Chip NTC Thermistor - HNTC0402 Series
The HNTC0402 Series Chip NTC Thermistor is a leadless, SMD type component designed for high-density mounting. It offers a B constant tolerance of 1% and excellent solderability. With an operating temperature range of -40 to +125, it is RoHS compliant, Lead-Free, and Halogen Free. This thermistor is ideal for applications in consumer electronics (mobile phones, wearable devices, TWS headphones), office automation (printers, facsimiles, word processors), industrial power supplies, medical electronics, and IoT sensor nodes.
Product Attributes
- Brand: HJC
- Origin: Zhuhai Hongjiacheng Technology co., Ltd
- Certifications: RoHS compliant, Lead-Free, Halogen Free
Technical Specifications
| Parameter | Condition | Value | Unit |
| Rated Zero-Power Resistance | Ta=250.1 | 100 | K |
| B Constant (Material Constant) | 25/50 | 4250 | K |
| Permissible Operating Current | Ta=250.1 | 0.10 | mA |
| Thermal Dissipation Constant | Ta=250.1 | 1.0 | mW/ |
| Thermal Time Constant | Ta=250.1 | <3 | sec |
| Rated Electric Power | Ta=250.1 | 100 | mW |
| Operating Temperature Range | -40 to +125 |
Recommended Soldering Conditions
Reflow Soldering Recommendation
| Item | Condition |
| Pre-heat Temperature Min | +150 |
| Pre-heat Temperature Max | +170 |
| Pre-heat Time | 9030 secs. ramp up rate 3/sec. |
| Time above 240 Max | 20~40 secs |
| Peak Temperature | +26010 secs. Max |
| Ramp-down Rate Max | 6/sec. |
| Time 25 to Peak Temp (TP) Max | 8 min. |
| Note | Do not exceed +260 |
Iron Soldering Recommendation
| Item | Conditions |
| Temperature of Soldering Iron-tip | 280Max |
| Soldering Time | 3 secs. Max |
| Times for iron soldering Max | 1 time Max |
| Note | Take care not to apply the tip of the soldering iron to the terminal electrodes. |
Reliability Test Items
| Test Item | Standard | Requirements |
| Terminal Strength | IEC 60068-2-21 | No removal or split of the termination or other defects shall occur. |
| Resistance to Flexure | IEC 60068-2-21 | No visible damage. R25/R25 5% |
| Dropping | IEC 60068-2-32 | No visible damage. |
| Solderability | IEC 60068-2-58 | No visible damage. Wetting shall exceed 95% coverage. |
| Resistance to Soldering Heat | IEC 60068-2-58 | No visible damage. R25/R25 5% B/B 2% |
| Temperature cycling | IEC 60068-2-14 | No visible damage R25/R25 3% B/B 2% |
| Resistance to dry heat | IEC 60068-2-2 | No visible damage. R25/R25 5% B/B 2% |
| Resistance to cold | IEC 60068-2- 1 | No visible damage. R25/R25 5% B/B 2% |
| Resistance to damp heat | IEC 60068-2-78 | No visible damage. R25/R25 3% B/B 2% |
| Resistance to high temperature load | IEC 60539-1 5.25.4 | No visible damage. R25/R25 5% B/B 2% |
Physical Dimensions
| Part | Package | L (mm) | W (mm) | H (mm) | L1 (mm) |
| 0402 | 1.000.15 | 0.500.15 | 0.500.15 | 0.250.10 |
Ordering Information
| PACKAGE | Part Number | DELIVERY MODE | MPQ(PCS) |
| 0402 | HNTC0402-104F4250FB | 7''REEL | 10,000 |
2508041620_R-O-HNTC0402-104F4250FB_C49247684.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible