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Specifications
Mfr. Part #:
BDJ0700HFV-TR
Package:
HVSOF-5
Key Attributes
Model Number:
BDJ0700HFV-TR
Product Description
Product Overview
This document details the package information for the HVSOF5 package, a Small Outline Package (SOP) with 5 pins. It covers package structure, packing specifications including tape and reel dimensions, material usage, and storage and soldering conditions.
Product Attributes
- Brand: ROHM
- Package Type: SOP
- Lead Finish: Pure Tin
- MSL Level: 1
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Package Information | Package Name | HVSOF5 |
| Package Information | Type | SOP |
| Package Information | Pin Count | 5 |
| Package Information | Package Weight [g] | 0.003 |
| Packing Specification | Packing Form | Tape&Reel |
| Packing Specification | Packing Quantity [pcs] | 3,000 |
| Packing Specification | PIN 1 Orientation | TR |
| Packing Specification | Material - Embossed carrier tape | PS |
| Packing Specification | Material - Cover tape | PET+PE |
| Packing Specification | Material - Reel | PS |
| Packing Specification | Material - Unit box | Cardboard |
| Packing Specification | Material - Shipping box | Cardboard |
| Packing Specification | Leader specification | No component pockets are 160mm or more. |
| Packing Specification | Trailer specification | No component pockets are 40 mm or more. Tape is free from reel. |
| Packing Specification | Cover tape peelback strength | 0.2 N to 0.7 N |
| Packing Specification | Missing Ics | (1) No consecutive dropouts. (2) A maximun 0.1 % of specified number of products in each packing may be missing. |
| Reel Dimension | A [mm] | 180 +0/-1.5 |
| Reel Dimension | B [mm] | 60 +1.0/-0 |
| Reel Dimension | C [mm] | 13 0.2 |
| Reel Dimension | D [mm] | 21 0.8 |
| Reel Dimension | E [mm] | 2 0.5 |
| Reel Dimension | W1 [mm] | 9 +1.0/-0 |
| Reel Dimension | W2 [mm] | 11.4 1.0 |
| Packing Method | Unit box | 3 reel(s) or less per unit box |
| Packing Style | Shipping box | 4 unit boxes or less per shipping box |
| Shipping Box Dimension | X [mm] | 190 |
| Shipping Box Dimension | Y [mm] | 255 |
| Shipping Box Dimension | Z [mm] | 193 |
| Storage conditions | Storage environment - Temperature | 5 to 30 C |
| Storage conditions | Storage environment - Humidity | - to 85 % RH |
| Storage conditions | Storage period | - to 1 year |
| Storage conditions | Drying process | Not required before solder mounting. |
| Soldering conditions | Wave soldering | Not supported. |
| Soldering conditions | Solder iron | Rework by soldering iron is not allowed or it may cause mold crack and terminal open. |
| Soldering conditions | Mounting on flexible film | Film bend may occur lack of lead from package, usage of support board and under fill is recommended. |
| Soldering conditions | Mounting on long and narrow board | Bending stress may occur a luck of lead from package, bending board direction and outer lead direction is recommended as drawing (vertically layout) and under fill usage is recommended. |
2311140557_ROHM-BDJ0700HFV-TR_C17261254.pdf
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