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quality Temperature Sensing Encapsulated SMD NTC Thermistor STE SMDNTC3225N04004MK0 with Lead Free Soldering factory
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quality Temperature Sensing Encapsulated SMD NTC Thermistor STE SMDNTC3225N04004MK0 with Lead Free Soldering factory
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Specifications
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC3225N04004MK0
Package:
SMD,8.1x6mm
Key Attributes
Model Number: SMDNTC3225N04004MK0
Product Description

Product Overview

The Songtian Encapsulated SMD NTC Thermistor, SMD-3225 Series, is designed for robust circuit protection and temperature sensing applications. Featuring advanced encapsulation technology with UL94-V0 compliant materials, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape reels for automated lead-free reflow/wave soldering processes, making them ideal for industrial equipment, communication devices, consumer electronics, and automotive electronics.

Product Attributes

  • Brand: Songtian ()
  • Series: SMD-3225
  • Type: Encapsulated SMD NTC Thermistor
  • Encapsulation Material: Meets UL94-V0 standard
  • Packaging: SMD Tape Reel
  • Soldering Compatibility: Lead-free reflow/wave soldering
  • Lead Shape Options: Internal Fold (N), External Fold (W)

Technical Specifications

General Specifications

Specification Value
Model Series SMD-3225
Dimensions (approx.) 8.1 x 6.0 mm
Operating Temperature Range -40C to 175C

Electrical Performance Table

Part Number Example Resistance @ 25C () Max Steady Current @ 25C (A) Residual Resistance @ Max Steady Current () B Value (K) 10% Thermal Time Constant (S) Thermal Dissipation Coefficient (mW/C)
SMDNTC3225*1R505** 1.5 5 0.065 2600 <43 >13
SMDNTC3225*02005** 2 5 0.085 2600 <43 >13
SMDNTC3225*2R505** 2.5 5 0.095 2600 <43 >13
SMDNTC3225*03005** 3 5 0.100 2600 <43 >13
SMDNTC3225*04004** 4 4 0.150 2600 <44 >13
SMDNTC3225*05004** 5 4 0.156 2800 <45 >13
SMDNTC3225*06003** 6 3 0.240 2800 <45 >13
SMDNTC3225*6R803** 6.8 3 0.245 2800 <45 >13
SMDNTC3225*07003** 7 3 0.2824 2800 <45 >13
SMDNTC3225*08003** 8 3 0.255 2800 <47 >14
SMDNTC3225*10003** 10 3 0.275 2800 <47 >14
SMDNTC3225*12002** 12 2 0.462 2800 <48 >14
SMDNTC3225*13002** 13 2 0.465 2800 <50 >14
SMDNTC3225*15002** 15 2 0.468 2800 <50 >14
SMDNTC3225*16002** 16 2 0.470 2800 <50 >14
SMDNTC3225*18002** 18 2 0.495 3000 <52 >15
SMDNTC3225*20002** 20 2 0.512 3000 <52 >15
SMDNTC3225*22002** 22 2 0.563 3000 <52 >15
SMDNTC3225*25002** 25 2 0.623 3000 <52 >15
SMDNTC3225*300S5** 30 1.5 0.667 3000 <52 >15
SMDNTC3225*330S5** 33 1.5 0.734 3000 <52 >15
SMDNTC3225*470S5** 47 1.5 1.002 3000 <52 >15
SMDNTC3225*500S5** 50 1.5 1.021 3000 <52 >15
SMDNTC3225*600S5** 60 1.5 1.215 3000 <52 >15
SMDNTC3225*800S2** 80 1.2 1.656 3200 <52 >15
SMDNTC3225*101S1** 100 1.1 2.053 3200 <50 >15
SMDNTC3225*121S1** 120 1.1 2.253 3200 <50 >15
SMDNTC3225*20101** 200 1 4.121 3200 <50 >13

Dimensions

External Fold (W)

Parameter Dimension (mm)
L 8.1 0.3
L1 10.0 0.3
W 6.0 0.3
L2 11.4 0.3
H 2.5 0.3
L3 0.5 0.3
W1 2.5 0.3
T 0.15 0.01

Pad Dimensions (External Fold)

Parameter Dimension (mm)
a 10.0 0.2
b 2.2 0.2
c 3.6 0.2

Internal Fold (N)

Parameter Dimension (mm)
L 8.1 0.3
L1 8.5 0.3
W 6.0 0.3
L2 6.0 Min
H 2.5 0.3
L3 1.1 0.3
W1 2.5 0.3

Pad Dimensions (Internal Fold)

Parameter Dimension (mm)
a 5.7 0.2
b 1.65 0.2
c 3.0 0.2

Reliability Testing

No. Item Test Method Standard
1 Vibration Frequency: 10~55Hz, Amplitude: 0.75mm, Axis: X, Y, Z (2 hours each) No visible damage, Resistance change rate: 10%
2 Solderability Temperature: 2455, Time: 30.5s Uniform tinning, Area 95%
3 Resistance to Soldering Heat Immerse lead in 2605 solder for 101 sec Resistance change rate: 10%
4 High Temperature Storage 1252 for 1000+48 hours, rest 2 hours Resistance change rate: 20%
5 Humidity Resistance 1) 402, 90-95% RH for 1000 hours
2) 402, 90-95% RH with 1/20 max dissipation voltage (min 0.5V) for 500 hours
Resistance change rate: 20%
6 Thermal Shock -4030min 255min 12530min 255min (5 cycles) Resistance change rate: 20%
7 Endurance Test 1) 255, Imax, 1000h;
2) 255, Imax, (1min ON /5min OFF) * 1000 times
No visible damage, Resistance change rate: 20%
8 Insulation Withstand Voltage Apply 750Vac for 1 minute between coil and leads No external damage

Packaging Specifications

Tape Dimensions (mm)

Spec A0 B0 K0 P P0 P2 T N(Internal) / W(External)
Internal Fold (N) 6.350.1 8.450.1 3.250.1 8.00.1 4.00.1 2.00.1 0.30.05 N/A
External Fold (W) 6.160.1 11.900.15 3.100.1 8.00.15 4.00.15 2.00.15 0.30.05 N/A

Component Count per Reel

Spec W E F D0 D1 Components/Reel
Internal Fold (N) 16.00.3 1.750.1 7.50.1 1.5+0.1/-0 1.5+0.1/-0 4000pcs
External Fold (W) 24.00.3 1.750.15 11.50.15 1.5+0.15/-0 1.5+0.15/-0 4000pcs

15-inch Reel Dimensions (mm)

Spec N (Internal) W (External) E0.5 F0.5 W0.2 T10.3 T20.3 A+0/-2 N3.0 D0.3
380 380 2.3 10.75 16.4 2.2 2.2 100 13.3 N/A
N/A N/A 2.3 10.75 24.4 2.2 2.2 N/A N/A N/A

Soldering Instructions

Lead-Free Reflow Soldering Curve

  • Soldering Temperature: 230260
  • Soldering Time: 1030s
  • Preheating Temperature: 170 max.

Wave Soldering Curve

(Curve data not provided in source text)

Soldering Iron Rework Conditions

Condition Value
Soldering Iron Tip Temperature (max.) 400
Soldering Time (max.) 3.5 sec
Soldering Iron Power (max.) 50W

Storage Environment

  • Storage Conditions: Temperature: 10~30, Relative Humidity: 60% max.
  • Use within 6 months after delivery.
  • Solder NTC within 168 hours after opening moisture-proof packaging.
  • If storage period exceeds 6 months or HIC card indicator changes color, bake at 60 for 168 hours before soldering.
  • Avoid storage in corrosive environments (sulfur, chlorine gas, acid).
  • Store on shelves to avoid moisture and dust.
  • Avoid thermal shock, vibration, and direct sunlight.

Usage Precautions

  • Ensure operating ambient temperature is within specified limits.
  • Maintain a minimum 3mm separation from heat-generating or flammable components.
  • Wear gloves when handling leads.
  • This specification guarantees product quality as a standalone component. Ensure final product evaluation and confirmation when integrated into customer's product.
  • Songtian is not liable for failures resulting from usage exceeding the test specifications defined herein.
  • In case of NTC failure (short circuit), implement fail-safe mechanisms like fuses to prevent fire hazards.

2508261540_STE-SMDNTC3225N04004MK0_C50751509.pdf

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