Product Overview
The Songtian SMD-3225 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and temperature sensing applications. Featuring advanced encapsulation technology with UL94-V0 rated materials, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape packaging, compatible with lead-free reflow and wave soldering processes, making them suitable for industrial equipment, communication devices, consumer electronics, and automotive electronics.
Product Attributes
- Brand: Songtian ()
- Series: SMD-3225
- Type: Encapsulated Surface Mount NTC Thermistor
- Encapsulation Material: Meets UL94-V0
- Packaging: SMD Tape Reel
- Soldering Compatibility: Lead-free Reflow/Wave Soldering
- Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.
Technical Specifications
Part Numbering Principle
SMD NTC 3225 N/W 2R5 05 M/L
- NTC: Negative Temperature Coefficient Thermistor
- SMD: Model
- 3225: Size (approx. 8.1*6.0mm)
- N/W: Lead Shape (N: Internal Fold, W: External Fold)
- Resistance Value @ 25 (Zero Power): e.g., 020 (2.0), 2R5 (2.5), 201 (200)
- Maximum Steady State Current: e.g., S5 (1.5A), 05 (5.0A)
- Resistance Tolerance: L (15%), M (20%)
Product Dimensions (mm)
External Fold (W):
| Dimension | Value |
|---|---|
| L | 8.1 0.3 |
| L1 | 10.0 0.3 |
| W | 6.0 0.3 |
| L2 | 11.4 0.3 |
| H | 2.5 0.3 |
| L3 | 0.5 0.3 |
| W1 | 2.5 0.3 |
| T | 0.15 0.01 |
Pad Dimensions (mm) (External Fold):
| Dimension | Value |
|---|---|
| a | 10.0 0.2 |
| b | 2.2 0.2 |
| c | 3.6 0.2 |
Internal Fold (N):
| Dimension | Value |
|---|---|
| L | 8.1 0.3 |
| L1 | 8.5 0.3 |
| W | 6.0 0.3 |
| L2 | 6.0 Min |
| H | 2.5 0.3 |
| L3 | 1.1 0.3 |
| W1 | 2.5 0.3 |
Pad Dimensions (mm) (Internal Fold):
| Dimension | Value |
|---|---|
| a | 5.7 0.2 |
| b | 1.65 0.2 |
| c | 3.0 0.2 |
Electrical Performance
| Model | Rated Zero Power Resistance @ 25 () | Max. Steady State Current @ 25 (A) | Residual Resistance @ Max. Steady State Current @ 25 () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/) | Operating Temperature Range () |
|---|---|---|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 0.065 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*02005** | 2 | 5 | 0.085 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*2R505** | 2.5 | 5 | 0.095 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*03005** | 3 | 5 | 0.100 | 2600 | <43 | >13 | -40 to 175 |
| SMDNTC3225*04004** | 4 | 4 | 0.150 | 2600 | <44 | >13 | -40 to 175 |
| SMDNTC3225*05004** | 5 | 4 | 0.156 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*06003** | 6 | 3 | 0.240 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*6R803** | 6.8 | 3 | 0.245 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*07003** | 7 | 3 | 0.2824 | 2800 | <45 | >13 | -40 to 175 |
| SMDNTC3225*08003** | 8 | 3 | 0.255 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*10003** | 10 | 3 | 0.275 | 2800 | <47 | >14 | -40 to 175 |
| SMDNTC3225*12002** | 12 | 2 | 0.462 | 2800 | <48 | >14 | -40 to 175 |
| SMDNTC3225*13002** | 13 | 2 | 0.465 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*15002** | 15 | 2 | 0.468 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*16002** | 16 | 2 | 0.470 | 2800 | <50 | >14 | -40 to 175 |
| SMDNTC3225*18002** | 18 | 2 | 0.495 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*20002** | 20 | 2 | 0.512 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*22002** | 22 | 2 | 0.563 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*25002** | 25 | 2 | 0.623 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*300S5** | 30 | 1.5 | 0.667 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*330S5** | 33 | 1.5 | 0.734 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*470S5** | 47 | 1.5 | 1.002 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*500S5** | 50 | 1.5 | 1.021 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*600S5** | 60 | 1.5 | 1.215 | 3000 | <52 | >15 | -40 to 175 |
| SMDNTC3225*800S2** | 80 | 1.2 | 1.656 | 3200 | <52 | >15 | -40 to 175 |
| SMDNTC3225*101S1** | 100 | 1.1 | 2.053 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*121S1** | 120 | 1.1 | 2.253 | 3200 | <50 | >15 | -40 to 175 |
| SMDNTC3225*20101** | 200 | 1 | 4.121 | 3200 | <50 | >13 | -40 to 175 |
Reliability Experiments
| No. | Item | Test Method | Standard |
|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Axis: X, Y, Z for 2 hours each | No visible damage, Resistance change rate: 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning, Area 95% |
| 3 | Resistance to Soldering Heat | Immerse leads in 2605 solder liquid for 101 sec | Resistance change rate: 10% |
| 4 | High Temperature Storage | Store at 1252 for 1000+48 hours, test after 2 hours static | Resistance change rate: 20% |
| 5 | Humidity Resistance | 1) 1000 hours at 402, 90-95% RH. 2) 500 hours at 402, 90-95% RH with 1/20 max dissipation voltage (not less than 0.5V) | Resistance change rate: 20% |
| 6 | Thermal Shock | -4030min 255min 12530min 255min, 5 cycles | Resistance change rate: 20% |
| 7 | Endurance Test | 1) 255, Imax, 1000h; 2) 255, Imax, (1min ON /5min OFF)*1000 times | No visible damage, Resistance change rate: 20% |
| 8 | Insulation Dielectric Strength | Apply 750Vac for 1 minute between coil formed on surface and leads | No external damage |
Packaging Information
Tape Packaging (Unit: mm)
| SPEC | Internal Fold (N) | External Fold (W) | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A0 | B0 | K0 | P | P0 | P2 | T | A0 | B0 | K0 | P | P0 | P2 | T | |
| Dimensions | 6.350.1 | 8.450.1 | 3.250.1 | 8.00.1 | 4.00.1 | 2.00.1 | 0.30.05 | 6.160.1 | 11.900.15 | 3.100.1 | 8.00.15 | 4.00.15 | 2.00.15 | 0.30.05 |
Component/Reel: 4000pcs
15-inch Reel Dimensions (Unit: mm)
| SPEC | Internal Fold (N) | External Fold (W) | ||
|---|---|---|---|---|
| Dimensions | Hole Diameter | Dimensions | Hole Diameter | |
| Dimensions | 16.4 | 100 | 24.4 | 100 |
| E0.5 | 2.3 | - | 2.3 | - |
| F0.5 | 10.75 | - | 10.75 | - |
| W0.2 | 16.4 | - | 24.4 | - |
| T10.3 | 2.2 | - | 2.2 | - |
| T20.3 | 2.2 | - | 2.2 | - |
| A+0/-2 | 380 | - | 380 | - |
| N3.0 | 100 | - | 100 | - |
| D0.3 | 13.3 | - | 13.3 | - |
Soldering Instructions
Lead-Free Reflow Soldering Curve:
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max
Wave Soldering Curve: [Details not provided in source text]
Soldering Iron Rework Conditions:
| Condition | Value |
|---|---|
| Soldering Iron Tip Temperature | 400 (max.) |
| Soldering Time | 3.5 sec (max.) |
| Soldering Iron Power | 50W (max.) |
Storage Environment
- Recommended Storage Conditions: Temperature: 10~30, Relative Humidity: 60% max.
- Use within 6 months of delivery.
- Solder NTC within 168 hours after opening moisture-proof packaging.
- Store opened products in moisture-proof packaging with desiccant and HIC card.
- If storage exceeds 6 months or HIC card indicator changes color, bake at 60 for 168 hours before soldering.
- Avoid storage in corrosive substances (sulfur, chlorine gas, acid) to prevent lead oxidation.
- Store products on shelves to prevent moisture and dust contamination.
- Avoid thermal shock, vibration, and direct sunlight in storage.
Usage Precautions
- Ensure operating ambient temperature is within specified technical limits.
- Maintain a distance of >3mm from heat-generating or combustible components.
- Wear gloves when handling leads.
- This specification guarantees product quality as a single unit. Ensure your product is evaluated and confirmed according to your specifications when integrating our product.
- Songtian is not liable for failures arising from the use of our products beyond the scope defined in this specification.
- In case of NTC failure leading to a short circuit, implement fail-safe mechanisms such as fuses to prevent fire hazards.
2508261540_STE-SMDNTC3225N16002MK0_C50751516.pdf
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