NTC Chip Thermistor - TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick-film sintering process, offer high reliability and high temperature detection accuracy, meeting AEC-Q200 automotive-grade requirements. They are suitable for demanding applications in automotive electronics, medical equipment, industrial control, and smart home appliances.
Product Attributes
- Brand: CBE ()
- Origin: Shenzhen, China
- Certifications: AEC-Q200, some models comply with UL245
Technical Specifications
| Series | Size | Resistance Range (25) | B Value Range (25/85) | Resistance Tolerance | B Value Tolerance | Operating Temperature Range | Max. Operating Power | Dissipation Factor () | Thermal Time Constant () |
|---|---|---|---|---|---|---|---|---|---|
| TCTR | 0402 | 2.6K ~ 41K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 110mW | ~1.1mW/ | ~1.5sec |
| TCTR | 0603 | 2.6K ~ 41K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 120mW | ~1.2mW/ | ~2.0sec |
| TCTR | 0805 | 2.6K ~ 41K | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 130mW | ~1.3mW/ | ~2.5sec |
Product Advantages
The TCTR series utilizes a third-generation NTC thick-film chip technology with a special electrode structure. This results in temperature detection accuracy up to 1.2 across the full temperature range. The mature thick-film manufacturing process allows for a thermal response time as low as 2 seconds, twice as fast as comparable products. The thick-film structure minimizes thermal shock during soldering, making it suitable for applications requiring high stability and reliability. The special end electrode structure effectively releases mechanical stress from thermal shock and PCB bending.
Dimensions and Part Numbering
Standard Dimensions (mm):
| Series | L | W | T | a | b | c |
|---|---|---|---|---|---|---|
| TCTR0402 | 1.000.10 | 0.500.10 | 0.350.05 | 0.300.20 | 0.500.10 | 0.25+0.05/-0.10 |
| TCTR0603 | 1.600.15 | 0.800.15 | 0.500.10 | 0.400.20 | 0.800.15 | 0.300.20 |
| TCTR0805 | 2.000.20 | 1.250.20 | 0.550.10 | 0.400.20 | 1.250.20 | 0.350.10 |
Part Numbering Example: TCTR0805J1K00H3200T
- TCTR: Series
- 0805: Size
- J: Resistance Tolerance (5%)
- 1K00: Resistance (1000)
- H: B Value Tolerance (3%)
- 3200: B Value (3200K)
- T: Product Type (Standard)
Performance Indicators
| Test Item | Test Method | Standard | Requirement |
|---|---|---|---|
| High Temperature Storage | +255~+260, within 30sec. | IEC 60068-2-20 | R4% |
| High Temperature & Humidity | +85, 85%RH, loaded 5mW, 1000h | IEC 60068-2-3 | B3%, R4% |
| Vibration | 10-66Hz, amplitude 1.6mm (peak-peak) | IEC 60068-2-6 | R4% |
| Solder Heat Resistance | +245 tin bath, 5s | IEC 60068-2-21 | B3%, R4% |
| Solderability | Min. solderable area 95% | MIL-STD-202G Method 208 | R4% |
| Temperature Cycling | -55, +125, 30min each, 211 cycles | IEC 60068-2-14 | B3%, R4% |
| Board Flex Test | 6mm, 20s hold time | IEC 60068-2-21 | R4% |
| Low Temperature Storage | -55, 1000h | IEC 60068-2-1 | R4% |
Soldering Temperature Curve
Reflow Soldering Curve (Sn-Ag-Cu):
Preheating: +150 to +200, 60-180s. Peak: +265, 21s. Max Temp: +275, within 30sec. (Max 4 times)
Wave Soldering Curve (Sn-Ag-Cu):
Preheating: +150 to +200, 60-180s. Peak: +255, 21s. Max Temp: +260, within 30sec. (Max 3 times)
2504101957_RESI-TCTR0603F100KF4310T_C525389.pdf
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