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quality R O HNTC0402 103J3950HB chip thermistor with rated electric power and leadless surface mount design factory
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quality R O HNTC0402 103J3950HB chip thermistor with rated electric power and leadless surface mount design factory
>
Specifications
Resistance @ 25℃:
10kΩ
Power(Watts):
100mW
Pitch:
0.25mm
Operating Temperature:
-40℃~+125℃
Tolerance:
±5%
Steady State Current (Max):
310uA
Thermal Time Constant:
3s
B Constant (25℃/50℃):
3950K
B Constant Tolerance:
±3%
Mfr. Part #:
HNTC0402-103J3950HB
Package:
0402
Key Attributes
Model Number: HNTC0402-103J3950HB
Product Description

Chip NTC Thermistor HNTC0402 Series

The HNTC0402 is a leadless, chip-type NTC thermistor designed for high-density surface-mount applications. It offers excellent solderability, a wide operating temperature range of -40 to +125, and is RoHS compliant, Lead-Free, and Halogen-Free. This thermistor is suitable for various applications including consumer electronics, mobile phones, wearable devices, TWS headphones, office automation, industrial power supplies, medical electronics, and IoT sensor nodes.

Product Attributes

  • Brand: HJC
  • Origin: Zhuhai Hongjiacheng Technology co., Ltd
  • Certifications: RoHS compliant, Lead-Free, Halogen Free

Technical Specifications

ParameterConditionValueUnit
Rated Zero-Power ResistanceTa=250.1105%K
B Constant (Material Constant)25/5039503%K
Permissible Operating CurrentTa=250.10.31mA
Thermal Dissipation ConstantTa=250.11.0mW/
Thermal Time ConstantTa=250.1<3sec
Rated Electric PowerTa=250.1100mW
Operating Temperature Range-40 to +125

Recommended Soldering Conditions

ItemCondition
Reflow Soldering ProfilePre-heat Temperature: Min +150, Max +170; Pre-heat Time: 9030 secs. ramp up rate 3/sec.; Time above 240: 20~40 secs; Peak Temperature: +260, 10 secs. Max; Ramp-down Rate: 6/sec. Max; Time 25 to Peak Temp (TP): 8 min. Max
Iron SolderingSoldering Iron-tip Temperature: 280Max; Soldering Time: 3 secs. Max; Times for iron soldering: 1 time Max

Reliability Test Items

Test ItemStandard Test Methods and RemarksRequirements
Terminal StrengthIEC 60068-2-21No removal or split of the termination or other defects shall occur.
Resistance to FlexureIEC 60068-2-21No visible damage. R25/R25 5%
DroppingIEC 60068-2-32No visible damage.
SolderabilityIEC 60068-2-58No visible damage. Wetting shall exceed 95% coverage.
Resistance to Soldering HeatIEC 60068-2-58No visible damage. R25/R25 5%; B/B 2%
Temperature cyclingIEC 60068-2-14No visible damage R25/R25 3%; B/B 2%
Resistance to dry heatIEC 60068-2-2No visible damage. R25/R25 5%; B/B 2%
Resistance to coldIEC 60068-2- 1No visible damage. R25/R25 5%; B/B 2%
Resistance to damp heatIEC 60068-2-78No visible damage. R25/R25 3%; B/B 2%
Resistance to high temperature loadIEC 60539-1 5.25.4No visible damage. R25/R25 5%; B/B 2%

Packaging Information

Part NumberPackageDELIVERY MODEMPQ(PCS)
HNTC0402-103J3950HB04027''REEL10,000

Physical Dimensions

PartPackageL (mm)W (mm)H (mm)L1 (mm)
04021.000.150.500.150.500.150.250.10

Storage Conditions

  • Storage temperature: -10 to +40
  • Storage Conditions: Light-proof, Hermetically Sealed, Moisture-proof; The components should be left in their original packing to avoid soldering problems due to oxidized contacts.
  • Relative humidity: < 75 % RH
  • Storage period: The components should be employed within 6 months after delivery

2508041620_R-O-HNTC0402-103J3950HB_C49247683.pdf

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