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Specifications
Sensing Range:
1cm~30cm
Operating Temperature:
-40℃~+85℃
Voltage - Supply:
3V~3.5V
Type:
I2C
Mfr. Part #:
GP2AP03VT00F
Package:
SMD-12P
Key Attributes
Model Number:
GP2AP03VT00F
Product Description
Product Overview
The GP2AP03VT00F is a time-of-flight sensor featuring a built-in SPAD (single photon avalanche diode) and an IR emitter. It is designed for various applications including computers, OA equipment, telecommunication equipment, measuring equipment, tooling machines, audio-visual equipment, and home appliances. The device is Class 1 laser safety compliant under foreseeable conditions and adheres to EU RoHS Directive and Chinese regulations.
Product Attributes
- Brand: Sharp
- Origin: China
- Material: Specific brominated flame retardants such as PBB and PBDE are not used. Does not contain ODS materials (CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane).
- Certifications: EU RoHS Directive (2011/65/EU), Commission Delegated Directive (EU)2015/863, Chinese Electronic Information Products Pollution Control Management Methods.
Technical Specifications
| Item | Specification | Details |
|---|---|---|
| Model Number | GP2AP03VT00F | Time of flight sensor |
| Core Technology | SPAD (single photon avalanche diode) | Built-in |
| Laser Safety | Class 1 | Compliant with IEC 60825-1:2014 under recommended settings and operating conditions. Warning: Use of controls, adjustments, or procedures other than specified may result in hazardous radiation exposure. |
| Product Mass | Approx. 0.028g | |
| Moisture Absorption Level | MSL.3 | |
| Environmental Compliance | EU RoHS Directive (2011/65/EU), EU RoHS Directive (EU)2015/863, Chinese RoHS | Content of six substances (Pb, Hg, Cd, Cr6+, PBB, PBDE) is below limit requirements. |
| Warranty Period | 1 year after shipment | Sharp will repair, replace, or refund for product problems during this period. Post-warranty issues will be discussed based on analysis and shared responsibility. Damages arising from malfunction/failure caused by storage, handling, connected equipment, modification, installation, natural disasters, external factors, special environments, unforeseen phenomena, or factors not in the datasheet are excepted. |
| Receiver Surface Notes | Prone to malfunction if dirty with garbage/dust. Do not touch the surface. | |
| ESD Sensitivity | High | IC is fabricated by sub-micron CMOS process. Grounding of human body, soldering iron, etc., is recommended during handling. |
| Laser Output Degradation | Consideration needed for long continuous operation. | Circuit design should allow for degradation. |
| Ambient Light Disturbance | Avoid direct ambient light on the detector. | Structural arrangement to reduce light on the receiving surface is recommended. Avoid proximity to other components that may reflect light. |
| Mechanical Impact | Avoid deformation from external force or impact after mounting/soldering. | May result in defective implementation such as terminal lift-off. |
| VCSEL Driving Current Noise Reduction | Arrange CX1 within 5mm from VDDV terminal. Keep wiring between VDDV, CX1, and GND terminals close. Separate VDDV wiring from VDD and VDDIO. Separate VDDV power source from VDD. | Recommended external circuit components: CX1 (4.7F), CX2 (100nF). |
| Power Supply Noise Reduction | Arrange CX2 within 5mm from VDD terminal. | |
| Pin Characteristics | SDA, GPIO: NMOS open-drain output, digital input. EN, SCL: Digital input. INT: NMOS open-drain output. | Pull-up resistors for SDA, SCL, INT, and EN need adjustment based on communication speed, board capacitance, and power supply voltage. Recommended values: RSDA*1 (1~10k), RSCL*1 (1~10k), RINT (47k), REN (47k). |
2510141432_SHARP-GP2AP03VT00F_C691375.pdf
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