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Specifications
Resistance @ 25℃:
18Ω
Operating Temperature:
-40℃~+175℃
Mfr. Part #:
SMDNTC3225N18002MK0
Package:
SMD,8.1x6mm
Key Attributes
Model Number:
SMDNTC3225N18002MK0
Product Description
Product Overview
The SMD-3225 Series is a series of encapsulated surface mount thermistors designed for circuit protection and general electronic applications. These thermistors feature advanced encapsulation technology meeting UL94-V0 standards, offering compact size, excellent high-temperature and high-humidity performance, and strong surge suppression capabilities. They are supplied in SMD tape reels for automated mounting via lead-free reflow or wave soldering.
Product Attributes
- Brand: Songtian ()
- Product Type: Encapsulated Surface Mount Thermistor
- Series: SMD-3225
- Encapsulation Material: UL94-V0 compliant
- Packaging: SMD tape reel
- Termination: Lead-free compatible for reflow/wave soldering
- Origin: China
Technical Specifications
General Specifications
| Feature | Description |
|---|---|
| NTC Type | Negative Temperature Coefficient Thermistor |
| Model Size | 3225 (approx. 8.1 * 6.0 mm) |
| Lead Shape | N: Inward bend, W: Outward bend |
| Operating Temperature Range | -40C to 175C |
Electrical Characteristics (Sample Data)
| Part Number (Example) | Resistance @ 25C () | Max. Steady Current @ 25C (A) | B Value (K) 10% | Thermal Dissipation Coefficient (mW/C) |
|---|---|---|---|---|
| SMDNTC3225*1R505** | 1.5 | 5 | 2600 | >13 |
| SMDNTC3225*2R505** | 2.5 | 5 | 2600 | >13 |
| SMDNTC3225*500S5** | 50 | 1.5 | 3000 | >15 |
| SMDNTC3225*20101** | 200 | 1 | 3200 | >13 |
Dimensions (mm)
Outward Bend (W)
| Dimension | Value |
|---|---|
| L | 8.1 0.3 |
| W | 6.0 0.3 |
| H | 2.5 0.3 |
| W1 | 2.5 0.3 |
| T | 0.15 0.01 |
| L1 | 10.0 0.3 |
| L2 | 11.4 0.3 |
Inward Bend (N)
| Dimension | Value |
|---|---|
| L | 8.1 0.3 |
| W | 6.0 0.3 |
| H | 2.5 0.3 |
| W1 | 2.5 0.3 |
| L1 | 8.5 0.3 |
| L2 | 6.0 Min |
| L3 | 1.1 0.3 |
Applications
- Circuit protection
- Industrial equipment
- Communication equipment
- Consumer electronics
- Automotive electronics
Soldering Instructions (Lead-Free Reflow)
| Parameter | Condition |
|---|---|
| Soldering Temperature | 230C ~ 260C |
| Soldering Time | 10s ~ 30s |
| Preheating Temperature | 170C (max.) |
2508261540_STE-SMDNTC3225N18002MK0_C50751517.pdf
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