NTC Chip Thermistor TCTR Series
The TCTR series NTC chip thermistors, manufactured using the 3rd generation thick-film sintering process, offer high reliability and high temperature detection accuracy, meeting AEC-Q200 automotive-grade requirements. They are suitable for demanding applications in automotive electronics, medical devices, industrial control equipment, and smart home appliances.
Product Attributes
- Brand: (CBEureka)
- Origin: China
- Certifications: AEC-Q200, UL (partial models)
Technical Specifications
| Series | Size | Resistance Range (25) | B Value Range (25/85) | Resistance Tolerance | B Value Tolerance | Operating Temperature Range | Max. Operating Power | Dissipation Factor () | Thermal Time Constant () |
|---|---|---|---|---|---|---|---|---|---|
| TCTR0805 | 0805 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 120mW | 1.2mW/ | 2.0sec |
| TCTR0603 | 0603 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 110mW | 1.1mW/ | 1.5sec |
| TCTR0402 | 0402 | 1K ~ 1M | 3000K ~ 4800K | 1% ~ 10% | 1% ~ 5% | -40 ~ +125 | 5mW | 1.5mW/ | 5.0sec |
Product Advantages
- 3rd generation thick-film sintering process for high reliability.
- High temperature detection accuracy (up to 1.2 over the full temperature range).
- Fast thermal response time (down to 2s).
- Low thermal shock from soldering due to thick-film structure.
- Special end electrode structure to release mechanical stress.
- Meets AEC-Q200 automotive regulations.
- Some models comply with UL2450 standards.
- Maximum operating temperature up to 150 for B=4510K and above, and 230 for B below 4510K.
Applications
- Automotive Electronics
- Medical Devices
- Industrial Control Equipment
- Smart Home Appliances
Part Numbering Scheme Example
TCTR0805J1K00H3200T (TCTR 0805 5% 1K B value accuracy 3% B value 3200K Standard product)
Dimensions and Packaging
Refer to the detailed diagrams for dimensions, tape & reel specifications, and PCB pad recommendations.
Performance Indicators
| Test Item | Test Method | Standard | Requirement |
|---|---|---|---|
| High Temperature Storage | - | IEC 68-2-2 | R4% |
| High Temp/Humidity Storage | +95C, 96%RH, 1000h | IEC 68-2-3 | R4%, B3% |
| Vibration | 10-66Hz, 1.6mm peak-peak | IEC 68-2-6 | R4% |
| Solder Heat Resistance | +255C tin bath, 4s | IEC 68-2-20 | R4%, B3% |
| Solderability | Min. solderable area 95% | IEC 68-2-21 | - |
| Temperature Cycling | -55C to +125C, 41min each, 211 cycles | IEC 68-2-14 | R4%, B3% |
| Board Flex Test | 6mm, 20s hold time | IEC 68-2-21 | R4% |
| Low Temperature Storage | -55C, 1000h | IEC 68-2-1 | R4% |
| Solder Heat Resistance (Reflow) | +260C tin bath, 10s | MIL-STD-202G Method 210 | R4% |
Soldering Temperature Curve
Wave Soldering Curve:
Surface Temperature: Preheat: +150C to +200C, 60-180s. Reflow: +217C, 70-260s. Peak Temperature: +265C, 10s. Applicable solder composition: Sn-Ag-Cu paste. Number of times: within 4 times.
Reflow Soldering Curve:
Surface Temperature: Preheat: +150C to +200C, 60-180s. Peak: +217C, 10s. Maximum Temperature: +265C, 10s. Applicable solder composition: Sn-Ag-Cu paste. Number of times: within 4 times.
Disclaimer
All product information, specifications, and data are subject to change without notice. Shenzhen CBE Electronics Co., Ltd. and its affiliates disclaim all liability for errors, inaccuracies, or incompleteness in the provided information. Product descriptions do not extend or modify the terms and conditions of purchase. CBE Electronics makes no warranties or representations beyond those expressly stated in the terms and conditions of purchase. Customers are responsible for verifying the suitability of the product for their specific application. The latest version of the specifications can be obtained from www.resistor.today. The use of products in life-support or life-sustaining applications is prohibited unless expressly stated in writing by an authorized CBE Electronics representative. All risks associated with such use are borne by the customer.
2504101957_RESI-TCTR0805F100KF4460T_C525384.pdf
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