NTC Chip Thermistor TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick-film sintering process, offer high reliability and high temperature detection accuracy, meeting AEC-Q200 automotive-grade requirements. They are suitable for applications requiring precise temperature sensing and fast response times.
Product Attributes
- Brand: CBE ()
- Origin: Shenzhen, China
- Certifications: AEC-Q200, some models comply with UL 2450
Technical Specifications
| Series | Size | Resistance Range (25C) | B Value Range (25C/85C) | Resistance Tolerance | B Value Tolerance | Operating Temperature Range | Max. Power Rating | Dissipation Factor () | Thermal Time Constant () |
|---|---|---|---|---|---|---|---|---|---|
| TCTR0805 | 0805 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40C ~ +125C | 120mW | ~1.2mW/ | ~2.0 sec |
| TCTR0603 | 0603 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40C ~ +125C | 110mW | ~1.1mW/ | ~1.5 sec |
| TCTR0402 | 0402 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40C ~ +125C | 5mW | ~1.5mW/ | ~5.0 sec |
Applications
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Product Advantages
- 3rd generation thick-film sintering process
- High reliability and high temperature detection accuracy
- Automotive-grade product compliant with AEC-Q200
- Insulating glass protective layer
- High purity alumina substrate
- Special electrode structure for mechanical stress relief
- Fast thermal response time (as low as 2s)
Ordering Information Example
TCTR0805J1K00H3200T (TCTR 0805, 5% Resistance Tolerance, 1K, 3% B Value Tolerance, 3200K B Value, Standard Product)Performance Indicators
| Test Item | Test Method | Standard | Requirement |
|---|---|---|---|
| High Temperature Storage | +125C, 1000 hours | IEC 60751-2 | R 4% |
| High Temp & Humidity | +85C, 85%RH, 1000 hours | IEC 60751-2 | R 4% |
| Vibration | 10-500Hz, 1.5mm peak-peak, 3 hours per axis | IEC 60751-2 | R 4% |
| Solder Heat Resistance | +260C, 10 sec | IEC 60751-2 | R 4% |
| Solderability | Min. 95% coverage | MIL-STD-202G Method 219 | R 4% |
| Temperature Cycling | -55C to +125C, 1000 cycles | IEC 60751-2 | R 4% |
| Board Flex Test | 3mm flex | IEC 60751-2 | R 4% |
| Low Temperature Storage | -55C, 1000 hours | IEC 60751-2 | R 4% |
Soldering Temperature Curve
Reflow Soldering: Preheat: +150C to +200C, 60-180 sec. Peak Temp: +265C, 10 sec. Applicable solder composition: Sn-Ag-Cu. Max. 4 times.
Wave Soldering: Preheat: +150C to +200C, 60-180 sec. Peak Temp: +260C, 10 sec. Applicable solder composition: Sn-Ag-Cu. Max. 3 times.
2504101957_RESI-TCTR0402F100KF4540T_C525365.pdf
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