Product Overview
The Songtian Encapsulated SMD NTC Thermistor, SMD-3225 Series, is designed for robust circuit protection and temperature sensing applications. Featuring advanced encapsulation technology with UL94-V0 compliant materials, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape reels for automated lead-free reflow/wave soldering processes, making them ideal for industrial equipment, communication devices, consumer electronics, and automotive electronics.
Product Attributes
- Brand: Songtian ()
- Series: SMD-3225
- Type: Encapsulated SMD NTC Thermistor
- Encapsulation Material: Meets UL94-V0 standard
- Packaging: SMD Tape Reel
- Soldering Compatibility: Lead-free reflow/wave soldering
- Lead Shape Options: Internal Fold (N), External Fold (W)
Technical Specifications
General Specifications
| Specification | Value |
|---|---|
| Model Series | SMD-3225 |
| Dimensions (approx.) | 8.1 x 6.0 mm |
| Operating Temperature Range | -40C to 175C |
Electrical Performance Table
| Part Number Example | Resistance @ 25C () | Max Steady Current @ 25C (A) | Residual Resistance @ Max Steady Current () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/C) |
|---|---|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 0.065 | 2600 | <43 | >13 |
| SMDNTC3225*02005** | 2 | 5 | 0.085 | 2600 | <43 | >13 |
| SMDNTC3225*2R505** | 2.5 | 5 | 0.095 | 2600 | <43 | >13 |
| SMDNTC3225*03005** | 3 | 5 | 0.100 | 2600 | <43 | >13 |
| SMDNTC3225*04004** | 4 | 4 | 0.150 | 2600 | <44 | >13 |
| SMDNTC3225*05004** | 5 | 4 | 0.156 | 2800 | <45 | >13 |
| SMDNTC3225*06003** | 6 | 3 | 0.240 | 2800 | <45 | >13 |
| SMDNTC3225*6R803** | 6.8 | 3 | 0.245 | 2800 | <45 | >13 |
| SMDNTC3225*07003** | 7 | 3 | 0.2824 | 2800 | <45 | >13 |
| SMDNTC3225*08003** | 8 | 3 | 0.255 | 2800 | <47 | >14 |
| SMDNTC3225*10003** | 10 | 3 | 0.275 | 2800 | <47 | >14 |
| SMDNTC3225*12002** | 12 | 2 | 0.462 | 2800 | <48 | >14 |
| SMDNTC3225*13002** | 13 | 2 | 0.465 | 2800 | <50 | >14 |
| SMDNTC3225*15002** | 15 | 2 | 0.468 | 2800 | <50 | >14 |
| SMDNTC3225*16002** | 16 | 2 | 0.470 | 2800 | <50 | >14 |
| SMDNTC3225*18002** | 18 | 2 | 0.495 | 3000 | <52 | >15 |
| SMDNTC3225*20002** | 20 | 2 | 0.512 | 3000 | <52 | >15 |
| SMDNTC3225*22002** | 22 | 2 | 0.563 | 3000 | <52 | >15 |
| SMDNTC3225*25002** | 25 | 2 | 0.623 | 3000 | <52 | >15 |
| SMDNTC3225*300S5** | 30 | 1.5 | 0.667 | 3000 | <52 | >15 |
| SMDNTC3225*330S5** | 33 | 1.5 | 0.734 | 3000 | <52 | >15 |
| SMDNTC3225*470S5** | 47 | 1.5 | 1.002 | 3000 | <52 | >15 |
| SMDNTC3225*500S5** | 50 | 1.5 | 1.021 | 3000 | <52 | >15 |
| SMDNTC3225*600S5** | 60 | 1.5 | 1.215 | 3000 | <52 | >15 |
| SMDNTC3225*800S2** | 80 | 1.2 | 1.656 | 3200 | <52 | >15 |
| SMDNTC3225*101S1** | 100 | 1.1 | 2.053 | 3200 | <50 | >15 |
| SMDNTC3225*121S1** | 120 | 1.1 | 2.253 | 3200 | <50 | >15 |
| SMDNTC3225*20101** | 200 | 1 | 4.121 | 3200 | <50 | >13 |
Dimensions
External Fold (W)
| Parameter | Dimension (mm) |
|---|---|
| L | 8.1 0.3 |
| L1 | 10.0 0.3 |
| W | 6.0 0.3 |
| L2 | 11.4 0.3 |
| H | 2.5 0.3 |
| L3 | 0.5 0.3 |
| W1 | 2.5 0.3 |
| T | 0.15 0.01 |
Pad Dimensions (External Fold)
| Parameter | Dimension (mm) |
|---|---|
| a | 10.0 0.2 |
| b | 2.2 0.2 |
| c | 3.6 0.2 |
Internal Fold (N)
| Parameter | Dimension (mm) |
|---|---|
| L | 8.1 0.3 |
| L1 | 8.5 0.3 |
| W | 6.0 0.3 |
| L2 | 6.0 Min |
| H | 2.5 0.3 |
| L3 | 1.1 0.3 |
| W1 | 2.5 0.3 |
Pad Dimensions (Internal Fold)
| Parameter | Dimension (mm) |
|---|---|
| a | 5.7 0.2 |
| b | 1.65 0.2 |
| c | 3.0 0.2 |
Reliability Testing
| No. | Item | Test Method | Standard |
|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Axis: X, Y, Z (2 hours each) | No visible damage, Resistance change rate: 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning, Area 95% |
| 3 | Resistance to Soldering Heat | Immerse lead in 2605 solder for 101 sec | Resistance change rate: 10% |
| 4 | High Temperature Storage | 1252 for 1000+48 hours, rest 2 hours | Resistance change rate: 20% |
| 5 | Humidity Resistance | 1) 402, 90-95% RH for 1000 hours 2) 402, 90-95% RH with 1/20 max dissipation voltage (min 0.5V) for 500 hours | Resistance change rate: 20% |
| 6 | Thermal Shock | -4030min 255min 12530min 255min (5 cycles) | Resistance change rate: 20% |
| 7 | Endurance Test | 1) 255, Imax, 1000h; 2) 255, Imax, (1min ON /5min OFF) * 1000 times | No visible damage, Resistance change rate: 20% |
| 8 | Insulation Withstand Voltage | Apply 750Vac for 1 minute between coil and leads | No external damage |
Packaging Specifications
Tape Dimensions (mm)
| Spec | A0 | B0 | K0 | P | P0 | P2 | T | N(Internal) / W(External) |
|---|---|---|---|---|---|---|---|---|
| Internal Fold (N) | 6.350.1 | 8.450.1 | 3.250.1 | 8.00.1 | 4.00.1 | 2.00.1 | 0.30.05 | N/A |
| External Fold (W) | 6.160.1 | 11.900.15 | 3.100.1 | 8.00.15 | 4.00.15 | 2.00.15 | 0.30.05 | N/A |
Component Count per Reel
| Spec | W | E | F | D0 | D1 | Components/Reel |
|---|---|---|---|---|---|---|
| Internal Fold (N) | 16.00.3 | 1.750.1 | 7.50.1 | 1.5+0.1/-0 | 1.5+0.1/-0 | 4000pcs |
| External Fold (W) | 24.00.3 | 1.750.15 | 11.50.15 | 1.5+0.15/-0 | 1.5+0.15/-0 | 4000pcs |
15-inch Reel Dimensions (mm)
| Spec | N (Internal) | W (External) | E0.5 | F0.5 | W0.2 | T10.3 | T20.3 | A+0/-2 | N3.0 | D0.3 |
|---|---|---|---|---|---|---|---|---|---|---|
| 380 | 380 | 2.3 | 10.75 | 16.4 | 2.2 | 2.2 | 100 | 13.3 | N/A | |
| N/A | N/A | 2.3 | 10.75 | 24.4 | 2.2 | 2.2 | N/A | N/A | N/A |
Soldering Instructions
Lead-Free Reflow Soldering Curve
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max.
Wave Soldering Curve
(Curve data not provided in source text)
Soldering Iron Rework Conditions
| Condition | Value |
|---|---|
| Soldering Iron Tip Temperature (max.) | 400 |
| Soldering Time (max.) | 3.5 sec |
| Soldering Iron Power (max.) | 50W |
Storage Environment
- Storage Conditions: Temperature: 10~30, Relative Humidity: 60% max.
- Use within 6 months after delivery.
- Solder NTC within 168 hours after opening moisture-proof packaging.
- If storage period exceeds 6 months or HIC card indicator changes color, bake at 60 for 168 hours before soldering.
- Avoid storage in corrosive environments (sulfur, chlorine gas, acid).
- Store on shelves to avoid moisture and dust.
- Avoid thermal shock, vibration, and direct sunlight.
Usage Precautions
- Ensure operating ambient temperature is within specified limits.
- Maintain a minimum 3mm separation from heat-generating or flammable components.
- Wear gloves when handling leads.
- This specification guarantees product quality as a standalone component. Ensure final product evaluation and confirmation when integrated into customer's product.
- Songtian is not liable for failures resulting from usage exceeding the test specifications defined herein.
- In case of NTC failure (short circuit), implement fail-safe mechanisms like fuses to prevent fire hazards.
2508261540_STE-SMDNTC3225N04004MK0_C50751509.pdf
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