<
>
Specifications
Mfr. Part #:
BDJ0800HFV-TR
Package:
HVSOF-5
Key Attributes
Model Number:
BDJ0800HFV-TR
Product Description
Package Information: HVSOF5
This document provides detailed package information for the HVSOF5 package, including its structure, packing specifications, dimensions, marking, storage conditions, and soldering recommendations. It is intended for use in general electronic equipment.
Product Attributes
- Brand: ROHM
- Package Name: HVSOF5
- Package Type: SOP
- Lead Finish: Pure Tin
- MSL Level: 1
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Package | Pin Count | 5 |
| Package | Weight | 0.003 g |
| Packing | Form | Tape&Reel |
| Packing | Quantity | 3,000 pcs |
| Packing Material | Embossed carrier tape | PS |
| Packing Material | Cover tape | PET+PE |
| Packing Material | Reel | PS |
| Packing Material | Unit box | Cardboard |
| Packing Material | Shipping box | Cardboard |
| Packing Specification | Leader length | No component pockets are 160mm or more. |
| Packing Specification | Trailer length | No component pockets are 40 mm or more. Tape is free from reel. |
| Packing Specification | Cover tape peelback strength | 0.2 N to 0.7 N |
| Packing Specification | Missing ICs | No consecutive dropouts. A maximum of 0.1% of specified number of products in each packing may be missing. |
| Reel Dimensions | A | 180 +0/-1.5 mm |
| Reel Dimensions | B | 60 +1.0/-0 mm |
| Reel Dimensions | C | 13 0.2 mm |
| Reel Dimensions | D | 21 0.8 mm |
| Reel Dimensions | E | 2 0.5 mm |
| Reel Dimensions | W1 | 9 +1.0/-0 mm |
| Reel Dimensions | W2 | 11.4 1.0 mm |
| Packing Method | Unit box per reel | 3 reel(s) or less per unit box |
| Packing Style | Unit box per shipping box | 4 unit boxes or less per shipping box |
| Shipping Box Dimensions | X | 190 mm |
| Shipping Box Dimensions | Y | 255 mm |
| Shipping Box Dimensions | Z | 193 mm |
| Storage Conditions | Temperature | 5 to 30 C |
| Storage Conditions | Humidity | - to 85 % RH |
| Storage Conditions | Storage Period | - to 1 year |
| Soldering Conditions | Reflow Profile | Recommended temperature profile for reflow |
| Soldering Conditions | Wave Soldering | Not supported |
| Soldering Conditions | Solder Iron Rework | Not allowed (may cause mold crack and terminal open) |
| Mounting Cautions | Flexible Film Mounting | Film bend may occur; usage of support board and underfill is recommended. |
| Mounting Cautions | Long/Narrow Board Mounting | Bending stress may occur; bending board direction and outer lead direction is recommended as drawing (vertically layout) and under fill usage is recommended. |
2311142236_ROHM-BDJ0800HFV-TR_C17383133.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
