NTC Chip Thermistor TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick film sintering process, offer high reliability and high temperature detection accuracy. Designed for automotive-grade applications compliant with AEC-Q200 requirements, these thermistors are suitable for demanding environments. They feature an insulating glass protective layer, high-purity alumina substrate, and a special electrode structure to withstand mechanical stress from soldering and board bending. The advanced thick film manufacturing process ensures fast thermal response times and excellent stability.
Product Attributes
- Brand: CBE ()
- Origin: Shenzhen, China
- Certifications: AEC-Q200, some models comply with UL2459
Technical Specifications
| Series | Size | Resistance Range (25) | B Value Range (25/85) | Resistance Tolerance | B Value Tolerance | Operating Temperature Range | Max. Operating Power | Dissipation Factor () | Thermal Time Constant () |
| TCTR0805 | 0805 | 1K ~ 1.6M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 120mW | ~1.2mW/ | ~2.0sec |
| TCTR0603 | 0603 | 1K ~ 1.1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 110mW | ~1.1mW/ | ~1.5sec |
| TCTR0402 | 0402 | 1K ~ 610K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 5mW | ~1.5mW/ | ~5.0sec |
Application Scenarios
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Performance Indicators
| Test Item | Test Method | Standard Compliance | Requirement |
| High Temperature Storage | IEC 60068-2-2 | - | 1000h @ +125, no load |
| High Temp & Humidity | IEC 60068-2-3 | - | +85, 85%RH, 1000h, 1.6h on, 1.6h off |
| Vibration | IEC 60068-2-6 | - | 10-500Hz, Amplitude 1.5mm peak-to-peak, 1 cycle, 3h each for X, Y, Z axes |
| Resistance to Soldering Heat | IEC 60068-2-21 | - | +260 solder bath, 10s |
| Solderability | MIL-STD-202G Method 208 | - | Minimum solderable area 95% |
| Temperature Cycling | IEC 60068-2-14 | - | -55, +125, 40min each, 211 cycles |
| Board Flex Test | IEC 60068-2-21 | - | 6mm, holding time 20s |
| Low Temperature Storage | IEC 60068-2-1 | - | -55, 1000h, no load |
Soldering Temperature Curve
Wave Soldering Curve:
Surface Temperature: Preheat: +150 ~ +200, 60~180sec. Reflow: +265, 10s. Applicable solder composition: Sn-Ag-Cu solder paste. Number of passes: within 4 times.
Reflow Soldering Curve:
Surface Temperature: Preheat: +150 ~ +200, 60~180sec. Peak: +217, 10s. Maximum temperature: +260, within 30sec. Applicable solder composition: Sn-Ag-Cu solder paste. Number of passes: within 3 times.
2504101957_RESI-TCTR0603F10K0F3960T_C525382.pdf
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