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quality Compact Leadless SMD Thermistor R O HNTC0805-103F3380FB with Fast Thermal Response and Dissipation factory
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quality Compact Leadless SMD Thermistor R O HNTC0805-103F3380FB with Fast Thermal Response and Dissipation factory
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Specifications
Resistance @ 25℃:
10kΩ
Power(Watts):
200mW
Pitch:
0.5mm
Operating Temperature:
-40℃~+125℃
Tolerance:
±1%
Steady State Current (Max):
440uA
Thermal Time Constant:
5s
B Constant Tolerance:
±1%
B Constant (25℃/50℃):
3380K
Mfr. Part #:
HNTC0805-103F3380FB
Package:
0805
Key Attributes
Model Number: HNTC0805-103F3380FB
Product Description

Product Overview

The HNTC0805 Series Chip NTC Thermistor from Zhuhai Hongjiacheng Technology co., Ltd is a leadless, SMD-type thermistor designed for high-density mounting. It offers excellent solderability, a wide operating temperature range of -40 to +125, and is RoHS compliant, Lead-Free, and Halogen Free. This thermistor is suitable for various applications including consumer electronics, mobile phones, wearable devices, TWS headphones, office automation, industrial power supplies, medical electronics, and IoT sensor nodes.

Product Attributes

  • Brand: HJC (Zhuhai Hongjiacheng Technology co., Ltd)
  • Origin: Zhuhai, China
  • Certifications: RoHS compliant, Lead-Free, Halogen Free

Technical Specifications

ParameterConditionValueUnit
Rated Zero-Power ResistanceTa=250.1101%K
B Constant (Material Constant)25/5033801%K
Permissible Operating CurrentTa=250.10.44mA
Thermal Dissipation ConstantTa=250.12.0mW/
Thermal Time ConstantTa=250.1<5sec
Rated Electric PowerTa=250.1200mW
Operating Temperature Range-40 to +125
B Constant Tolerance1% (F)
Resistance Tolerance1% (F)
Test ItemStandardConditionRequirement
Terminal StrengthIEC 60068-2-21Solder chip to jig, apply force.No removal or split of termination or other defects.
Resistance to FlexureIEC 60068-2-21Solder chip to jig, apply force.No visible damage. |R25/R25| 5%
DroppingIEC 60068-2-32Drop 10 times from 1 meter onto concrete.No visible damage.
SolderabilityIEC 60068-2-58Solder temp: 2455, Duration: 30.3s, Solder: Sn/3.0Ag/0.5CuNo visible damage. Wetting 95% coverage.
Resistance to Soldering HeatIEC 60068-2-58Solder temp: 2605, Duration: 101s, Solder: Sn/3.0Ag/0.5CuNo visible damage. |R25/R25| 5%, |B/B| 2%
Temperature CyclingIEC 60068-2-145 cycles without loading.No visible damage. |R25/R25| 3%, |B/B| 2%
Resistance to Dry HeatIEC 60068-2-21255 in air for 100024 hours.No visible damage. |R25/R25| 5%, |B/B| 2%
Resistance to ColdIEC 60068-2-1-403 in air for 100024 hours.No visible damage. |R25/R25| 5%, |B/B| 2%
Resistance to Damp HeatIEC 60068-2-78402, 90-95%RH for 100024 hours.No visible damage. |R25/R25| 3%, |B/B| 2%
Resistance to High Temperature LoadIEC 60539-1 5.25.4852 in air with permissive operating current for 100048 hours.No visible damage. |R25/R25| 5%, |B/B| 2%
PackagePart NumberDelivery ModeMPQ (PCS)L (mm)W (mm)H (mm)L1 (mm)
0805HNTC0805-103F3380FB7''REEL4,0002.000.201.250.200.850.200.50.30

2508041620_R-O-HNTC0805-103F3380FB_C49247661.pdf

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