Product Overview

The SMD-2522 Series is a range of epoxy-encapsulated Surface Mount Device (SMD) NTC thermistors designed for circuit protection and temperature sensing applications. Featuring advanced encapsulation with UL94-V0 compliant materials, these thermistors offer a compact size, small volume, and excellent high-temperature and high-humidity performance. They are built with strong surge suppression capabilities and are supplied in tape and reel packaging for automated placement via lead-free reflow or wave soldering. Key applications include industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

• Brand: Songtian ()
• Series: SMD-2522
• Encapsulation Material: Meets UL94-V0 standards
• Packaging: Tape and reel for automated placement
• Soldering Compatibility: Lead-free reflow/wave soldering
• Foot Shape: Inner fold (N)

Technical Specifications

Part Number Coding Principle:

SMD NTC 2522 N [Resistance Value] [Max Steady Current] [Tolerance]

• NTC: Negative Temperature Coefficient Thermistor
• Model: SMD
• Size: 2522 (approx. 6.0*5.5mm)
• Foot Shape: N (Inner fold)
• 25 Zero-Power Resistance: e.g., 020 (2.0), 050 (5.0), 201 (200)
• Max Steady Current: e.g., X5 (0.5A), 01 (1.0A), 02 (2.0A), 03 (3.0A), 04 (4.0A)
• Resistance Tolerance: L (15%), M (20%)

Product Dimensions (for 2522):

Pad Dimensions (mm):

Electrical Performance:

Reliability Tests:

Packaging Information:

Tape Packaging Dimensions (Unit: mm):

13-inch Reel Dimensions (Unit: mm):

Packaging Carton:

Foot shape N: Inner fold

Curves:

• Resistance-Temperature Characteristic Curve
• Maximum Current Derating Curve
  ITa = [1-(Ta-25)/(Tu-25)]Imax
  TU: Upper limit of operating temperature ()
  TL: Lower limit of operating temperature ()
  Ta: Ambient temperature ()
  Imax: Maximum steady current

Soldering Instructions:

• Lead-Free Reflow Soldering Curve
  Soldering temperature: 230260; Soldering time: 1030s; Preheating temperature: 170 max.
• Wave Soldering Curve
• Soldering Iron Rework Conditions
  Soldering iron tip temperature: 400 (max.)
  Soldering time: 3.5 sec (max.)
  Soldering iron power: 50W (max.)

Storage Environment:

• Store products under the following conditions and use within 6 months of delivery.
• Temperature: 10~30, Relative Humidity: 60% max.
• Solder NTC within 168 hours after opening the moisture-proof packaging. After opening, store NTC in the moisture-proof packaging with desiccant and HIC card, maintaining the above conditions.
• If the storage period exceeds 6 months, or the indicator color of the accompanying HIC card changes after opening the package, baking (60 * 168hr) is required before soldering.
• Reference data for baking before reflow soldering when product humidity exceeds requirements after exposure beyond the allowable exposure time or when ambient temperature/humidity exceeds requirements: (Exposure time after baking starts from zero).
• Do not store products in corrosive substances such as sulfur, chlorine gas, or acids, as this may cause lead oxidation and reduce solderability.
• To avoid the influence of moisture, dust, etc., products should be stored on shelves.
• Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.

Usage Precautions:

• The working environment temperature should be within the range specified by the technical conditions.
• Do not install near heat-generating or flammable components; maintain a gap of greater than 3 mm to avoid damaging the component.
• Wear gloves when handling the leads.
• This specification guarantees the quality of our products as individual units. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
• If your company's trial use of our products exceeds the product functions defined by this test specification, we will not be responsible for any resulting failures.
• When an NTC is damaged, the failure may result in a short circuit. To prevent dangerous situations such as burnout, smoke, or fire during a short circuit, please incorporate fail-safe functions using components like fuses in the circuit.