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Specifications
Resistance @ 25℃:
10kΩ
Power(Watts):
5mW
Operating Temperature:
-60℃~+150℃
B Constant (25℃/100℃):
-
Steady State Current (Max):
-
B Constant (25℃/85℃):
-
B Constant (25℃/75℃):
-
B Constant (25℃/50℃):
3435K
B Constant Tolerance:
±0.5%
Mfr. Part #:
103AP-2
Package:
Through Hole,P=2.54mm
Key Attributes
Model Number:
103AP-2
Product Description
Product Overview
This specification defines the rating, dimensions, electrical properties, mechanical properties, and climatic properties for the SEMITEC Ishizuka Electronics Corporation 103AP-2 thermistor. It is designed for applications requiring precise temperature sensing within a wide operating range.
Product Attributes
- Brand: SEMITEC Ishizuka Electronics Corporation
- Origin: Japan (implied by manufacturer name)
Technical Specifications
| Item | Specification | Conditions | Criteria |
|---|---|---|---|
| 3. Rating | |||
| Rated zero-power resistance R25 | 10.0 k ohm +/-0.5% | at 25 deg C | |
| Rated B-value B25/85 | 3 435 K +/- 0.5% | Calculated from zero-power resistance at 25 deg C and 85 deg C | |
| Dissipation factor | Approx. 1.0mW/deg C | in still air at 25 deg C (JIS C 2570 13.7) | |
| Thermal time constant | Approx. 15.0 s | in still air (JIS C 2570 13.8) | |
| Maximum power | 5.0mW | in still air at 25 deg C (Including self-heat of approx. 5 deg C) | |
| 4. Operating temperature ranges | |||
| Operating temperature | -60 deg C ~ +150 deg C | ||
| 5. Dimensions | |||
| Dimensions | Unit: mm 2.54+/-0.25 (Pitch) 17+/-1.5 (Length) 8.5+/-1 (Diameter) 0.25t (Wire diameter) 3.0~4.5 (Coating length) 3.0~3.6 (Body length) 1.8~2.6 (Lead wire length) | ||
| Material | Tin plated 42 alloy (Lead wire) Epoxy resin (Coating) Lead free solder | ||
| 6. Electric properties | |||
| Voltage proof | AC 1 200V x 1 s | (Cut-off current: 1mA) | No visible damage |
| Insulation | Over 100M ohm | Measured at DC 500V between coated area and lead-wires | |
| 7. Mechanical properties | |||
| Robustness of Terminations | +/-0.5% variation (R25 and B-value) | 2N load for 10s; Variation of R25 and B-value within +/-0.5% of initial values; No visible damage except lead wire bend | |
| Free fall | From 1 meter high to maple or similar board | ||
| Resistance to soldering heat | +/-0.5% variation (R25 and B-value) | Soldering bath at 260 deg C+/-5 deg C for 10s+/-1s; OR Soldering iron at 350 deg C+/-5 deg C for 3s+/-0.5s (below tiebar-cut) | Variation of R25 and B-value within +/-0.5% of initial values |
| Solderability | Soldered area, more than 90% | Lead-wires dipped in soldering bath at 245 deg C+/-5 deg C for 2s+/-1s (after applying flux specified in JIS C2570) | |
| 8. Climatic properties | |||
| Dry Heat | +/-0.5% variation (R25 and B-value) | At 150 deg C+/-3 deg C for 1000 hours, then stored at room temperature and humidity for 1 hour | Variation of R25 and B-value within +/-0.5% of initial values |
| Cold | +/-0.5% variation (R25 and B-value) | At 60 deg C+/-3 deg C for 1000 hours, then stored at room temperature and humidity for 1 hour | Variation of R25 and B-value within +/-0.5% of initial values |
| Damp Heat | +/-0.5% variation (R25 and B-value) | At 40 deg C+/-3 deg C, 90%RH~95%RH for 1000 hours, then stored at room temperature and humidity for 1 hour | Variation of R25 and B-value within +/-0.5% of initial values |
| Damp load | +/-0.5% variation (R25 and B-value) | At 40 deg C+/-3 deg C, 90%RH~95%RH with DC 1mA load for 1000 hours, then stored at room temperature and humidity for 1 hour | Variation of R25 and B-value within +/-0.5% of initial values |
| Temperature Cycling | +/-0.5% variation (R25 and B-value) | 100 cycles: Room temp (initial) -> -60 deg C+/-3 deg C (30min) -> Room temp (3min) -> 150 deg C+/-3 deg C (30min) -> Room temp (3min), then stored at room temperature and humidity for 1 hour | Variation of R25 and B-value within +/-0.5% of initial values |
2411220015_SEMITEC-103AP-2_C497230.pdf
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