NTC Chip Thermistor TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick film sintering process, offer high reliability and high temperature detection accuracy, meeting AEC-Q200 automotive standards. They are suitable for demanding applications requiring precise temperature sensing and fast response times.
Product Attributes
- Brand: CBE ()
- Origin: Shenzhen, China
- Certifications: AEC-Q200, some models comply with UL2459
Technical Specifications
| Series | Size | Resistance Range (25C) | B Value Range (25C/85C) | Resistance Tolerance | B Value Tolerance | Operating Temperature Range | Max. Power Rating | Thermal Dissipation Coefficient () | Time Constant () |
|---|---|---|---|---|---|---|---|---|---|
| TCTR0805 | 0805 | 1K ~ 1M60 | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40C ~ +125C | 120mW | ~1.1mW/ | ~1.5sec |
| TCTR0603 | 0603 | 1K ~ 1M00 | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40C ~ +125C | 110mW | ~1.2mW/ | ~2.0sec |
| TCTR0402 | 0402 | 1K ~ 4510K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40C ~ +125C | 5mW | ~1.5mW/ | ~5.0sec |
Applications
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Product Advantages
- 3rd generation thick film sintering process for high reliability.
- High temperature detection accuracy (up to 1.2C across the full temperature range).
- Fast thermal response time (as low as 2 seconds).
- Minimal thermal shock during soldering due to thick film structure.
- Special end electrode structure to release mechanical stress.
- Meets AEC-Q200 automotive regulations.
- High purity alumina substrate with insulating glass protective layer.
Ordering Information Example
TCTR0805J1K00H3200T (TCTR 0805, 5% Resistance Tolerance, 1K Resistance, 3% B Value Tolerance, 3200K B Value, Standard Product)Dimensions
| Series | L (mm) | W (mm) | T (mm) | a (mm) | b (mm) | c (mm) |
|---|---|---|---|---|---|---|
| TCTR0805 | 2.000.20 | 1.250.20 | 0.550.10 | 0.400.20 | 1.600.15 | 0.800.15 |
| TCTR0603 | 1.600.15 | 0.800.15 | 0.500.10 | 0.300.20 | 1.000.05 | 0.500.05 |
| TCTR0402 | 1.000.10 | 0.500.10 | 0.350.05 | 0.25+0.05/-0.10 | 0.500.05 | 0.350.05 |
Reliability Test Items
| Test Item | Test Method | Standard | Condition | Criteria |
|---|---|---|---|---|
| High Temperature Storage | IEC 60068-2-2 | Ta=150C, 1000h | R4% | |
| High Temp. & Humidity Storage | IEC 60068-2-30 | +96C, 96%RH, 1000h | R4% | |
| Vibration | IEC 60068-2-6 | 10-500Hz, Amplitude 1.5mm peak-peak, 3h each direction | R4% | |
| Solder Heat Resistance | IEC 60068-2-21 | +260C tin bath, 10s | R4% | |
| Solderability | MIL-STD-202G Method 208 | Min. solderable area 95% | R1% | |
| Temperature Cycling | IEC 60068-2-14 | -55C to +125C, 1000 cycles | R4% | |
| Board Flex Test | IEC 60068-2-31 | 6mm, hold time 20s | R4% | |
| Low Temperature Storage | IEC 60068-2-1 | -55C, 1000h | R4% |
Soldering Temperature Curve
Reflow Soldering Curve (Sn-Ag-Cu)
Preheat: +150C to +200C, 60-180s. Peak: +265C, 10s. Max Temp: +265C, within 30s. Number of cycles: 3.
Wave Soldering Curve (Sn-Ag-Cu)
Preheat: +150C to +200C, 60-180s. Peak: +265C, 10s. Max Temp: +265C, within 30s. Number of cycles: 4.
Marking
- TCTR1513, TCTR1714, TCTR1916: No marking.
2504101957_RESI-TCTR0402F10K0F4100T_C525370.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible