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quality temperature sensing thermistor STE SMDNTC3225N16002MK0 compatible with lead free soldering processes factory
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quality temperature sensing thermistor STE SMDNTC3225N16002MK0 compatible with lead free soldering processes factory
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Specifications
Resistance @ 25℃:
16Ω
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC3225N16002MK0
Package:
SMD,8.1x6mm
Key Attributes
Model Number: SMDNTC3225N16002MK0
Product Description

Product Overview

The Songtian SMD-3225 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and temperature sensing applications. Featuring advanced encapsulation technology with UL94-V0 rated materials, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape packaging, compatible with lead-free reflow and wave soldering processes, making them suitable for industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

  • Brand: Songtian ()
  • Series: SMD-3225
  • Type: Encapsulated Surface Mount NTC Thermistor
  • Encapsulation Material: Meets UL94-V0
  • Packaging: SMD Tape Reel
  • Soldering Compatibility: Lead-free Reflow/Wave Soldering
  • Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.

Technical Specifications

Part Numbering Principle

SMD NTC 3225 N/W 2R5 05 M/L

  • NTC: Negative Temperature Coefficient Thermistor
  • SMD: Model
  • 3225: Size (approx. 8.1*6.0mm)
  • N/W: Lead Shape (N: Internal Fold, W: External Fold)
  • Resistance Value @ 25 (Zero Power): e.g., 020 (2.0), 2R5 (2.5), 201 (200)
  • Maximum Steady State Current: e.g., S5 (1.5A), 05 (5.0A)
  • Resistance Tolerance: L (15%), M (20%)

Product Dimensions (mm)

External Fold (W):

Dimension Value
L 8.1 0.3
L1 10.0 0.3
W 6.0 0.3
L2 11.4 0.3
H 2.5 0.3
L3 0.5 0.3
W1 2.5 0.3
T 0.15 0.01

Pad Dimensions (mm) (External Fold):

Dimension Value
a 10.0 0.2
b 2.2 0.2
c 3.6 0.2

Internal Fold (N):

Dimension Value
L 8.1 0.3
L1 8.5 0.3
W 6.0 0.3
L2 6.0 Min
H 2.5 0.3
L3 1.1 0.3
W1 2.5 0.3

Pad Dimensions (mm) (Internal Fold):

Dimension Value
a 5.7 0.2
b 1.65 0.2
c 3.0 0.2

Electrical Performance

Model Rated Zero Power Resistance @ 25 () Max. Steady State Current @ 25 (A) Residual Resistance @ Max. Steady State Current @ 25 () B Value (K) 10% Thermal Time Constant (S) Thermal Dissipation Coefficient (mW/) Operating Temperature Range ()
SMDNTC3225*1R505** 1.5 5 0.065 2600 <43 >13 -40 to 175
SMDNTC3225*02005** 2 5 0.085 2600 <43 >13 -40 to 175
SMDNTC3225*2R505** 2.5 5 0.095 2600 <43 >13 -40 to 175
SMDNTC3225*03005** 3 5 0.100 2600 <43 >13 -40 to 175
SMDNTC3225*04004** 4 4 0.150 2600 <44 >13 -40 to 175
SMDNTC3225*05004** 5 4 0.156 2800 <45 >13 -40 to 175
SMDNTC3225*06003** 6 3 0.240 2800 <45 >13 -40 to 175
SMDNTC3225*6R803** 6.8 3 0.245 2800 <45 >13 -40 to 175
SMDNTC3225*07003** 7 3 0.2824 2800 <45 >13 -40 to 175
SMDNTC3225*08003** 8 3 0.255 2800 <47 >14 -40 to 175
SMDNTC3225*10003** 10 3 0.275 2800 <47 >14 -40 to 175
SMDNTC3225*12002** 12 2 0.462 2800 <48 >14 -40 to 175
SMDNTC3225*13002** 13 2 0.465 2800 <50 >14 -40 to 175
SMDNTC3225*15002** 15 2 0.468 2800 <50 >14 -40 to 175
SMDNTC3225*16002** 16 2 0.470 2800 <50 >14 -40 to 175
SMDNTC3225*18002** 18 2 0.495 3000 <52 >15 -40 to 175
SMDNTC3225*20002** 20 2 0.512 3000 <52 >15 -40 to 175
SMDNTC3225*22002** 22 2 0.563 3000 <52 >15 -40 to 175
SMDNTC3225*25002** 25 2 0.623 3000 <52 >15 -40 to 175
SMDNTC3225*300S5** 30 1.5 0.667 3000 <52 >15 -40 to 175
SMDNTC3225*330S5** 33 1.5 0.734 3000 <52 >15 -40 to 175
SMDNTC3225*470S5** 47 1.5 1.002 3000 <52 >15 -40 to 175
SMDNTC3225*500S5** 50 1.5 1.021 3000 <52 >15 -40 to 175
SMDNTC3225*600S5** 60 1.5 1.215 3000 <52 >15 -40 to 175
SMDNTC3225*800S2** 80 1.2 1.656 3200 <52 >15 -40 to 175
SMDNTC3225*101S1** 100 1.1 2.053 3200 <50 >15 -40 to 175
SMDNTC3225*121S1** 120 1.1 2.253 3200 <50 >15 -40 to 175
SMDNTC3225*20101** 200 1 4.121 3200 <50 >13 -40 to 175

Reliability Experiments

No. Item Test Method Standard
1 Vibration Frequency: 10~55Hz, Amplitude: 0.75mm, Axis: X, Y, Z for 2 hours each No visible damage, Resistance change rate: 10%
2 Solderability Temperature: 2455, Time: 30.5s Uniform tinning, Area 95%
3 Resistance to Soldering Heat Immerse leads in 2605 solder liquid for 101 sec Resistance change rate: 10%
4 High Temperature Storage Store at 1252 for 1000+48 hours, test after 2 hours static Resistance change rate: 20%
5 Humidity Resistance 1) 1000 hours at 402, 90-95% RH. 2) 500 hours at 402, 90-95% RH with 1/20 max dissipation voltage (not less than 0.5V) Resistance change rate: 20%
6 Thermal Shock -4030min 255min 12530min 255min, 5 cycles Resistance change rate: 20%
7 Endurance Test 1) 255, Imax, 1000h; 2) 255, Imax, (1min ON /5min OFF)*1000 times No visible damage, Resistance change rate: 20%
8 Insulation Dielectric Strength Apply 750Vac for 1 minute between coil formed on surface and leads No external damage

Packaging Information

Tape Packaging (Unit: mm)

SPEC Internal Fold (N) External Fold (W)
A0B0K0PP0P2T A0B0K0PP0P2T
Dimensions 6.350.18.450.13.250.18.00.14.00.12.00.10.30.05 6.160.111.900.153.100.18.00.154.00.152.00.150.30.05

Component/Reel: 4000pcs

15-inch Reel Dimensions (Unit: mm)

SPEC Internal Fold (N) External Fold (W)
DimensionsHole Diameter DimensionsHole Diameter
Dimensions 16.4100 24.4100
E0.5 2.3- 2.3-
F0.5 10.75- 10.75-
W0.2 16.4- 24.4-
T10.3 2.2- 2.2-
T20.3 2.2- 2.2-
A+0/-2 380- 380-
N3.0 100- 100-
D0.3 13.3- 13.3-

Soldering Instructions

Lead-Free Reflow Soldering Curve:

  • Soldering Temperature: 230260
  • Soldering Time: 1030s
  • Preheating Temperature: 170 max

Wave Soldering Curve: [Details not provided in source text]

Soldering Iron Rework Conditions:

Condition Value
Soldering Iron Tip Temperature 400 (max.)
Soldering Time 3.5 sec (max.)
Soldering Iron Power 50W (max.)

Storage Environment

  • Recommended Storage Conditions: Temperature: 10~30, Relative Humidity: 60% max.
  • Use within 6 months of delivery.
  • Solder NTC within 168 hours after opening moisture-proof packaging.
  • Store opened products in moisture-proof packaging with desiccant and HIC card.
  • If storage exceeds 6 months or HIC card indicator changes color, bake at 60 for 168 hours before soldering.
  • Avoid storage in corrosive substances (sulfur, chlorine gas, acid) to prevent lead oxidation.
  • Store products on shelves to prevent moisture and dust contamination.
  • Avoid thermal shock, vibration, and direct sunlight in storage.

Usage Precautions

  • Ensure operating ambient temperature is within specified technical limits.
  • Maintain a distance of >3mm from heat-generating or combustible components.
  • Wear gloves when handling leads.
  • This specification guarantees product quality as a single unit. Ensure your product is evaluated and confirmed according to your specifications when integrating our product.
  • Songtian is not liable for failures arising from the use of our products beyond the scope defined in this specification.
  • In case of NTC failure leading to a short circuit, implement fail-safe mechanisms such as fuses to prevent fire hazards.

2508261540_STE-SMDNTC3225N16002MK0_C50751516.pdf

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