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Specifications
Mfr. Part #:
BDJ0600HFV-TR
Package:
HVSOF-5
Key Attributes
Model Number:
BDJ0600HFV-TR
Product Description
Package Information: HVSOF5
This document provides detailed package information for the HVSOF5 package, including its structure, packing specifications, dimensions, marking, storage, and soldering conditions. It is intended for use in general electronic equipment.
Product Attributes
- Brand: ROHM
- Package Name: HVSOF5
- Type: SOP
- Pin Count: 5
- Lead Finish: Pure Tin
- MSL Level: 1
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Package | Package Name | HVSOF5 |
| Package | Type | SOP |
| Package | Pin Count | 5 |
| Package | Weight [g] | 0.003 |
| Package | Lead Finish | Pure Tin |
| Package | MSL Level | 1 |
| Packing | Packing Form | Tape&Reel |
| Packing | Packing Quantity [pcs] | 3,000 |
| Packing | PIN 1 Orientation | TR |
| Packing | Material - Embossed carrier tape | PS |
| Packing | Material - Cover tape | PET+PE |
| Packing | Material - Reel | PS |
| Packing | Material - Unit box | Cardboard |
| Packing | Material - Shipping box | Cardboard |
| Packing | Leader specification | No component pockets are 160mm or more. |
| Packing | Trailer specification | No component pockets are 40 mm or more. Tape is free from reel. |
| Packing | Cover tape peelback strength | 0.2 N to 0.7 N |
| Packing | Missing ICs | (1) No consecutive dropouts. (2) A maximun 0.1 % of specified number of products in each packing may be missing. |
| Packing | Unit box quantity | 3 reel(s) or less per unit box |
| Packing | Shipping box quantity | 4 unit boxes or less per shipping box |
| Dimensions | Shipping Box Dimension X [mm] | 190 |
| Dimensions | Shipping Box Dimension Y [mm] | 255 |
| Dimensions | Shipping Box Dimension Z [mm] | 193 |
| Storage | Recommended Storage Temperature Min. [C] | 5 |
| Storage | Recommended Storage Temperature Max. [C] | 30 |
| Storage | Recommended Storage Humidity Max. [% RH] | 85 |
| Storage | Storage period Max. [year] | 1 |
| Storage | Drying process required before solder mounting | No |
| Soldering | Wave soldering method support | No |
| Soldering | Rework by soldering iron | Not allowed |
| Soldering | Mounting on flexible film recommendation | Usage of support board and under fill is recommended. |
| Soldering | Mounting on long and narrow board recommendation | Bending board direction and outer lead direction is recommended as drawing (vertically layout) and under fill usage is recommended. |
2311150024_ROHM-BDJ0600HFV-TR_C17395724.pdf
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