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Specifications
Operating Temperature:
-40℃~175℃
Tolerance:
±20%
Mfr. Part #:
SMDNTC2522N13001MK0
Package:
SMD,6x5.6mm
Key Attributes
Model Number:
SMDNTC2522N13001MK0
Product Description
Product Overview
The Songtian SMD-2522 Series is a series of encapsulated surface-mount thermistors designed for circuit protection and power management applications. These NTC thermistors offer advanced encapsulation for excellent high-temperature and high-humidity performance, along with strong surge suppression capabilities. They are supplied in tape and reel packaging, suitable for lead-free reflow and wave soldering processes, making them ideal for industrial equipment, communication devices, consumer electronics, and automotive electronics.
Product Attributes
- Brand: Songtian ()
- Series: SMD-2522
- Type: Encapsulated Surface Mount NTC Thermistor
- Encapsulation Material: Meets UL94-V0
- Packaging: Tape and reel for automatic placement
- Certifications: Implied by UL94-V0 rating
Technical Specifications
General Specifications
| Specification | Details |
|---|---|
| Series Name | SMD-2522 Series |
| Product Type | Encapsulated Surface Mount NTC Thermistor |
| Dimensions (Approx.) | 6.0*5.5mm (2522) |
| Lead Shape | N (Internal Fold) |
| Operating Temperature Range | -40 to 175 |
| Lead-Free Compatibility | Suitable for lead-free reflow/wave soldering |
| Encapsulation Compliance | UL94-V0 |
Part Numbering Scheme
| Component | Description | Example |
|---|---|---|
| SMD | Model | SMD |
| NTC | Negative Temperature Coefficient Thermistor | NTC |
| 2522 | Size (approx. 6.0*5.5mm) | 2522 |
| N | Lead Shape (Internal Fold) | N |
| 050 | Resistance at 25 (e.g., 5.0) | 050 (5.0) |
| 04 | Max. Steady State Current (e.g., 4.0A) | 04 (4.0A) |
| M | Resistance Tolerance (e.g., 20%) | M (20%) |
Product Dimensions (for 2522)
| Dimension | Size (mm) |
|---|---|
| L | 6.0 0.1 |
| L1 | 7.0 0.15 |
| W | 5.55 0.1 |
| L2 | 6.0 0.15 |
| H | 2.38 0.1 |
| L3 | 0.5 0.1 |
| W1 | 2.5 0.02 |
Pad Dimensions
| Dimension | Size (mm) |
|---|---|
| a | 5.5 Min |
| b | 2.2 0.1 |
| c | 3.6 0.2 |
Electrical Performance
| Model | Rated Zero-Power Resistance @ 25 () | Max. Steady State Current @ 25 (A) | Max. Residual Resistance @ 25 () | B Value (K) 10% | Thermal Time Constant (S) | Thermal Dissipation Coefficient (mW/) | Operating Temperature Range () |
|---|---|---|---|---|---|---|---|
| SMDNTC2522N2R504** | 2.5 | 4 | 0.113 | 2600 | <35 | >11 | -40 to 175 |
| SMDNTC2522N03004** | 3 | 4 | 0.100 | 2600 | <35 | >11 | -40 to 175 |
| SMDNTC2522N04003** | 4 | 3 | 0.150 | 2600 | <35 | >11 | -40 to 175 |
| SMDNTC2522N05003** | 5 | 3 | 0.156 | 2800 | <34 | >11 | -40 to 175 |
| SMDNTC2522N06002** | 6 | 2 | 0.240 | 2800 | <34 | >11 | -40 to 175 |
| SMDNTC2522N6R802** | 6.8 | 2 | 0.245 | 2800 | <34 | >11 | -40 to 175 |
| SMDNTC2522N07002** | 7 | 2 | 0.2824 | 2800 | <34 | >11 | -40 to 175 |
| SMDNTC2522N08002** | 8 | 2 | 0.255 | 2800 | <32 | >11 | -40 to 175 |
| SMDNTC2522N10002** | 10 | 2 | 0.275 | 2800 | <32 | >11 | -40 to 175 |
| SMDNTC2522N12001** | 12 | 1 | 0.462 | 2800 | <32 | >11 | -40 to 175 |
| SMDNTC2522N13001** | 13 | 1 | 0.465 | 2800 | <32 | >11 | -40 to 175 |
| SMDNTC2522N15001** | 15 | 1 | 0.468 | 2800 | <30 | >11 | -40 to 175 |
| SMDNTC2522N16001** | 16 | 1 | 0.470 | 2800 | <30 | >11 | -40 to 175 |
| SMDNTC2522N18001** | 18 | 1 | 0.495 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N20001** | 20 | 1 | 0.512 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N22001** | 22 | 1 | 0.563 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N25001** | 25 | 1 | 0.623 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N30001** | 30 | 1 | 0.667 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N33001** | 33 | 1 | 0.734 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N47001** | 47 | 1 | 1.002 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N50001** | 50 | 1 | 1.021 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N600X8** | 60 | 0.8 | 1.215 | 3000 | <30 | >11 | -40 to 175 |
| SMDNTC2522N800X8** | 80 | 0.8 | 1.656 | 3200 | <30 | >11 | -40 to 175 |
| SMDNTC2522N101X8** | 100 | 0.8 | 2.053 | 3200 | <30 | >11 | -40 to 175 |
| SMDNTC2522N121X8** | 120 | 0.8 | 2.253 | 3200 | <30 | >11 | -40 to 175 |
| SMDNTC2522N201X5** | 200 | 0.5 | 4.121 | 3200 | <32 | >11 | -40 to 175 |
Reliability Testing
| No. | Item | Test Method | Standard | Resistance Change Rate |
|---|---|---|---|---|
| 1 | Vibration | Frequency: 10~55Hz, Amplitude: 0.75mm, Directions: X, Y, Z axes for 2 hours each | No visible damage | 10% |
| 2 | Solderability | Temperature: 2455, Time: 30.5s | Uniform tinning, 95% coverage | N/A |
| 3 | Resistance to Soldering Heat | Immersion in 2605 solder for 101 sec | N/A | 10% |
| 4 | High Temperature Storage | 1252 for 1000+48 hours, followed by 2 hours rest | N/A | 20% |
| 5 | Humidity Resistance | 1) 402, 90-95% RH for 1000 hours 2) 402, 90-95% RH with 1/20 max. dissipation voltage (0.5V) for 500 hours | N/A | 20% |
| 6 | Thermal Shock | -4030min 255min 12530min 255min, 5 cycles | N/A | 20% |
| 7 | Endurance Test | 1) 255, Imax, 1000h; 2) 255, Imax, (1min ON /5min OFF)*1000 times | No visible damage | 20% |
| 8 | Insulation Withstand Voltage | 750Vac applied for 1 minute between windings and leads | No external damage | N/A |
Packaging Specifications
| Specification | Value (mm) |
|---|---|
| Tape Packaging (Internal Fold 'N') | |
| A0 | 5.7 0.1 |
| B0 | 7.3 0.1 |
| K0 | 2.7 0.1 |
| P | 12.0 0.1 |
| P0 | 4.0 0.1 |
| P2 | 2.0 0.1 |
| T | 0.3 0.1 |
| N (Internal Fold) | N/A (Indicated by part number) |
| SPEC | 16.0 0.3 |
| W | 1.75 0.1 |
| E | 7.5 0.1 |
| F | 1.5 +0.1/-0 |
| D0 | 1.50 +0.1/-0 |
| D1 | N/A |
| Components per Reel | 3000 pcs |
| 13-inch Reel Dimensions | |
| SPEC | 12 |
| E | 2.6 F0.2 |
| F | 10.8 W1.0 |
| W | 12.5 T10.2 |
| T1 | 2.0 T20.2 |
| T2 | 2.0 |
| A+0/-2 | 330 |
| N3.0 | 100 |
Soldering Instructions
| Process | Conditions |
|---|---|
| Lead-Free Reflow Soldering | Peak Temperature: 230260 Time above 230: 1030s Preheating Temperature: 170 max. |
| Wave Soldering | Refer to standard wave soldering profiles. |
| Soldering Iron Rework | Tip Temperature: 400 (max.) Soldering Time: 3.5 sec (max.) Soldering Iron Power: 50W (max.) |
Storage Environment
| Condition | Details |
|---|---|
| Storage Period | Use within 6 months of delivery. |
| Temperature & Humidity | 10~30, Relative Humidity 60%. |
| Post-Moisture Barrier Bag Opening | Solder within 168 hours. Store with desiccant and HIC card in the opened bag. |
| Baking Requirement | If storage exceeds 6 months, or HIC card indicates change, bake at 60 for 168 hours before soldering. Baking resets exposure time. |
| Prohibited Storage | Avoid storage in corrosive substances (sulfur, chlorine gas, acids) to prevent lead oxidation and reduced solderability. |
| General Storage | Store on shelves to avoid moisture, dust, thermal shock, vibration, and direct light. |
Usage Precautions
| Item | Details |
|---|---|
| Operating Temperature | Must be within specified technical limits. |
| Component Proximity | Avoid mounting near heat-generating or flammable components; maintain a gap of >3mm. |
| Handling | Wear gloves when handling leads. |
| Customer Product Evaluation | Ensure thorough evaluation and confirmation of your product's compatibility when integrating Songtian's thermistors. |
| Usage Beyond Specification | Songtian is not liable for failures resulting from usage exceeding the defined product functions in this specification. |
| Fail-Safe Design | In case of NTC failure (potential short circuit), implement fail-safe mechanisms like fuses to prevent fire or smoke hazards. |
2508261540_STE-SMDNTC2522N13001MK0_C50751580.pdf
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