NTC Chip Thermistor - TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick-film sintering process, offer high reliability and high temperature detection accuracy, meeting AEC-Q200 automotive standards. These thermistors are designed to address customer design and manufacturing challenges in various electronic applications.
Product Advantages
- Utilizes 3rd generation thick-film sintering technology for high reliability.
- High temperature detection accuracy, meeting AEC-Q200 automotive grade requirements.
- Features an insulating glass protective layer, high-purity alumina substrate, and specialized electrode structure.
- Fast thermal response time, with some models reaching as low as 2 seconds.
- Low thermal shock from soldering, suitable for applications requiring high stability and reliability.
- Special end electrode structure effectively releases mechanical stress from thermal shock and PCB bending.
- AEC-Q200 automotive certification compliant.
- Some models comply with UL2459 standard.
Application Scenarios
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Product Attributes
- Brand: (CBEureka)
- Origin: Shenzhen, China
- Material: Alumina substrate, thick-film resistive element
- Certifications: AEC-Q200, UL2459 (partial models)
Technical Specifications
| Series | Size | Resistance Range (25C) | B Value Range (25C/85C) | Resistance Tolerance | B Value Tolerance | Max Operating Power | Operating Temperature Range | Thermal Dissipation Coefficient () | Time Constant () |
| TCTR0402 | 0402 | 2K ~ 211K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | 5mW | -40C ~ +125C | ~1.1mW/C | ~1.5sec |
| TCTR0603 | 0603 | 2K ~ 211K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | 6mW | -40C ~ +125C | ~1.2mW/C | ~2.0sec |
| TCTR0805 | 0805 | 2K ~ 211K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | 6mW | -40C ~ +125C | ~1.5mW/C | ~2.5sec |
| Series | Standard Resistance (, 25C) | B Value (25C/85C) | Max Operating Temperature | Dissipation Factor (mW/C) | Time Constant (sec) | Max Power (mW) | Resistance Tolerance (%) | B Value Tolerance (%) |
| TCTR0805 | 1K, 10K, 100K | 3000K, 3200K, 3450K, 3700K, 3900K, 4100K, 4300K, 4500K, 4700K | +125C | ~1.1 | ~1.5 | 5 | 1, 2, 3, 5, 10 | 1, 2, 3, 5 |
| TCTR0603 | 1K, 10K, 100K | 3000K, 3200K, 3450K, 3700K, 3900K, 4100K, 4300K, 4500K, 4700K | +125C | ~1.2 | ~2.0 | 6 | 1, 2, 3, 5, 10 | 1, 2, 3, 5 |
| TCTR0402 | 1K, 10K, 100K | 3000K, 3200K, 3450K, 3700K, 3900K, 4100K, 4300K, 4500K, 4700K | +125C | ~1.5 | ~2.5 | 6 | 1, 2, 3, 5, 10 | 1, 2, 3, 5 |
| Test Item | Test Method | Standard | Requirement |
| High Temperature Storage | IEC 60068-2-2 | +125C, 1000 hours | R4% |
| High Temp/Humidity Storage | IEC 60068-2-30 | +85C, 85%RH, 1000 hours | R4% |
| Vibration | IEC 60068-2-6 | 10-500Hz, Amplitude 1.5mm, 3 hours per axis | R4% |
| Solder Heat Resistance | IEC 60068-2-21 | +260C, 10 seconds | R4% |
| Solderability | MIL-STD-202G Method 208 | Minimum solderable area 95% | N/A |
| Temperature Cycling | IEC 60068-2-14 | -55C to +125C, 1000 cycles | R4% |
| Board Flex Test | IEC 60068-2-21 | 0.6mm, 20s hold time | R4% |
| Low Temperature Storage | IEC 60068-2-1 | -55C, 1000 hours | R4% |
2504101957_RESI-TCTR0402F100KF4360T_C525366.pdf
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