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Specifications
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC3225N4R704MK0
Package:
SMD,8.1x6mm
Key Attributes
Model Number:
SMDNTC3225N4R704MK0
Product Description
Product Overview
The SMD-3225 Series Encapsulated SMD NTC Thermistors are designed for circuit protection and general electronic applications. Featuring advanced encapsulation technology with UL94-V0 rated materials, these thermistors offer a compact size, space-saving design, and excellent high-temperature and high-humidity performance. They possess strong surge suppression capabilities and are supplied in SMD tape packaging, compatible with lead-free reflow/wave soldering and automatic placement.
Product Attributes
- Brand: Songtian ()
- Series: SMD-3225
- Type: Encapsulated SMD NTC Thermistor
- Encapsulation Material: Meets UL94-V0
- Packaging: SMD Tape Reel
- Certifications/Standards: Lead-free compatible (Reflow/Wave Soldering)
- Origin: China ()
Technical Specifications
Key Features & Applications
- Features: Advanced encapsulation, compact size, excellent high-temperature/high-humidity performance, strong surge suppression, SMD tape packaging for automatic placement.
- Applications: Circuit protection, industrial equipment, communication equipment, consumer electronics, automotive electronics.
Part Numbering Principle
SMD NTC 3225 N 2R5 05 M 0
- NTC: Negative Temperature Coefficient Thermistor
- SMD: Model Type
- 3225: Size (Approx. 8.1*6.0mm)
- N/W: Lead Shape (N: Inner Fold, W: Outer Fold)
- Resistance Value @ 25C: e.g., 2R5 (2.5), 020 (2.0), 201 (200)
- Max. Steady State Current: e.g., 05 (5.0A), S5 (1.5A)
- Resistance Tolerance: e.g., M (20%), L (15%)
Product Marking Example
1. Songtian Logo, 2. NTC, 3. 3225 (Size), 4. 050 (Resistance @ 25C: 5.0), 5. M (Tolerance: 20%)
Dimensions
Outer Fold (W) Lead Shape:
| Parameter | Value (mm) |
|---|---|
| L | 8.1 0.3 |
| L1 | 10.0 0.3 |
| W | 6.0 0.3 |
| L2 | 11.4 0.3 |
| H | 2.5 0.3 |
| L3 | 0.5 0.3 |
| W1 | 2.5 0.3 |
| T | 0.15 0.01 |
Pad Dimensions (Outer Fold):
| Parameter | Value (mm) |
|---|---|
| a | 10.0 0.2 |
| b | 2.2 0.2 |
| c | 3.6 0.2 |
Inner Fold (N) Lead Shape:
| Parameter | Value (mm) |
|---|---|
| L | 8.1 0.3 |
| L1 | 8.5 0.3 |
| W | 6.0 0.3 |
| L2 | 6.0 Min |
| H | 2.5 0.3 |
| L3 | 1.1 0.3 |
| W1 | 2.5 0.3 |
Pad Dimensions (Inner Fold):
| Parameter | Value (mm) |
|---|---|
| a | 5.7 0.2 |
| b | 1.65 0.2 |
| c | 3.0 0.2 |
Electrical Performance
| Model | Resistance @ 25C () | Max. Steady State Current @ 25C (A) | Residual Resistance @ Max. Steady State Current () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/C) | Operating Temp. Range (C) |
|---|---|---|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 0.065 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*02005** | 2 | 5 | 0.085 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*2R505** | 2.5 | 5 | 0.095 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*03005** | 3 | 5 | 0.100 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*04004** | 4 | 4 | 0.150 | 2600 | <44 | >13 | -40 to 175 |
| SMDNTC3225*05004** | 5 | 4 | 0.156 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*06003** | 6 | 3 | 0.240 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*6R803** | 6.8 | 3 | 0.245 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*07003** | 7 | 3 | 0.2824 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*08003** | 8 | 3 | 0.255 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*10003** | 10 | 3 | 0.275 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*12002** | 12 | 2 | 0.462 | 2800 | <48 | >14 | -40 to 175 |
| SMDNTC3225*13002** | 13 | 2 | 0.465 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*15002** | 15 | 2 | 0.468 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*16002** | 16 | 2 | 0.470 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*18002** | 18 | 2 | 0.495 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*20002** | 20 | 2 | 0.512 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*22002** | 22 | 2 | 0.563 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*25002** | 25 | 2 | 0.623 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*300S5** | 30 | 1.5 | 0.667 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*330S5** | 33 | 1.5 | 0.734 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*470S5** | 47 | 1.5 | 1.002 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*500S5** | 50 | 1.5 | 1.021 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*600S5** | 60 | 1.5 | 1.215 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*800S2** | 80 | 1.2 | 1.656 | 3200 | <52 | >15 | -40 to 175 |
| SMDNTC3225*101S1** | 100 | 1.1 | 2.053 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*121S1** | 120 | 1.1 | 2.253 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*20101** | 200 | 1 | 4.121 | 3200 | <50 | >13 | -40 to 175 |
Reliability Testing
| No. | Item | Test Method | Standard |
|---|---|---|---|
| 1 | Vibration | Frequency: 10-55Hz, Amplitude: 0.75mm, Axis: X, Y, Z (2 hrs each) | No visible damage, Resistance change: 10% |
| 2 | Solderability | Temperature: 2455C, Time: 30.5s | Uniform tinning, Area 95% |
| 3 | Resistance to Soldering Heat | Immersion in 2605C solder for 101s | Resistance change: 10% |
| 4 | High Temp. Storage | 1252C for 1000+48 hrs, rest 2 hrs | Resistance change: 20% |
| 5 | Damp Heat | 1) 402C, 90-95% RH for 1000 hrs 2) 402C, 90-95% RH with 1/20 Max Dissipation Voltage (0.5V) for 500 hrs | Resistance change: 20% |
| 6 | Thermal Shock | -40C (30min) 25C (5min) 125C (30min) 25C (5min), 5 cycles | Resistance change: 20% |
| 7 | Durability Test | 1) 255C, Imax, 1000h 2) 255C, Imax, (1min ON /5min OFF) * 1000 times | No visible damage, Resistance change: 20% |
| 8 | Insulation Withstand Voltage | 750Vac applied for 1 min to surface with wire coil | No external damage |
Packaging Specifications
Taped Packaging Dimensions (Unit: mm)
| SPEC | Inner Fold (N) | Outer Fold (W) | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A0 | B0 | K0 | P | P0 | P2 | T | A0 | B0 | K0 | P | P0 | P2 | T | |
| Value | 6.350.1 | 8.450.1 | 3.250.1 | 8.00.1 | 4.00.1 | 2.00.1 | 0.30.05 | 6.160.1 | 11.900.15 | 3.100.1 | 8.00.15 | 4.00.15 | 2.00.15 | 0.30.05 |
Component per Reel: 4000 pcs
15-inch Reel Dimensions (Unit: mm)
| SPEC | Inner Fold (N) | Outer Fold (W) | ||
|---|---|---|---|---|
| Value | Value | |||
| E0.5 | 2.3 | 2.3 | ||
| F0.5 | 10.75 | 10.75 | ||
| W0.2 | 16.4 | 24.4 | ||
| T10.3 | 2.2 | 2.2 | ||
| T20.3 | 2.2 | 2.2 | ||
| A+0/-2 | 380 | 380 | ||
| N3.0 | 100 | 100 | ||
| D0.3 | 13.3 | 13.3 | ||
Soldering Instructions
Lead-Free Reflow Soldering Curve:
- Soldering Temperature: 230260C
- Soldering Time: 1030s
- Preheating Temperature: 170C max.
Wave Soldering Curve: (Details not provided in source)
Soldering Iron Rework Conditions:
| Item | Condition |
|---|---|
| Soldering Iron Tip Temperature | 400C (max.) |
| Soldering Time | 3.5 sec (max.) |
| Soldering Iron Power | 50W (max.) |
Storage Environment
- Storage Conditions: Temperature: 10~30C, Relative Humidity: 60% max.
- Use within 6 months of delivery.
- Solder NTC within 168 hours after opening moisture-proof packaging. Store in original packaging with desiccant and HIC card.
- If storage exceeds 6 months or HIC card color changes, bake at 60C for 168 hours before soldering.
- Avoid storage in corrosive environments (sulfur, chlorine gas, acid) to prevent pin oxidation and poor solderability.
- Store on shelves to avoid moisture and dust.
- Avoid thermal shock, vibration, and direct sunlight.
Usage Precautions
- Ensure operating ambient temperature is within specified limits.
- Install with a minimum 3mm gap from heat-generating or flammable components.
- Wear gloves when handling pins.
- This specification guarantees product quality as a standalone component. Ensure your product design is validated with the component integrated.
- Songtian is not liable for failures caused by exceeding the scope of this specification during customer product trials.
- In case of NTC failure resulting in a short circuit, implement fail-safe mechanisms such as fuses to prevent fire hazards.
2508261540_STE-SMDNTC3225N4R704MK0_C50751511.pdf
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