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quality Surface mount thermistor STE SMDNTC2522N12001MK0 featuring UL94 V0 encapsulation for enhanced durability factory
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quality Surface mount thermistor STE SMDNTC2522N12001MK0 featuring UL94 V0 encapsulation for enhanced durability factory
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Specifications
Resistance @ 25℃:
12Ω
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC2522N12001MK0
Package:
SMD,6x5.6mm
Key Attributes
Model Number: SMDNTC2522N12001MK0
Product Description

Product Overview

The SMD-2522 Series is a line of encapsulated surface-mount thermistors designed for circuit protection and general electronic applications. These NTC thermistors feature advanced encapsulation for excellent high-temperature and high-humidity performance, along with strong surge suppression capabilities. Their compact size and SMD packaging make them ideal for automated assembly processes using lead-free reflow and wave soldering. Applications include industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

  • Brand: Songtian ()
  • Series: SMD-2522
  • Type: Encapsulated Surface Mount NTC Thermistor
  • Encapsulation Material: Meets UL94-V0
  • Packaging: Tape and reel for automatic placement
  • Lead-Free Compatibility: Suitable for lead-free reflow/wave soldering
  • Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.

Technical Specifications

Part Numbering Principle: SMD NTC 2522 N [Resistance Value] [Max Steady Current] [Tolerance]

  • NTC: Negative Temperature Coefficient Thermistor
  • Model: SMD
  • Size: 2522 (approx. 6.0*5.5mm)
  • Lead Shape: N (Internal Fold)
  • 25 Zero-Power Resistance Value: e.g., 020 (2.0), 050 (5.0), 201 (200)
  • Max Steady Current: e.g., X5 (0.5A), 01 (1.0A), 04 (4.0A)
  • Resistance Tolerance: L (15%), M (20%)

Product Dimensions (SMD-2522 Series)

Parameter Dimensions (mm)
Product Length (L) 6.0 0.1
Product Length 1 (L1) 7.0 0.15
Product Width (W) 5.55 0.1
Product Length 2 (L2) 6.0 0.15
Product Height (H) 2.38 0.1
Product Length 3 (L3) 0.5 0.1
Product Width 1 (W1) 2.5 0.02

Pad Dimensions (SMD-2522 Series)

Parameter Dimensions (mm)
Pad 'a' 5.5 Min
Pad 'b' 2.2 0.1
Pad 'c' 3.6 0.2

Electrical Characteristics

Model Rated Zero-Power Resistance @25 () Max Steady Current @25 (A) Max Steady Current Residual Resistance @25 () B Value (K) 10% Thermal Time Constant (S) Dissipation Factor (mW/) Operating Temperature Range ()
SMDNTC2522N2R504** 2.5 4 0.113 2600 <35 >11 -40175
SMDNTC2522N03004** 3 4 0.100 2600 <35 >11 -40175
SMDNTC2522N04003** 4 3 0.150 2600 <35 >11 -40175
SMDNTC2522N05003** 5 3 0.156 2800 <34 >11 -40175
SMDNTC2522N06002** 6 2 0.240 2800 <34 >11 -40175
SMDNTC2522N6R802** 6.8 2 0.245 2800 <34 >11 -40175
SMDNTC2522N07002** 7 2 0.2824 2800 <34 >11 -40175
SMDNTC2522N08002** 8 2 0.255 2800 <32 >11 -40175
SMDNTC2522N10002** 10 2 0.275 2800 <32 >11 -40175
SMDNTC2522N12001** 12 1 0.462 2800 <32 >11 -40175
SMDNTC2522N13001** 13 1 0.465 2800 <32 >11 -40175
SMDNTC2522N15001** 15 1 0.468 2800 <30 >11 -40175
SMDNTC2522N16001** 16 1 0.470 2800 <30 >11 -40175
SMDNTC2522N18001** 18 1 0.495 3000 <30 >11 -40175
SMDNTC2522N20001** 20 1 0.512 3000 <30 >11 -40175
SMDNTC2522N22001** 22 1 0.563 3000 <30 >11 -40175
SMDNTC2522N25001** 25 1 0.623 3000 <30 >11 -40175
SMDNTC2522N30001** 30 1 0.667 3000 <30 >11 -40175
SMDNTC2522N33001** 33 1 0.734 3000 <30 >11 -40175
SMDNTC2522N47001** 47 1 1.002 3000 <30 >11 -40175
SMDNTC2522N50001** 50 1 1.021 3000 <30 >11 -40175
SMDNTC2522N600X8** 60 0.8 1.215 3000 <30 >11 -40175
SMDNTC2522N800X8** 80 0.8 1.656 3200 <30 >11 -40175
SMDNTC2522N101X8** 100 0.8 2.053 3200 <30 >11 -40175
SMDNTC2522N121X8** 120 0.8 2.253 3200 <30 >11 -40175
SMDNTC2522N201X5** 200 0.5 4.121 3200 <32 >11 -40175

Reliability Experiments

No. Item Test Method Standard
1 Vibration Frequency: 10~55Hz, Amplitude: 0.75mm, Direction & Time: X, Y, Z axes each 2 hours No visible damage, Resistance change rate: 10%
2 Solderability Temperature: 2455, Time: 30.5s Uniform tinning and area 95%
3 Resistance to Soldering Heat Immerse product leads in 2605 solder liquid for 101 seconds, then remove Resistance change rate: 10%
4 High Temperature Storage Stored at 1252 for 1000+48 hours, tested after 2 hours of rest Resistance change rate: 20%
5 Moisture Resistance 1. Stored in 402, 90-95% humidity environment for 1000 hours. 2. Stored in 402, 90-95% humidity environment with 1/20 of max dissipation voltage applied (not less than 0.5V) for 500 hours. Resistance change rate: 20%
6 Thermal Shock -4030min 255min 12530min 255min, 5 cycles Resistance change rate: 20%
7 Endurance Test 1. 255, Imax, 1000h; 2. 255, Imax, (1min ON /5min OFF) * 1000 times. No visible damage, Resistance change rate: 20%
8 Insulation Dielectric Strength Apply 750Vac voltage for 1 minute between the metal wire coil wrapped around the encapsulated surface and the leads. No external damage

Packaging Specifications

Tape Packaging (Unit: mm)

SPEC A0 B0 K0 P P0 P2 T N (Internal Fold)
Dimensions 5.70.1 7.30.1 2.70.1 12.00.1 4.00.1 2.00.1 0.30.1
SPEC W E F D0 D1 N (Internal Fold) Pieces/Reel
Dimensions 16.00.3 1.750.1 7.50.1 1.5+0.1/-0 1.50+0.1/-0 0.30.1 3000pcs

13-inch Reel Dimensions (Unit: mm)

SPEC 12 E 2.6 F 10.8 W 12.5 T1 2.0 T2 2.0 A +0/-2 330 N 3.0 100
Dimensions 0.2 0.2 1.0 0.2 0.2

Packaging Carton

Footprint N: Internal Fold

Curves

  • Resistance-Temperature Characteristic Curve
  • Maximum Current Derating Curve

ITa = [1-(Ta-25)/(Tu-25)]Imax

Where: TU = Upper limit of working temperature (), TL = Lower limit of working temperature (), Ta = Ambient temperature (), Imax = Maximum steady current (A)

Soldering Instructions

Lead-Free Reflow Soldering Curve

Conditions for reflow soldering:

  • Soldering Temperature: 230260
  • Soldering Time: 1030s
  • Preheating Temperature: 170 max.

Wave Soldering Curve

Soldering Iron Rework Conditions

Item Condition
Soldering Iron Tip Temperature 400 (max.)
Soldering Time 3.5 sec (max.)
Soldering Iron Power 50W (max.)

Storage Environment

  • Store products under the following conditions and use within 6 months of delivery.
  • Temperature: 10~30, Relative Humidity: 60% max.
  • Solder NTC within 168 hours after opening the moisture-proof packaging. After opening, store NTC in the moisture-proof packaging with desiccant and HIC card, maintaining the above conditions.
  • If the storage period exceeds 6 months, or the indicator color of the accompanying HIC card changes after opening the package, baking (60 * 168hr) is required before soldering.
  • Reference data for baking when product humidity exceeds requirements before reflow soldering, after exposure time exceeds shelf life, or when ambient temperature/humidity exceed requirements (shelf life restarts after baking).
  • Do not store products in corrosive substances such as sulfur, chlorine gas, or acids, as this may cause lead oxidation and reduce solderability.
  • To avoid contamination from moisture, dust, etc., products should be stored on shelves.
  • Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.

Usage Precautions

  • The operating ambient temperature should be within the specified technical range.
  • Do not install near heat-generating or combustible components; maintain a gap of more than 3 mm to prevent damage.
  • Wear gloves when handling leads.
  • This specification guarantees the quality of our product as a standalone component. When our product is installed in your product, please ensure your product has been effectively evaluated and confirmed according to your specifications.
  • If your trial use of our product exceeds the product functions defined in this test specification, we will not be responsible for any resulting failures.
  • When an NTC is damaged, the failure may lead to a short circuit. To prevent hazardous situations such as ignition, smoking, or fire during a short circuit, incorporate fail-safe functions using components like fuses in the circuit.

2508261540_STE-SMDNTC2522N12001MK0_C50751579.pdf

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