Chip NTC Thermistor HNTC0402 Series
The HNTC0402 is a leadless, chip-type NTC thermistor designed for high-density surface-mount applications. It offers excellent solderability, a wide operating temperature range of -40 to +125, and is RoHS compliant, Lead-Free, and Halogen-Free. This thermistor is suitable for various applications including consumer electronics, mobile phones, wearable devices, TWS headphones, office automation, industrial power supplies, medical electronics, and IoT sensor nodes.
Product Attributes
- Brand: HJC
- Origin: Zhuhai Hongjiacheng Technology co., Ltd
- Certifications: RoHS compliant, Lead-Free, Halogen Free
Technical Specifications
| Parameter | Condition | Value | Unit |
| Rated Zero-Power Resistance | Ta=250.1 | 105% | K |
| B Constant (Material Constant) | 25/50 | 39503% | K |
| Permissible Operating Current | Ta=250.1 | 0.31 | mA |
| Thermal Dissipation Constant | Ta=250.1 | 1.0 | mW/ |
| Thermal Time Constant | Ta=250.1 | <3 | sec |
| Rated Electric Power | Ta=250.1 | 100 | mW |
| Operating Temperature Range | -40 to +125 |
Recommended Soldering Conditions
| Item | Condition |
| Reflow Soldering Profile | Pre-heat Temperature: Min +150, Max +170; Pre-heat Time: 9030 secs. ramp up rate 3/sec.; Time above 240: 20~40 secs; Peak Temperature: +260, 10 secs. Max; Ramp-down Rate: 6/sec. Max; Time 25 to Peak Temp (TP): 8 min. Max |
| Iron Soldering | Soldering Iron-tip Temperature: 280Max; Soldering Time: 3 secs. Max; Times for iron soldering: 1 time Max |
Reliability Test Items
| Test Item | Standard Test Methods and Remarks | Requirements |
| Terminal Strength | IEC 60068-2-21 | No removal or split of the termination or other defects shall occur. |
| Resistance to Flexure | IEC 60068-2-21 | No visible damage. R25/R25 5% |
| Dropping | IEC 60068-2-32 | No visible damage. |
| Solderability | IEC 60068-2-58 | No visible damage. Wetting shall exceed 95% coverage. |
| Resistance to Soldering Heat | IEC 60068-2-58 | No visible damage. R25/R25 5%; B/B 2% |
| Temperature cycling | IEC 60068-2-14 | No visible damage R25/R25 3%; B/B 2% |
| Resistance to dry heat | IEC 60068-2-2 | No visible damage. R25/R25 5%; B/B 2% |
| Resistance to cold | IEC 60068-2- 1 | No visible damage. R25/R25 5%; B/B 2% |
| Resistance to damp heat | IEC 60068-2-78 | No visible damage. R25/R25 3%; B/B 2% |
| Resistance to high temperature load | IEC 60539-1 5.25.4 | No visible damage. R25/R25 5%; B/B 2% |
Packaging Information
| Part Number | Package | DELIVERY MODE | MPQ(PCS) |
| HNTC0402-103J3950HB | 0402 | 7''REEL | 10,000 |
Physical Dimensions
| Part | Package | L (mm) | W (mm) | H (mm) | L1 (mm) |
| 0402 | 1.000.15 | 0.500.15 | 0.500.15 | 0.250.10 |
Storage Conditions
- Storage temperature: -10 to +40
- Storage Conditions: Light-proof, Hermetically Sealed, Moisture-proof; The components should be left in their original packing to avoid soldering problems due to oxidized contacts.
- Relative humidity: < 75 % RH
- Storage period: The components should be employed within 6 months after delivery
2508041620_R-O-HNTC0402-103J3950HB_C49247683.pdf
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