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quality SMD Type Leadless Chip NTC Thermistor R O HNTC0603-103J3950HB for High Density Mounting Applications factory
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quality SMD Type Leadless Chip NTC Thermistor R O HNTC0603-103J3950HB for High Density Mounting Applications factory
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Specifications
Resistance @ 25℃:
10kΩ
Power(Watts):
100mW
Pitch:
0.3mm
Operating Temperature:
-40℃~+125℃
Tolerance:
±5%
Steady State Current (Max):
310uA
Thermal Time Constant:
5s
B Constant (25℃/50℃):
3950K
B Constant Tolerance:
±3%
Mfr. Part #:
HNTC0603-103J3950HB
Package:
0603
Key Attributes
Model Number: HNTC0603-103J3950HB
Product Description

Product Overview

The HNTC0603 Series Chip NTC Thermistor from Zhuhai Hongjiacheng Technology co., Ltd is a leadless, SMD-type thermistor designed for high-density mounting. It offers excellent solderability, a wide operating temperature range of -40 to +125, and is RoHS compliant, Lead-Free, and Halogen Free. This thermistor is ideal for various applications including consumer electronics, office automation, industrial power supplies, medical electronics, and IoT sensor nodes.

Product Attributes

  • Brand: HJC (Zhuhai Hongjiacheng Technology co., Ltd)
  • Origin: Zhuhai
  • Certifications: RoHS compliant, Lead-Free & Halogen Free
  • Type: Chip NTC Thermistor
  • Mounting Type: SMD
  • Features: Leadless, suitable for high density mounting, excellent solderability

Technical Specifications

Parameter Condition Value Unit
Rated Zero-Power Resistance Ta=250.1 105% K
B Constant (25/50) Material Constant 39503% K
Permissible Operating Current Ta=250.1 0.31 mA
Thermal Dissipation Constant Ta=250.1 1.0 mW/
Thermal Time Constant Ta=250.1 <5 sec
Rated Electric Power Ta=250.1 100 mW
Operating Temperature Range -40 to +125

Part Number Code Explanation

H NTC - J H B

  • HJC Brand Code
  • Chip NTC Thermistor
  • Chip Size/package
  • Rated Zero-Power Resistance: e.g., 104=100K, 105=1M
  • Resistance Tolerance: F: 2%, G: 1%, H: 4%, J: 5%
  • B Constant
  • B Constant Tolerance: F: 2%, H: 4%
  • B Constant calculation method: A: 25/50, B: 25/85

Recommended Soldering Conditions (Reflow Soldering)

Feature Condition Profile
Pre-heat Temperature Min +150
Pre-heat Temperature Max +170
Pre-heat Time 9030 secs. ramp up rate 3/sec.
Time above 240 Max 20~40 secs
Peak Temperature +26010 secs. Max
Ramp-down Rate Max 6/sec.
Time 25 to Peak Temp (TP) Max 8 min.
Note Do not exceed +260

Iron Soldering Recommendation

Item Conditions
Temperature of Soldering Iron-tip 280Max
Soldering Time 3 secs. Max
Times for iron soldering Max 1 time
Note Take care not to apply the tip of the soldering iron to the terminal electrodes.

Physical Dimensions

Part Package L (mm) W (mm) H (mm) L1 (mm)
0603 1.600.15 0.800.15 0.800.15 0.30.20

Packaging Information

Part Number Package MPQ(PCS) Delivery Mode
HNTC0603-103J3950HB 0603 4,000 7''REEL

2508041620_R-O-HNTC0603-103J3950HB_C49247676.pdf

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