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quality Surface Mount Encapsulated SMD NTC Thermistor STE SMDNTC2522N08002MK0 for High Surge Suppression Needs factory
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quality Surface Mount Encapsulated SMD NTC Thermistor STE SMDNTC2522N08002MK0 for High Surge Suppression Needs factory
>
Specifications
Operating Temperature:
-40℃~+175℃
Tolerance:
±20%
Mfr. Part #:
SMDNTC2522N08002MK0
Package:
SMD,6x5.6mm
Key Attributes
Model Number: SMDNTC2522N08002MK0
Product Description

Product Overview

The SMD-2522 Series Encapsulated SMD NTC Thermistors are designed for circuit protection in a wide range of electronic applications. These thermistors feature advanced encapsulation technology with UL94-V0 rated materials, offering a compact size, small volume, and space-saving design. They excel in high-temperature and high-humidity environments and possess strong surge suppression capabilities. Packaged in SMD tape reels, they are suitable for lead-free reflow/wave soldering automatic placement. Key applications include industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

  • Brand: Songtian ()
  • Series: SMD-2522
  • Type: Encapsulated SMD NTC Thermistor
  • Encapsulation Material: UL94-V0 rated
  • Packaging: SMD Tape Reel
  • Mounting Type: Surface Mount (SMD)
  • Soldering Compatibility: Lead-free Reflow/Wave Soldering
  • Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.

Technical Specifications

Specification Details
Product Series SMD-2522
Product Dimensions (approx.) 6.0*5.5mm
Lead Shape N: Inner fold
Operating Temperature Range -40 to 175
Encapsulation Process Advanced, meets UL94-V0
Key Features Compact size, small volume, space-saving, excellent high-temperature/high-humidity performance, strong surge suppression.
Product Marking (Example) 1: Songtian Logo, 2: NTC, 3: 2522 (Size), 4: 050 (Resistance @25), 5: M (Tolerance)
Product Dimensions (mm) L: 6.00.1, L1: 7.00.15, W: 5.550.1, L2: 6.00.15, H: 2.380.1, L3: 0.50.1, W1: 2.50.02
Pad Dimensions (mm) a: 5.5 Min, b: 2.20.1, c: 3.60.2
Electrical Performance
Model Rated Zero-Power Resistance @25 () | Max. Steady Current @25 (A) | Max. Residual Resistance @25 () under Max. Steady Current | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/)
SMDNTC2522N2R504** 2.5 | 4 | 0.113 | 2600 | <35 | >11
SMDNTC2522N03004** 3 | 4 | 0.100 | 2600 | <35 | >11
SMDNTC2522N04003** 4 | 3 | 0.150 | 2600 | <35 | >11
SMDNTC2522N05003** 5 | 3 | 0.156 | 2800 | <34 | >11
SMDNTC2522N06002** 6 | 2 | 0.240 | 2800 | <34 | >11
SMDNTC2522N6R802** 6.8 | 2 | 0.245 | 2800 | <34 | >11
SMDNTC2522N07002** 7 | 2 | 0.2824 | 2800 | <34 | >11
SMDNTC2522N08002** 8 | 2 | 0.255 | 2800 | <32 | >11
SMDNTC2522N10002** 10 | 2 | 0.275 | 2800 | <32 | >11
SMDNTC2522N12001** 12 | 1 | 0.462 | 2800 | <32 | >11
SMDNTC2522N13001** 13 | 1 | 0.465 | 2800 | <32 | >11
SMDNTC2522N15001** 15 | 1 | 0.468 | 2800 | <30 | >11
SMDNTC2522N16001** 16 | 1 | 0.470 | 2800 | <30 | >11
SMDNTC2522N18001** 18 | 1 | 0.495 | 3000 | <30 | >11
SMDNTC2522N20001** 20 | 1 | 0.512 | 3000 | <30 | >11
SMDNTC2522N22001** 22 | 1 | 0.563 | 3000 | <30 | >11
SMDNTC2522N25001** 25 | 1 | 0.623 | 3000 | <30 | >11
SMDNTC2522N30001** 30 | 1 | 0.667 | 3000 | <30 | >11
SMDNTC2522N33001** 33 | 1 | 0.734 | 3000 | <30 | >11
SMDNTC2522N47001** 47 | 1 | 1.002 | 3000 | <30 | >11
SMDNTC2522N50001** 50 | 1 | 1.021 | 3000 | <30 | >11
SMDNTC2522N600X8** 60 | 0.8 | 1.215 | 3000 | <30 | >11
SMDNTC2522N800X8** 80 | 0.8 | 1.656 | 3200 | <30 | >11
SMDNTC2522N101X8** 100 | 0.8 | 2.053 | 3200 | <30 | >11
SMDNTC2522N121X8** 120 | 0.8 | 2.253 | 3200 | <30 | >11
SMDNTC2522N201X5** 200 | 0.5 | 4.121 | 3200 | <32 | >11
Reliability Tests
No. Item | Test Method | Standard | Resistance Change Rate
1 Vibration | Freq: 10~55Hz, Amplitude: 0.75mm, Duration: 2 hrs per axis (X, Y, Z) | - | 10%
2 Solderability | Temp: 2455, Time: 30.5s | - | Tinning uniform & 95% area
3 Resistance to Soldering Heat | Immerse leads in 2605 solder for 101s | - | 10%
4 High Temperature Storage | 1000+48 hrs at 1252, then 2 hrs rest | - | 20%
5 Damp Heat | 1000 hrs at 402, 90-95% RH; or 500 hrs with 1/20 max dissipation voltage (0.5V) | - | 20%
6 Thermal Shock | -40(30min)25(5min)125(30min)25(5min), 5 cycles | - | 20%
7 Endurance Test | 1) 255, Imax, 1000h; 2) 255, Imax, (1min ON /5min OFF)*1000 cycles | - | 20%
8 Insulation Withstand Voltage | 750Vac applied for 1 min between coil and leads | - | No visible damage
Packaging Information
Tape Packaging Dimensions (mm) SPEC A0: 5.70.1, B0: 7.30.1, K0: 2.70.1, P: 12.00.1, P0: 4.00.1, P2: 2.00.1, T: 0.30.1
Carrier Tape Dimensions (mm) SPEC W: 16.00.3, E: 1.750.1, F: 7.50.1, D0: 1.5+0.1/-0, D1: 1.50+0.1/-0
Pieces per Reel 3000 pcs
13-inch Reel Dimensions (mm) SPEC 12: E: 2.6, F: 10.8, W: 12.5, T1: 2.0, T2: 2.0, A: 0 to -2, 330, N: 3.0, 100
Soldering Instructions
Lead-free Reflow Soldering Curve Welding Temperature: 230260; Welding Time: 1030s; Preheating Temperature: 170 max.
Wave Soldering Curve (Details not provided in source)
Soldering Iron Rework Conditions Tip Temperature: 400 (max.); Welding Time: 3.5 sec (max.); Iron Power: 50W (max.)
Storage Environment
Recommended Storage Conditions Temperature: 10~30, Relative Humidity: 60% max. Use within 6 months of delivery.
Post-Opening Storage Weld NTC within 168 hours after opening moisture-proof packaging. Store in moisture-proof packaging with desiccant and HIC card.
Baking Recommendation If storage exceeds 6 months or HIC card indicator changes color, bake at 60 for 168 hours before soldering.
Prohibited Storage Conditions Do not store in corrosive substances (sulfur, chlorine gas, acid) to prevent pin oxidation and reduced solderability. Avoid heat shock, vibration, and direct sunlight. Store on shelves to avoid moisture and dust.
Usage Precautions
Operating Environment Work environment temperature must be within specified technical range.
Component Proximity Install with a minimum 3mm spacing from heat-generating or combustible components.
Handling Wear gloves when handling leads.
Product Evaluation Customer must ensure their product is effectively evaluated and confirmed when integrating Songtian's product. Songtian is not responsible for failures arising from use beyond the defined test specifications.
Fail-safe Design In case of NTC damage which may lead to short circuits, implement fail-safe measures like fuses to prevent fire or smoke hazards.

2508261540_STE-SMDNTC2522N08002MK0_C50751577.pdf
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