NTC Chip Thermistor - TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick film sintering process, offer high reliability and high temperature detection accuracy, meeting AEC-Q200 automotive-grade requirements. They are designed to address customer design and manufacturing challenges in various electronic applications.
Product Advantages
- 3rd generation thick film sintering process for high reliability.
- High temperature detection accuracy, meeting AEC-Q200 automotive-grade requirements.
- Excellent thermal response time, with a minimum of 2 seconds.
- Low thermal shock from soldering due to thick film structure.
- Special end electrode structure to release mechanical stress.
- Insulated glass protective layer.
- High purity alumina substrate.
Applications
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Product Attributes
- Brand: CBE (Shenzhen Kaibu Electronics Co., Ltd.)
- Origin: China
- Certifications: AEC-Q200, some models comply with UL2459
Technical Specifications
| Series | Size | Resistance Range (25) | B Value Range (25/85) | Resistance Tolerance | B Value Tolerance | Operating Temperature Range | Max. Operating Power | Dissipation Factor () | Thermal Time Constant () |
|---|---|---|---|---|---|---|---|---|---|
| TCTR | 0402 | 2.6K ~ 41K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 110mW | 1.1mW/ | 1.5sec |
| TCTR | 0603 | 2.6K ~ 41K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 120mW | 1.2mW/ | 2.0sec |
| TCTR | 0805 | 2.6K ~ 41K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 130mW | 1.5mW/ | 2.5sec |
Note: B value is calculated from zero-power resistance at 25 and 85. Other B values can be customized. For specific resistance and B value combinations, please refer to the detailed resistance-temperature characteristic table.
Part Numbering Scheme Example
TCTR0805J1K00H3200T
- TCTR: Series
- 0805: Size
- J: Resistance Tolerance (5%)
- 1K00: Resistance (1000)
- H: B Value Tolerance (3%)
- 3200: B Value (3200K)
- T: Packaging (Standard)
Performance Indicators
| Test Item | Test Method | Standard | Requirement |
|---|---|---|---|
| High Temperature Storage | IEC 60751-2 5.28 | - | R4% |
| High Temp. & High Humidity | IEC 60751-2 5.26 | +95C, 96%RH, 1000h | R4% |
| Vibration | IEC 60751-2 5.44 | 10-66Hz, Amplitude 1.6mm | R4% |
| Solder Heat Resistance | IEC 60751-2 5.36 | +220C, 4s | R3% |
| Solderability | MIL-STD-202G Method 219 | Min. wettable area: 95% | - |
| Temperature Cycling | IEC 60751-2 5.35 | -55C, +125C, 40min each, 211 cycles | R4% |
| Board Flex Test | IEC 60751-2 5.31 | - | R4% |
| Low Temp. Storage | IEC 60751-2 5.29 | -55C, 1000h | R4% |
| Soldering Reflow Curve | - | Sn-Ag-Cu Solder Paste | Max temp: +260C, 30s. Cycles: 3 |
Reel Packaging Dimensions
| Series | P2 | t1 | t2 | D0 | E | P1 | A | B | F | W | |
|---|---|---|---|---|---|---|---|---|---|---|---|
| TCTR0603, TCTR0805 | 2.800.2 | 2.1max. | 2.660.16 | 3.110.16 | 5.110.2 | 5.110.2 | 9.110.3 | 4.610.16 | 2.210.2 | 2.760.26 | 2.010.2 |
| TCTR0402 | 1.760.21 | 2.260.16 | 2.800.2 | 1.6max. | 2.660.16 | 3.110.16 | 1.630.16 | 5.110.2 | 9.110.3 | 4.610.16 | - |
Carrier Tape Reel Dimensions
| Unit: mm | A | B | C | D | W | E | 32.11.9 | 60+1.0/-0.0 | 24.10.3 | 29.1+1.1/-4.1 | 8.11+2.1/-1.1 | 3.110.16 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| - | 2.210.2 | 2.760.26 | 2.010.2 | - | 9.110.3 | - | - | - | - | - | - | - |
2504101957_RESI-TCTR0805F100KF4500T_C388282.pdf
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