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Specifications
Operating Temperature:
-40℃~+175℃
Tolerance:
±20%
Mfr. Part #:
SMDNTC2522N04003MK0
Package:
SMD,6x5.6mm
Key Attributes
Model Number:
SMDNTC2522N04003MK0
Product Description
Product Overview
The SMD-2522 Series Sealed SMD NTC Thermistors are designed for circuit protection and various electronic applications. They feature advanced encapsulation technology with UL94-V0 rated materials, offering a compact size, small volume, and space-saving design. These thermistors provide excellent high-temperature and high-humidity performance, with strong surge suppression capabilities. They are supplied in SMD tape reels, suitable for lead-free reflow and wave soldering automatic mounting.
Product Attributes
- Brand: Songtian ()
- Product Series: SMD-2522
- Type: NTC Thermistor (Negative Temperature Coefficient)
- Encapsulation Material: Meets UL94-V0
- Packaging: SMD Tape Reel
- Soldering Compatibility: Lead-free Reflow/Wave Soldering
- Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.
Technical Specifications
Part Number Coding Principle:
SMD NTC 2522 N [Resistance Value] [Max Steady Current] [Tolerance]
- SMD: Model
- 2522: Size (approx. 6.0*5.5mm)
- N: Lead Shape (Internal Fold)
- Resistance Value @ 25 (Zero Power): e.g., 020 (2.0), 050 (5.0), 201 (200)
- Max Steady Current @ 25: e.g., X5 (0.5A), 01 (1.0A), 04 (4.0A)
- Resistance Tolerance: L (15%), M (20%)
Product Dimensions (for 2522):
| Dimension | Value (mm) |
|---|---|
| L | 6.0 0.1 |
| L1 | 7.0 0.15 |
| W | 5.55 0.1 |
| L2 | 6.0 0.15 |
| H | 2.38 0.1 |
| L3 | 0.5 0.1 |
| W1 | 2.5 0.02 |
Pad Dimensions:
| Dimension | Value (mm) |
|---|---|
| a | 5.5 Min |
| b | 2.2 0.1 |
| c | 3.6 0.2 |
Electrical Characteristics:
| Model | Rated Zero Power Resistance @ 25 () | Max Steady Current @ 25 (A) | Max Steady Current Residual Resistance @ 25 () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/) | Operating Temperature Range () |
|---|---|---|---|---|---|---|---|
| SMDNTC2522N2R504** | 2.5 | 4 | 0.113 | 2600 | <35 | >11 | -40175 |
| SMDNTC2522N03004** | 3 | 4 | 0.100 | 2600 | <35 | >11 | -40175 |
| SMDNTC2522N04003** | 4 | 3 | 0.150 | 2600 | <35 | >11 | -40175 |
| SMDNTC2522N05003** | 5 | 3 | 0.156 | 2800 | <34 | >11 | -40175 |
| SMDNTC2522N06002** | 6 | 2 | 0.240 | 2800 | <34 | >11 | -40175 |
| SMDNTC2522N6R802** | 6.8 | 2 | 0.245 | 2800 | <34 | >11 | -40175 |
| SMDNTC2522N07002** | 7 | 2 | 0.2824 | 2800 | <34 | >11 | -40175 |
| SMDNTC2522N08002** | 8 | 2 | 0.255 | 2800 | <32 | >11 | -40175 |
| SMDNTC2522N10002** | 10 | 2 | 0.275 | 2800 | <32 | >11 | -40175 |
| SMDNTC2522N12001** | 12 | 1 | 0.462 | 2800 | <32 | >11 | -40175 |
| SMDNTC2522N13001** | 13 | 1 | 0.465 | 2800 | <32 | >11 | -40175 |
| SMDNTC2522N15001** | 15 | 1 | 0.468 | 2800 | <30 | >11 | -40175 |
| SMDNTC2522N16001** | 16 | 1 | 0.470 | 2800 | <30 | >11 | -40175 |
| SMDNTC2522N18001** | 18 | 1 | 0.495 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N20001** | 20 | 1 | 0.512 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N22001** | 22 | 1 | 0.563 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N25001** | 25 | 1 | 0.623 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N30001** | 30 | 1 | 0.667 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N33001** | 33 | 1 | 0.734 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N47001** | 47 | 1 | 1.002 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N50001** | 50 | 1 | 1.021 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N600X8** | 60 | 0.8 | 1.215 | 3000 | <30 | >11 | -40175 |
| SMDNTC2522N800X8** | 80 | 0.8 | 1.656 | 3200 | <30 | >11 | -40175 |
| SMDNTC2522N101X8** | 100 | 0.8 | 2.053 | 3200 | <30 | >11 | -40175 |
| SMDNTC2522N121X8** | 120 | 0.8 | 2.253 | 3200 | <30 | >11 | -40175 |
| SMDNTC2522N201X5** | 200 | 0.5 | 4.121 | 3200 | <32 | >11 | -40175 |
Product Marking (Example):
- Songtian Logo
- NTC (Negative Temperature Coefficient Thermistor)
- 2522 (Size: approx. 6.0*5.5mm)
- 050 (Resistance @ 25: 5.0)
- M (Tolerance: 20%)
Usage:
- Circuit Protection
- Industrial Equipment
- Communication Equipment
- Consumer Electronics
- Automotive Electronics
Features:
- Advanced encapsulation process, encapsulation material meets UL94-V0.
- Compact structure, small size, space-saving.
- Superior high-temperature and high-humidity performance.
- Strong surge suppression capability.
- SMD tape packaging, suitable for lead-free reflow/wave soldering automatic mounting.
Reliability Test:
| No. | Item | Test Method | Standard |
|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Direction and Time: X, Y, and Z axes for 2 hours each | No visible damage, Resistance change rate: 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning and area 95% |
| 3 | Resistance to Soldering Heat | Immerse product leads in 2605 solder liquid for 101 seconds, then remove | Resistance change rate: 10% |
| 4 | High-Temperature Storage | Stored at 1252 for 1000+48 hours, tested after 2 hours of rest | Resistance change rate: 20% |
| 5 | Moisture Resistance | 1. Placed in 402, 90-95% humidity environment for 1000 hours. 2. Placed in 402, 90-95% humidity environment with 1/20 of max. dissipation voltage applied (not less than 0.5V) for 500 hours. | Resistance change rate: 20% |
| 6 | Cold-Heat Shock | -4030min 255min 12530min 255min, 5 cycles in total | Resistance change rate: 20% |
| 7 | Endurance Test | 1. 255, Imax, 1000h; 2. 255, Imax, (1min ON /5min OFF) * 1000 cycles. | No visible damage, Resistance change rate: 20% |
| 8 | Dielectric Withstanding Voltage | Apply 750Vac voltage for 1 minute to the surface encapsulation of the product, wound with a tight coil of metal wire, between the coil terminals and the leads. | No external damage |
Packaging Information:
Tape Packaging Method (Unit: mm):
| SPEC | A0 | B0 | K0 | P | P0 | P2 | T | N (Internal Fold) |
|---|---|---|---|---|---|---|---|---|
| Value | 5.70.1 | 7.30.1 | 2.70.1 | 12.00.1 | 4.00.1 | 2.00.1 | 0.30.1 | - |
| SPEC | W | E | F | D0 | D1 | N (Internal Fold) |
|---|---|---|---|---|---|---|
| Value | 16.00.3 | 1.750.1 | 7.50.1 | 1.5+0.1/-0 | 1.50+0.1/-0 | 3000pcs/Reel |
13-inch Reel Dimensions (Unit: mm):
| SPEC | 12 | E0.2 | 2.6 | F0.2 | 10.8 | W1.0 | 12.5 | T10.2 | 2.0 | T20.2 | 2.0 | A+0/-2 | 330 | N3.0 | 100 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Value | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
Carton Packaging:
Lead Shape N: Internal Fold
Curves:
Resistance-Temperature Characteristic Curve
Maximum Current Derating Curve
ITa = [1-(Ta-25)/(Tu-25)]Imax
TU: Upper Limit of Working Temperature ()
TL: Lower Limit of Working Temperature ()
Ta: Ambient Temperature ()
Imax: Maximum Steady Current
Soldering Instructions:
Lead-Free Reflow Soldering Curve
When reflow soldering capacitors, it should be performed under the following conditions:
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max
Wave Soldering Curve
Soldering Iron Rework Conditions:
| Item | Conditions |
|---|---|
| Soldering Iron Tip Temperature | 400 (max.) |
| Soldering Time | 3.5 sec (max.) |
| Soldering Iron Power | 50W (max.) |
Storage Environment:
- Store products under the following conditions and use them within 6 months after delivery.
- Temperature: 10~30, Relative Humidity: 60% max.
- Solder NTC within 168 hours after opening the moisture-proof packaging. After opening the moisture-proof packaging, store the NTC in the moisture-proof packaging with desiccant and HIC card, and maintain the above state.
- If the storage period exceeds 6 months, or the indicator color of the attached HIC card changes after the package is opened, baking (60 * 168hr) should be performed before soldering.
- Reference data for baking when product moisture exceeds requirements before reflow soldering, after product exposure time exceeds bare-life or other conditions cause temperature and humidity around the product to exceed requirements (bare-life starts from zero after baking).
- Do not store products in corrosive substances such as sulfur, chlorine gas, or acid, as this will cause pin oxidation and reduce solderability.
- To avoid the influence of moisture, dust, and other substances, products should be stored on shelves.
- Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.
Usage Precautions:
- The working environment temperature should be within the range specified by the technical conditions.
- Do not install near heat-generating or flammable components; maintain a clearance of more than 3 mm to avoid damaging the components.
- Please wear gloves when touching the pins.
- This specification guarantees the quality of our products as individual units. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
- If your company's trial use of our products exceeds the product functions defined by this test specification, we will not be responsible for any failures caused thereby.
- When an NTC is damaged, the failure may lead to a short circuit. To prevent dangerous situations such as overheating, smoking, or fire during a short circuit, please set up an automatic fail-safe function using components such as fuses in the circuit.
2508261540_STE-SMDNTC2522N04003MK0_C50751520.pdf
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