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quality Leadless R plus O HNTC0402-473F4050FB chip thermistor with lead free and halogen free certification factory
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quality Leadless R plus O HNTC0402-473F4050FB chip thermistor with lead free and halogen free certification factory
>
Specifications
Resistance @ 25℃:
47kΩ
Power(Watts):
100mW
Pitch:
0.25mm
Operating Temperature:
-40℃~+125℃
Tolerance:
±1%
Steady State Current (Max):
140uA
Thermal Time Constant:
3s
B Constant Tolerance:
±1%
B Constant (25℃/50℃):
4050K
Mfr. Part #:
HNTC0402-473F4050FB
Package:
0402
Key Attributes
Model Number: HNTC0402-473F4050FB
Product Description

Product Overview

The HNTC0402 Series Chip NTC Thermistor is a leadless, SMD type component designed for high-density mounting. It offers a B constant tolerance of 1% and excellent solderability. With an operating temperature range of -40 to +125, it is RoHS compliant, Lead-Free, and Halogen Free. This thermistor is suitable for a wide range of applications including consumer electronics (mobile phones, wearable devices, TWS headphones), office automation (printers, facsimile machines), industrial power supplies, medical electronics, and IoT sensor nodes.

Product Attributes

  • Brand: HJC
  • Origin: Zhuhai Hongjiacheng Technology co., Ltd
  • Certifications: RoHS compliant, Lead-Free, Halogen Free

Technical Specifications

ParameterConditionValueUnit
Rated Zero-Power ResistanceTa=250.147K
B Constant (Material Constant)25/504050K
Permissible Operating CurrentTa=250.10.14mA
Thermal Dissipation ConstantTa=250.11.0mW/
Thermal Time ConstantTa=250.1<3sec
Rated Electric PowerTa=250.1100mW
Operating Temperature Range-40 to +125

Recommended Soldering Conditions

ProfileConditionValueUnit
Pre-heat Temperature Min150
Pre-heat Temperature Max170
Pre-heat Timeramp up rate 3/sec. Max9030secs.
Time above 240 Max20~40secs
Peak Temperature260
Peak Duration10secs.
Ramp-down Rate Max6/sec.
Time 25 to Peak Temp (TP) Max8min.

Iron Soldering Recommendation

ItemConditionsValueUnit
Temperature of Soldering Iron-tipMax280
Soldering TimeMax3secs.
Times for iron solderingMax1time

Reliability Test Items

Test ItemStandard Test MethodsRequirements
Terminal StrengthIEC 60068-2-21No removal or split of the termination or other defects shall occur.
Resistance to FlexureIEC 60068-2-21No visible damage. |R25/R25| 5%
DroppingIEC 60068-2-32No visible damage.
SolderabilityIEC 60068-2-58No visible damage. Wetting shall exceed 95% coverage.
Resistance to Soldering HeatIEC 60068-2-58No visible damage. |R25/R25| 5% |B/B| 2%
Temperature cyclingIEC 60068-2-14No visible damage |R25/R25| 3% |B/B| 2%
Resistance to dry heatIEC 60068-2-2No visible damage. |R25/R25| 5% |B/B| 2%
Resistance to coldIEC 60068-2-1No visible damage. |R25/R25| 5% |B/B| 2%
Resistance to damp heatIEC 60068-2-78No visible damage. |R25/R25| 3% |B/B| 2%
Resistance to high temperature loadIEC 60539-1 5.25.4No visible damage. |R25/R25| 5% |B/B| 2%

Physical Dimensions

PartPackageL (mm)W (mm)H (mm)L1 (mm)
04021.000.150.500.150.500.150.250.10

Ordering Information

PACKAGEPart NumberDELIVERY MODEMPQ(PCS)
0402HNTC0402-473F4050FB7''REEL10,000

2508041620_R-O-HNTC0402-473F4050FB_C49247685.pdf

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