >11 | -40 to 175 |
| SMD NTC 2522 N 050 03** | 5 | 3 | 0.156 | 2800 | <34 | >11 | -40 to 175 |
| SMD NTC 2522 N 060 02** | 6 | 2 | 0.240 | 2800 | <34 | >11 | -40 to 175 |
| SMD NTC 2522 N 6R8 02** | 6.8 | 2 | 0.245 | 2800 | <34 | >11 | -40 to 175 |
| SMD NTC 2522 N 070 02** | 7 | 2 | 0.2824 | 2800 | <34 | >11 | -40 to 175 |
| SMD NTC 2522 N 080 02** | 8 | 2 | 0.255 | 2800 | <32 | >11 | -40 to 175 |
| SMD NTC 2522 N 100 02** | 10 | 2 | 0.275 | 2800 | <32 | >11 | -40 to 175 |
| SMD NTC 2522 N 120 01** | 12 | 1 | 0.462 | 2800 | <32 | >11 | -40 to 175 |
| SMD NTC 2522 N 130 01** | 13 | 1 | 0.465 | 2800 | <32 | >11 | -40 to 175 |
| SMD NTC 2522 N 150 01** | 15 | 1 | 0.468 | 2800 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 160 01** | 16 | 1 | 0.470 | 2800 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 180 01** | 18 | 1 | 0.495 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 200 01** | 20 | 1 | 0.512 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 220 01** | 22 | 1 | 0.563 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 250 01** | 25 | 1 | 0.623 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 300 01** | 30 | 1 | 0.667 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 330 01** | 33 | 1 | 0.734 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 470 01** | 47 | 1 | 1.002 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 500 01** | 50 | 1 | 1.021 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 600 X8** | 60 | 0.8 | 1.215 | 3000 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 800 X8** | 80 | 0.8 | 1.656 | 3200 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 101 X8** | 100 | 0.8 | 2.053 | 3200 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 121 X8** | 120 | 0.8 | 2.253 | 3200 | <30 | >11 | -40 to 175 |
| SMD NTC 2522 N 201 X5** | 200 | 0.5 | 4.121 | 3200 | <32 | >11 | -40 to 175 |
| Product Dimensions (for 2522) | Pad Dimensions | ||
|---|---|---|---|
| Dimension | Size (mm) | Dimension | Size (mm) |
| L | 6.0 0.1 | a | 5.5 Min |
| L1 | 7.0 0.15 | b | 2.2 0.1 |
| W | 5.55 0.1 | c | 3.6 0.2 |
| L2 | 6.0 0.15 | ||
| H | 2.38 0.1 | ||
| L3 | 0.5 0.1 | ||
| W1 | 2.5 0.02 | ||
| Reliability Testing | ||||
|---|---|---|---|---|
| No. | Item | Test Method | Standard | Resistance Change Rate |
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Direction: X, Y, Z axis for 2 hours each | No visible damage | 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning, 95% coverage | N/A |
| 3 | Resistance to Soldering Heat | Immersion in 2605 solder bath for 101s | N/A | 10% |
| 4 | High Temperature Storage | 1252 for 1000+48 hours, static for 2 hours | N/A | 20% |
| 5 | Humidity Resistance | 1000 hours at 402, 90-95% RH; 500 hours at 402, 90-95% RH with 1/20 max dissipation voltage (0.5V) | N/A | 20% |
| 6 | Thermal Shock | -4030min 255min 12530min 255min, 5 cycles | N/A | 20% |
| 7 | Endurance Test | 1) 255, Imax, 1000h; 2) 255, Imax, (1min ON /5min OFF) * 1000 times | No visible damage | 20% |
| 8 | Insulation Withstand Voltage | 750Vac applied for 1 minute between windings on the surface encapsulation and terminals | No external damage | N/A |
| Taping Packaging Specifications (Unit: mm) | ||
|---|---|---|
| Dimension | N (Inner Fold) | N (Inner Fold) |
| SPEC A0 | 5.7 0.1 | |
| SPEC B0 | 7.3 0.1 | |
| SPEC K0 | 2.7 0.1 | |
| SPEC P | 12.0 0.1 | |
| SPEC P0 | 4.0 0.1 | |
| SPEC P2 | 2.0 0.1 | |
| SPEC T | 0.3 0.1 | |
| SPEC W | 16.0 0.3 | |
| SPEC E | 1.75 0.1 | |
| SPEC F | 7.5 0.1 | |
| SPEC D0 | 1.5 +0.1/-0 | |
| SPEC D1 | 1.50 +0.1/-0 | |
| Components/Reel | 3000pcs | |
| 13-inch Reel Dimensions (Unit: mm) | ||
|---|---|---|
| Dimension | Value (mm) | |
| SPEC 12 | ||
| E | 12 0.2 | |
| F | 2.6 0.2 | |
| W | 10.8 1.0 | |
| T1 | 12.5 0.2 | |
| T2 | 2.0 0.2 | |
| A | +0/-2 | |
| N | 330 3.0 | |
| 100 | ||
Soldering Instructions
Lead-free Reflow Soldering Curve
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max
Wave Soldering Curve
(No specific curve data provided in source)
Soldering Iron Rework Conditions
- Soldering Iron Tip Temperature: 400 (max.)
- Soldering Time: 3.5 sec (max.)
- Soldering Iron Power: 50W (max.)
Storage Environment
- Storage Conditions: Temperature: 10~30, Relative Humidity: 60% max.
- Use within 6 months of delivery.
- Solder NTC within 168 hours after opening the moisture-proof packaging. Store in moisture-proof packaging with desiccant and HIC card.
- If storage period exceeds 6 months or HIC card indicates color change, bake at 60 for 168 hours before soldering.
- Refer to baking data for products exposed beyond shelf life or exceeding temperature/humidity requirements before reflow soldering.
- Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent pin oxidation and reduced solderability.
- Store on shelves to avoid moisture and dust.
- Avoid thermal shock, vibration, and direct sunlight in storage.
Usage Precautions
- Operating ambient temperature must be within specified technical limits.
- Install away from heat-generating or combustible components, with a gap of >3mm.
- Wear gloves when handling terminals.
- This specification guarantees individual product quality. Ensure customer products are evaluated and confirmed according to their own specifications when integrating Songtian products.
- Songtian is not liable for failures arising from uses exceeding the tested functions defined in this specification.
- In case of NTC damage, failure may lead to short circuits. Implement fail-safe functions using components like fuses to prevent ignition, smoke, or fire.
2508261540_STE-SMDNTC2522N14001MK0_C50751581.pdf
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