NTC Chip Thermistor TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick-film sintering process, offer high reliability and high temperature detection accuracy, meeting AEC-Q200 automotive-grade requirements. They are designed to address the challenges in customer design and manufacturing across various electronic industries.
Product Advantages
- 3rd generation thick-film sintering process
- High reliability and high temperature detection accuracy
- Automotive-grade product meeting AEC-Q200 test requirements
- Insulated glass protective layer
- High purity alumina substrate
- Special end electrode structure to release mechanical stress
Applications
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Product Attributes
- Brand: (CBEureka)
- Origin: Shenzhen, China
- Certifications: AEC-Q200, some models meet UL2459
Technical Specifications
| Series | Size | Resistance Range (25) | B Value Range (25/85) | Resistance Tolerance | B Value Tolerance | Max Operating Power | Operating Temperature Range | Thermal Dissipation Coefficient () | Time Constant () |
| TCTR0805 | 0805 | 1K~1M | 3000K~4800K | 1%~10% | 1%~5% | 120mW | -40~+125 | 1.2mW/ | 2.0sec |
| TCTR0603 | 0603 | 1K~1M | 3000K~4800K | 1%~10% | 1%~5% | 110mW | -40~+125 | 1.1mW/ | 1.5sec |
| TCTR0402 | 0402 | 1K~1M | 3000K~4800K | 1%~10% | 1%~5% | 5mW | -40~+125 | 1.5mW/ | 5.0sec |
Resistance-Temperature Characteristics (Example: 10K, B:3200K)
| Temperature () | Resistance () |
| -40 | 24,430.0 |
| -35 | 18,210.0 |
| -30 | 14,820.0 |
| -25 | 12,140.0 |
| -20 | 10,000.0 |
| -15 | 8,286.0 |
| -10 | 6,903.0 |
| -5 | 5,782.0 |
| 0 | 4,867.0 |
| 5 | 4,116.0 |
| 10 | 3,498.0 |
| 15 | 2,986.0 |
| 20 | 2,560.0 |
| 25 | 2,203.0 |
| 30 | 1,904.0 |
| 35 | 1,652.0 |
| 40 | 1,439.0 |
| 45 | 1,258.0 |
| 50 | 1,103.0 |
| 55 | 971.3 |
| 60 | 857.7 |
| 65 | 759.8 |
| 70 | 675.3 |
| 75 | 601.9 |
| 80 | 538.1 |
| 85 | 483.4 |
| 90 | 435.9 |
| 95 | 394.1 |
| 100 | 357.5 |
| 105 | 325.3 |
| 110 | 296.8 |
| 115 | 271.3 |
| 120 | 248.5 |
| 125 | 227.9 |
Dimensions
| Series | L | W | T | a | b | c |
| TCTR0805 | 2.000.20 | 1.250.20 | 0.550.10 | 0.400.20 | 1.600.15 | 0.800.15 |
| TCTR0603 | 1.600.15 | 0.800.15 | 0.500.10 | 0.300.20 | 1.000.05 | 0.500.05 |
| TCTR0402 | 1.000.05 | 0.500.05 | 0.350.05 | 0.25+0.05/-0.10 | 0.700.05 | 0.300.05 |
Part Numbering Scheme
Example: TCTR0805J1K00H3200T (TCTR 0805 J 5% 1K H 3% B value 3200K T Standard Product)
| Component | TCTR | Size | Tolerance | Resistance | B Value Tolerance | B Value | Packaging |
| Series | TCTR | 0402, 0603, 0805 | F=1%, G=2%, H=3%, J=5%, K=10% | e.g., 1K00=1000, 390R=390 | F=1%, G=2%, H=3%, J=5% | e.g., 3200=3200K, 4000=4000K | T=Standard, H=High Temp |
Reliability Test Items
| Test Item | Test Method | Standard | Requirement |
| High Temperature Storage | IEC 60068-2-2 | +125, 1000 hours | R4% |
| High Temperature and High Humidity | IEC 60068-2-30 | +96, 96%RH, 1000 hours | R4% |
| Vibration | IEC 60068-2-6 | 10-500Hz, Amplitude 1.5mm, 1 hour/axis (X,Y,Z) | R4% |
| Solder Heat Resistance | IEC 60068-2-21 | +260, 10 seconds | R4% |
| Solderability | MIL-STD-202G Method 208 | Min. 95% coverage | R4% |
| Temperature Cycling | IEC 60068-2-14 | -55 to +125, 1000 cycles | R4% |
| Board Flex Test | IEC 60068-2-21 | 4mm | R4% |
| Low Temperature Storage | IEC 60068-2-1 | -55, 1000 hours | R4% |
2504101957_RESI-TCTR0402F100KF4750T_C525364.pdf
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