Product Overview
The SMD-3225 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and general electronic applications. These NTC thermistors feature advanced encapsulation technology meeting UL94-V0 standards, offering compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape reels for automated mounting via lead-free reflow or wave soldering.
Product Attributes
- Brand: Songtian ()
- Product Type: Encapsulated Surface Mount NTC Thermistor
- Series: SMD-3225
- Encapsulation Material: Meets UL94-V0
- Packaging: SMD Tape Reel
- Mounting Type: Surface Mount
- Soldering Compatibility: Lead-free Reflow/Wave Soldering
- Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.
Technical Specifications
Key Features & Applications
- Features:
- Advanced encapsulation process, material meets UL94-V0.
- Compact structure, small size, space-saving.
- Superior high-temperature and high-humidity performance.
- Strong surge suppression capability.
- SMD tape packaging, suitable for lead-free reflow/wave soldering automatic mounting.
- Applications:
- Circuit Protection
- Industrial Equipment
- Communication Equipment
- Consumer Electronics
- Automotive Electronics
Part Number Coding Principle
SMD NTC 3225 N 2R5 05 M 0
- NTC: Negative Temperature Coefficient Thermistor
- Internal Management Code
- Model: SMD
- Size: 3225 (approx. 8.1*6.0mm)
- Lead Shape: N (Internal Fold), W (External Fold)
- Zero Power Resistance @ 25: e.g., 020: 2.0, 2R5: 2.5, 201: 200
- Max. Steady State Current: e.g., S5: 1.5A, 05: 5.0A
- Resistance Tolerance: L: 15%, M: 20%
Product Marking Example
1. Songtian Logo
2. NTC (Negative Temperature Coefficient Thermistor)
3. 3225 (Size: approx. 8.1*6.0mm)
4. 050 (Zero Power Resistance @ 25: 5.0)
5. M (Capacity Tolerance: M (20%))
Dimensions
| Dimensions (mm) | Outer Fold (W) | Inner Fold (N) | |
|---|---|---|---|
| L | 8.1 0.3 | 8.1 0.3 | 8.1 0.3 |
| L1 | 10.0 0.3 | 8.5 0.3 | 8.5 0.3 |
| W | 6.0 0.3 | 6.0 0.3 | 6.0 0.3 |
| L2 | 11.4 0.3 | 6.0 Min | 6.0 Min |
| H | 2.5 0.3 | 2.5 0.3 | 2.5 0.3 |
| L3 | 0.5 0.3 | 1.1 0.3 | 1.1 0.3 |
| W1 | 2.5 0.3 | 2.5 0.3 | 2.5 0.3 |
| T | 0.15 0.01 | 0.15 0.01 | 0.15 0.01 |
Solder Pad Dimensions (mm)
| Dimensions (mm) | Outer Fold (W) | Inner Fold (N) | |
|---|---|---|---|
| a | 10.0 0.2 | 5.7 0.2 | 5.7 0.2 |
| b | 2.2 0.2 | 1.65 0.2 | 1.65 0.2 |
| c | 3.6 0.2 | 3.0 0.2 | 3.0 0.2 |
Electrical Performance
| Model | Rated Zero Power Resistance @ 25 () | Max. Steady State Current @ 25 (A) | Residual Resistance @ Max. Steady State Current @ 25 () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/) | Operating Temperature Range () |
|---|---|---|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 0.065 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*02005** | 2 | 5 | 0.085 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*2R505** | 2.5 | 5 | 0.095 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*03005** | 3 | 5 | 0.100 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*04004** | 4 | 4 | 0.150 | 2600 | <44 | >13 | -40 to 175 |
| SMDNTC3225*05004** | 5 | 4 | 0.156 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*06003** | 6 | 3 | 0.240 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*6R803** | 6.8 | 3 | 0.245 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*07003** | 7 | 3 | 0.2824 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*08003** | 8 | 3 | 0.255 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*10003** | 10 | 3 | 0.275 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*12002** | 12 | 2 | 0.462 | 2800 | <48 | >14 | -40 to 175 |
| SMDNTC3225*13002** | 13 | 2 | 0.465 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*15002** | 15 | 2 | 0.468 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*16002** | 16 | 2 | 0.470 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*18002** | 18 | 2 | 0.495 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*20002** | 20 | 2 | 0.512 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*22002** | 22 | 2 | 0.563 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*25002** | 25 | 2 | 0.623 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*300S5** | 30 | 1.5 | 0.667 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*330S5** | 33 | 1.5 | 0.734 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*470S5** | 47 | 1.5 | 1.002 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*500S5** | 50 | 1.5 | 1.021 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*600S5** | 60 | 1.5 | 1.215 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*800S2** | 80 | 1.2 | 1.656 | 3200 | <52 | >15 | -40 to 175 |
| SMDNTC3225*101S1** | 100 | 1.1 | 2.053 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*121S1** | 120 | 1.1 | 2.253 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*20101** | 200 | 1 | 4.121 | 3200 | <50 | >13 | -40 to 175 |
Reliability Experiments
| No. | Item | Test Method | Standard | Resistance Change Rate |
|---|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Direction & Time: X, Y, Z axes for 2 hours each | No visible damage | 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning, area 95% | N/A |
| 3 | Resistance to Soldering Heat | Immersion of leads in 2605 solder bath for 101 seconds | N/A | 10% |
| 4 | High Temperature Storage | 1000+48 hours at 1252, tested after 2 hours static rest | N/A | 20% |
| 5 | Humidity Resistance | 1. 1000 hours at 402, 90-95% humidity. 2. 500 hours at 402, 90-95% humidity with 1/20 of max. dissipation voltage applied (not less than 0.5V). | N/A | 20% |
| 6 | Cold and Heat Shock | 5 cycles of -4030min 255min 12530min 255min | N/A | 20% |
| 7 | Endurance Test | 1. 255, Imax, 1000h; 2. 255, Imax, (1min ON /5min OFF) * 1000 cycles. | No visible damage | 20% |
| 8 | Insulation Voltage Withstand | Apply 750Vac for 1 minute between surface encapsulated body (wound with metal wire coil) and leads. | No external damage | N/A |
Packaging Information
| Tape Packaging Specifications (mm) | Units/Reel | |||||||
|---|---|---|---|---|---|---|---|---|
| SPEC | A0 | B0 | K0 | P | P0 | P2 | T | |
| Inner Fold (N) | 6.35 0.1 | 8.45 0.1 | 3.25 0.1 | 8.0 0.1 | 4.0 0.1 | 2.0 0.1 | 0.3 0.05 | 4000pcs |
| Outer Fold (W) | 6.16 0.1 | 11.90 0.15 | 3.10 0.1 | 8.0 0.15 | 4.0 0.15 | 2.0 0.15 | 0.3 0.05 | |
| 15-inch Reel Dimensions (mm) | |||||||||
|---|---|---|---|---|---|---|---|---|---|
| SPEC | W | E 0.5 | F 0.5 | W 0.2 | T1 0.3 | T2 0.3 | A +0/-2 | N 3.0 | D 0.3 |
| Inner Fold (N) | 16.0 0.3 | 2.3 | 10.75 | 16.4 | 2.2 | 2.2 | 380 | 100 | 13.3 |
| Outer Fold (W) | 24.0 0.3 | 2.3 | 10.75 | 24.4 | 2.2 | 2.2 | 380 | 100 | 13.3 |
Soldering Instructions
Lead-Free Reflow Soldering Curve
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max.
Wave Soldering Curve
(Curve data not provided in source)
Soldering Iron Rework Conditions
| Item | Condition |
|---|---|
| Soldering Iron Tip Temperature | 400 (max.) |
| Soldering Time | 3.5 sec (max.) |
| Soldering Iron Power | 50W (max.) |
Storage Environment
- Store under the following conditions and use within 6 months of delivery.
- Temperature: 10~30, Relative Humidity: 60% max.
- Solder NTC within 168 hours after opening the moisture-proof packaging. After opening, store NTC in the moisture-proof packaging with desiccant and HIC card, maintaining the above conditions.
- If the storage period exceeds 6 months, or the indicator color on the accompanying HIC card changes after opening the package, baking (60 * 168hr) is required before soldering.
- Reference data for baking when product humidity exceeds requirements before reflow soldering (exposed life after baking starts from zero): (Data not provided in source)
- Do not store products in corrosive substances such as sulfur, chlorine gas, or acids, as this may cause lead oxidation and reduce solderability.
- To avoid influence from moisture, dust, etc., store products on shelves.
- Avoid thermal shock, vibration, and direct sunlight when storing products in warehouses.
Usage Precautions
- The operating ambient temperature should be within the specified range of technical conditions.
- Do not install close to heat-generating or combustible components; maintain a gap of more than 3 mm if possible to prevent component damage.
- Wear gloves when handling leads.
- This specification guarantees the quality of our product as an individual component. When our product is installed in your product, please ensure your product has been effectively evaluated and confirmed according to your company's specifications.
- If your company's trial use of our product exceeds the product functions defined in this test specification, we will not be responsible for failures caused by this.
- When an NTC is damaged, the failure may result in a short circuit. To prevent dangerous situations such as overheating, smoking, or fire during a short circuit, use components like fuses in the circuit to implement a fail-safe function.
2508261540_STE-SMDNTC3225N2R505MK0_C50751507.pdf
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