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Specifications
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC3225N06003MK0
Package:
SMD,8.1x6mm
Key Attributes
Model Number:
SMDNTC3225N06003MK0
Product Description
Product Overview
The SMD-3225 Series is a series of encapsulated SMD NTC thermistors designed for circuit protection and temperature sensing applications. Featuring advanced encapsulation technology meeting UL94-V0 standards, these thermistors offer a compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are suitable for automated surface mounting processes using lead-free reflow and wave soldering.
Product Attributes
- Brand: Songtian ()
- Product Type: Encapsulated SMD NTC Thermistor
- Series: SMD-3225
- Encapsulation Material: Meets UL94-V0
- Packaging: SMD Tape Reel
- Soldering Compatibility: Lead-free Reflow/Wave Soldering
- Origin: Shantou Free Trade Zone Songtian Electronic Technology Co., Ltd.
Technical Specifications
Features
- Advanced encapsulation process, encapsulation material meets UL94-V0.
- Compact structure, small size, space-saving.
- Superior high-temperature and high-humidity performance.
- Strong surge suppression capability.
- SMD tape reel packaging, suitable for lead-free reflow/wave soldering automatic mounting.
Applications
- Circuit Protection
- Industrial Equipment
- Communication Equipment
- Consumer Electronics
- Automotive Electronics
Part Numbering Scheme
SMD NTC 3225 N 2R5 05 M 0
- NTC: Negative Temperature Coefficient Thermistor
- Internal Management Code
- Model: SMD
- Size: 3225 (approx. 8.1*6.0mm)
- Lead Shape: N (Inward Fold), W (Outward Fold)
- Zero-Power Resistance @ 25: e.g., 020: 2.0, 2R5: 2.5, 201: 200
- Max. Steady-State Current: e.g., S5: 1.5A, 05: 5.0A
- Resistance Tolerance: L: 15%, M: 20%
Product Marking (Example)
1. Songtian Logo
2. NTC Negative Temperature Coefficient Thermistor
3. 3225 (Size: approx. 8.1*6.0mm)
4. 050 (Zero-Power Resistance @ 25: 5.0)
5. M (Capacitance Tolerance: M (20%))
Dimensions
Lead Shape W (Outward Fold)
| Specification | L | L1 | W | L2 | H | L3 | W1 | T |
|---|---|---|---|---|---|---|---|---|
| Product Size (mm) | 8.10.3 | 10.00.3 | 6.00.3 | 11.40.3 | 2.50.3 | 0.50.3 | 2.50.3 | 0.150.01 |
| Pad Size (mm) | a 10.00.2 | b 2.20.2 | c 3.60.2 |
Lead Shape N (Inward Fold)
| Specification | L | L1 | W | L2 | H | L3 | W1 |
|---|---|---|---|---|---|---|---|
| Product Size (mm) | 8.10.3 | 8.50.3 | 6.00.3 | 6.0 Min | 2.50.3 | 1.10.3 | 2.50.3 |
| Pad Size (mm) | a 5.70.2 | b 1.650.2 | c 3.00.2 |
Electrical Performance
| Model | Rated Zero-Power Resistance @ 25 () | Max. Steady-State Current @ 25 (A) | Residual Resistance @ Max. Steady-State Current @ 25 () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/) | Operating Temperature Range () |
|---|---|---|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 0.065 | 2600 | <43 | >13 | -40175 |
| SMDNTC3225*02005** | 2 | 5 | 0.085 | 2600 | <43 | >13 | -40175 |
| SMDNTC3225*2R505** | 2.5 | 5 | 0.095 | 2600 | <43 | >13 | -40175 |
| SMDNTC3225*03005** | 3 | 5 | 0.100 | 2600 | <43 | >13 | -40175 |
| SMDNTC3225*04004** | 4 | 4 | 0.150 | 2600 | <44 | >13 | -40175 |
| SMDNTC3225*05004** | 5 | 4 | 0.156 | 2800 | <45 | >13 | -40175 |
| SMDNTC3225*06003** | 6 | 3 | 0.240 | 2800 | <45 | >13 | -40175 |
| SMDNTC3225*6R803** | 6.8 | 3 | 0.245 | 2800 | <45 | >13 | -40175 |
| SMDNTC3225*07003** | 7 | 3 | 0.2824 | 2800 | <45 | >13 | -40175 |
| SMDNTC3225*08003** | 8 | 3 | 0.255 | 2800 | <47 | >14 | -40175 |
| SMDNTC3225*10003** | 10 | 3 | 0.275 | 2800 | <47 | >14 | -40175 |
| SMDNTC3225*12002** | 12 | 2 | 0.462 | 2800 | <48 | >14 | -40175 |
| SMDNTC3225*13002** | 13 | 2 | 0.465 | 2800 | <50 | >14 | -40175 |
| SMDNTC3225*15002** | 15 | 2 | 0.468 | 2800 | <50 | >14 | -40175 |
| SMDNTC3225*16002** | 16 | 2 | 0.470 | 2800 | <50 | >14 | -40175 |
| SMDNTC3225*18002** | 18 | 2 | 0.495 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*20002** | 20 | 2 | 0.512 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*22002** | 22 | 2 | 0.563 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*25002** | 25 | 2 | 0.623 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*300S5** | 30 | 1.5 | 0.667 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*330S5** | 33 | 1.5 | 0.734 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*470S5** | 47 | 1.5 | 1.002 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*500S5** | 50 | 1.5 | 1.021 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*600S5** | 60 | 1.5 | 1.215 | 3000 | <52 | >15 | -40175 |
| SMDNTC3225*800S2** | 80 | 1.2 | 1.656 | 3200 | <52 | >15 | -40175 |
| SMDNTC3225*101S1** | 100 | 1.1 | 2.053 | 3200 | <50 | >15 | -40175 |
| SMDNTC3225*121S1** | 120 | 1.1 | 2.253 | 3200 | <50 | >15 | -40175 |
| SMDNTC3225*20101** | 200 | 1 | 4.121 | 3200 | <50 | >13 | -40175 |
Reliability Experiments
| No. | Item | Test Method | Standard |
|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Direction and time: X, Y, and Z axes for 2 hours each | No visible damage, Resistance change rate: 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning and area 95% |
| 3 | Resistance to Soldering Heat | Immerse product leads in 2605 solder liquid for 101 seconds, then remove. | Resistance change rate: 10% |
| 4 | High Temperature Storage | Stored at 1252 for 1000+48 hours, tested after 2 hours of standing. | Resistance change rate: 20% |
| 5 | Humidity Resistance | 1. Place product in 402, 90-95% humidity environment for 1000 hours. 2. Place product in 402, 90-95% humidity environment with 1/20 of max. dissipation voltage applied (not less than 0.5V) for 500 hours. | Resistance change rate: 20% |
| 6 | Thermal Shock | -4030min 255min 12530min 255min, 5 cycles total. | Resistance change rate: 20% |
| 7 | Endurance Test | 1. 255, Imax, 1000h; 2. 255, Imax, (1min ON /5min OFF) * 1000 times. | No visible damage, Resistance change rate: 20% |
| 8 | Insulation Withstand Voltage | Apply 750Vac for 1 minute to the encapsulated surface of the product, wound with metal wire in a tight coil, between the coil ends and the leads. | No external damage |
Packaging Information
Tape Packaging Description (Unit: mm)
| SPEC | N (Inward Fold) | W (Outward Fold) | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A0 | B0 | K0 | P | P0 | P2 | T | A0 | B0 | K0 | P | P0 | P2 | T | |
| Dimensions | 6.350.1 | 8.450.1 | 3.250.1 | 8.00.1 | 4.00.1 | 2.00.1 | 0.30.05 | 6.160.1 | 11.900.15 | 3.100.1 | 8.00.15 | 4.00.15 | 2.00.15 | 0.30.05 |
Carrier Tape Dimensions (Unit: mm)
| SPEC | N (Inward Fold) | W (Outward Fold) | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| W | E | F | D0 | D1 | W | E | F | D0 | D1 | |
| Dimensions | 16.00.3 | 1.750.1 | 7.50.1 | 1.5+0.1/-0 | 1.5+0.1/-0 | 24.00.3 | 1.750.15 | 11.50.15 | 1.5+0.15/-0 | 1.5+0.15/-0 |
| Components/Reel | 4000pcs | 4000pcs | ||||||||
15-inch Reel Dimensions (Unit: mm)
| SPEC | N (Inward Fold) | W (Outward Fold) | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| W | E0.5 | F0.5 | T10.3 | T20.3 | W | E0.5 | F0.5 | T10.3 | T20.3 | |
| Dimensions | 16.4 | 2.3 | 10.75 | 2.2 | 2.2 | 24.4 | 2.3 | 10.75 | 2.2 | 2.2 |
| A+0/-2 | 380 | 380 | ||||||||
| N3.0 | 100 | 100 | ||||||||
| D0.3 | 13.3 | 13.3 | ||||||||
Carton Packaging
- N: Inward Fold
- W: Outward Fold
Curves
- Resistance-Temperature Characteristic Curve
- Max. Current Derating Curve
ITa = [1-(Ta-25)/(Tu-25)]Imax
TU: Upper Limit of Working Temperature ()
TL: Lower Limit of Working Temperature ()
Ta: Ambient Temperature ()
Imax: Maximum Steady-State Current
Soldering Instructions
Lead-Free Reflow Soldering Curve
When reflow soldering thermistors, it should be performed under the following conditions:
- Soldering Temperature: 230260
- Soldering Time: 1030s
- Preheating Temperature: 170 max
Wave Soldering Curve
Soldering Iron Rework Conditions
| Item | Condition |
|---|---|
| Soldering Iron Tip Temperature | 400 (max.) |
| Soldering Time | 3.5 sec (max.) |
| Soldering Iron Power | 50W (max.) |
Storage Environment
- Store products under the following conditions and use within 6 months after delivery.
- Temperature: 10~30, Relative Humidity: 60% max.
- Solder NTC within 168 hours after opening the moisture-proof packaging. After opening the moisture-proof packaging, store the NTC in the moisture-proof packaging with a desiccant and HIC card, maintaining the above conditions.
- If the storage period exceeds 6 months, or if the indicator color of the accompanying HIC card changes after the package is opened, baking (60 * 168hr) should be performed before soldering.
- Reference data for baking when product humidity exceeds requirements before reflow soldering (the exposure life after baking starts from zero) when the exposure time of opened products exceeds the exposure life, or when other conditions cause the temperature and humidity around the product to exceed requirements.
- Do not store products in corrosive substances such as sulfur, chlorine gas, or acid, as this will cause lead oxidation and reduce solderability.
- To avoid the influence of moisture, dust, etc., products should be stored on shelves.
- Products stored in warehouses should avoid thermal shock, vibration, and direct sunlight.
Usage Precautions
- The operating ambient temperature should be within the range specified by the technical conditions.
- Do not install close to heat-generating or combustible components. Maintain a spacing of more than 3mm to prevent damage to the components.
- Wear gloves when touching the leads.
- This specification guarantees the quality of our products as individual units. When our products are installed in your products, please ensure that your products have been effectively evaluated and confirmed according to your company's specifications.
- If your company's trial use of our products exceeds the product functions defined in this test specification, we will not be responsible for any failures caused thereby.
- When an NTC is damaged, the failure may result in a short circuit. To prevent dangerous situations such as overheating, smoking, or fire during a short circuit, please incorporate automatic fail-safe functions using components such as fuses in the circuit.
2508261540_STE-SMDNTC3225N06003MK0_C50751513.pdf
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