Product Overview

The Songtian SMD-2522 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and various electronic applications. These thermistors feature advanced encapsulation technology with UL94-V0 compliant materials, offering a compact and space-saving design. They provide excellent high-temperature and high-humidity performance, along with robust surge suppression capabilities. The SMD tape and reel packaging is suitable for lead-free reflow and wave soldering automatic mounting processes. Applications include industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

• Brand: Songtian ()
• Series: SMD-2522
• Type: Encapsulated SMD NTC Thermistor
• Encapsulation Material: UL94-V0 compliant
• Packaging: Tape and Reel (SMD)
• Mounting Type: Surface Mount
• Soldering Compatibility: Lead-free reflow/wave soldering
• Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.

Technical Specifications

General Specifications

Specification	Value
Dimensions (approx.)	6.0*5.5mm (2522)
Operating Temperature Range	-40 to 175
Lead Shape	N: Inner Fold

Electrical Characteristics

Model	Resistance @ 25 ()	Max. Steady Current @ 25 (A)	Max. Residual Resistance @ 25 ()	B Value (K) 10%	Thermal Time Constant (S)	Thermal Dissipation Coefficient (mW/)
SMDNTC2522N2R504**	2.5	4	0.113	2600	<35	>11
SMDNTC2522N03004**	3	4	0.100	2600	<35	>11
SMDNTC2522N04003**	4	3	0.150	2600	<35	>11
SMDNTC2522N05003**	5	3	0.156	2800	<34	>11
SMDNTC2522N06002**	6	2	0.240	2800	<34	>11
SMDNTC2522N6R802**	6.8	2	0.245	2800	<34	>11
SMDNTC2522N07002**	7	2	0.2824	2800	<34	>11
SMDNTC2522N08002**	8	2	0.255	2800	<32	>11
SMDNTC2522N10002**	10	2	0.275	2800	<32	>11
SMDNTC2522N12001**	12	1	0.462	2800	<32	>11
SMDNTC2522N13001**	13	1	0.465	2800	<32	>11
SMDNTC2522N15001**	15	1	0.468	2800	<30	>11
SMDNTC2522N16001**	16	1	0.470	2800	<30	>11
SMDNTC2522N18001**	18	1	0.495	3000	<30	>11
SMDNTC2522N20001**	20	1	0.512	3000	<30	>11
SMDNTC2522N22001**	22	1	0.563	3000	<30	>11
SMDNTC2522N25001**	25	1	0.623	3000	<30	>11
SMDNTC2522N30001**	30	1	0.667	3000	<30	>11
SMDNTC2522N33001**	33	1	0.734	3000	<30	>11
SMDNTC2522N47001**	47	1	1.002	3000	<30	>11
SMDNTC2522N50001**	50	1	1.021	3000	<30	>11
SMDNTC2522N600X8**	60	0.8	1.215	3000	<30	>11
SMDNTC2522N800X8**	80	0.8	1.656	3200	<30	>11
SMDNTC2522N101X8**	100	0.8	2.053	3200	<30	>11
SMDNTC2522N121X8**	120	0.8	2.253	3200	<30	>11
SMDNTC2522N201X5**	200	0.5	4.121	3200	<32	>11

Dimensions (mm)

Dimension	Value
L	6.00.1
L1	7.00.15
W	5.550.1
L2	6.00.15
H	2.380.1
L3	0.50.1
W1	2.50.02

Land Pattern Dimensions (mm)

Dimension	Value
a	5.5 Min
b	2.20.1
c	3.60.2

Product Marking (Example)

Marking	Description
1	Songtian Logo
2	NTC (Negative Temperature Coefficient Thermistor)
3	2522 (Size: approx. 6.0*5.5mm)
4	050 (Zero-power resistance at 25: 5.0)
5	M (Resistance tolerance: 20%)

Reliability Experiments

No.	Item	Test Method	Standard
1	Vibration	Frequency: 10~55Hz, Amplitude: 0.75mm, Direction & Time: X, Y, Z axes each 2 hours	No visible damage, Resistance change rate: 10%
2	Solderability	Temperature: 2455, Time: 30.5s	Uniform tinning, area 95%
3	Resistance to Soldering Heat	Immerse product leads in 2605 solder liquid for 101 seconds, then remove	Resistance change rate: 10%
4	High Temperature Storage	Stored at 1252 for 1000+48 hours, tested after 2 hours of rest	Resistance change rate: 20%
5	Humidity Resistance	1. Placed in 402, 90-95% humidity environment for 1000 hours. 2. Placed in 402, 90-95% humidity environment with 1/20 of max. dissipation voltage applied (not less than 0.5V) for 500 hours.	Resistance change rate: 20%
6	Thermal Shock	-4030min 255min 12530min 255min, 5 cycles total	Resistance change rate: 20%
7	Endurance Test	1. 255, Imax, 1000h; 2. 255, Imax, (1min ON /5min OFF) * 1000 times.	No visible damage, Resistance change rate: 20%
8	Insulation Withstand Voltage	Apply 750Vac for 1 minute to the encapsulated surface of the product, wound with metal wire in a tight coil, between the coil leads and the product leads.	No external damage

Packaging Information

Tape Packaging (Unit: mm)

SPEC	A0	B0	K0	P	P0	P2	T	N (Inner Fold)
Value	5.70.1	7.30.1	2.70.1	12.00.1	4.00.1	2.00.1	0.30.1	0.30.1

SPEC	W	E	F	D0	D1	Pieces/Reel
Value	16.00.3	1.750.1	7.50.1	1.5+0.1/-0	1.50+0.1/-0	3000pcs

13-inch Reel Dimensions (Unit: mm)

SPEC	12	E0.2	2.6	F0.2	10.8	W1.0	12.5	T10.2	2.0	T20.2	2.0	A+0/-2	330	N3.0	100
Value

Carton Packaging

Lead Shape N: Inner Fold

Curves

Resistance-Temperature Characteristic Curve

Maximum Current Derating Curve

ITa = [1-(Ta-25)/(Tu-25)]Imax

TU: Upper limit of operating temperature ()

TL: Lower limit of operating temperature ()

Ta: Ambient temperature ()

Imax: Maximum steady current

Soldering Instructions

Lead-Free Reflow Soldering Curve

When reflow soldering capacitors, it should be performed under the following conditions:

• Soldering Temperature: 230260
• Soldering Time: 1030s
• Preheating Temperature: 170 max

Wave Soldering Curve

Soldering Iron Rework Conditions

Item	Conditions
Soldering Iron Tip Temperature	400 (max.)
Soldering Time	3.5 sec (max.)
Soldering Iron Power	50W (max.)

Storage Environment

• Store products under the following conditions and use within 6 months after delivery.
• Temperature: 10~30, Relative Humidity: 60% max.
• Solder NTC within 168 hours after opening the moisture-proof packaging. After opening the moisture-proof packaging, store the NTC in the moisture-proof packaging with desiccant and HIC card, and maintain the above state.
• If the storage period exceeds 6 months, or the indicator color of the attached HIC card changes after opening the package, baking should be performed before soldering (60 * 168hr).
• Reference data for baking when product humidity exceeds requirements before reflow soldering, after the exposed time of the product in the opened package exceeds the exposure lifetime, or when temperature and humidity around the product exceed requirements due to other circumstances (exposure lifetime starts from zero after baking).
• Do not store products in corrosive substances such as sulfur, chlorine gas, or acid, as this will cause pin oxidation and reduce solderability.
• To avoid the influence of moisture, dust, and other substances, products should be stored on shelves.
• Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.

Usage Precautions

• The working environment temperature should be within the range specified by the technical conditions.
• Do not install near heat-generating or flammable components; maintain a clearance of more than 3 mm to avoid damaging the components.
• Please wear gloves when touching the pins.
• This specification guarantees the quality of our products as individual components. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
• If your company's trial use of our products exceeds the product functions defined by this test specification, we will not be responsible for any failures caused.
• When an NTC is damaged, the failure may lead to a short circuit. To prevent dangerous situations such as ignition, smoking, or fire during a short circuit, please set up an automatic fail-safe function using components such as fuses in the circuit.

2508261540_STE-SMDNTC2522N16001MK0_C50751583.pdf