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Specifications
Resistance @ 25℃:
10kΩ
Power(Watts):
100mW
Pitch:
0.25mm
Operating Temperature:
-40℃~+125℃
Tolerance:
±1%
Steady State Current (Max):
310uA
Thermal Time Constant:
3s
B Constant Tolerance:
±1%
B Constant (25℃/50℃):
3380K
Mfr. Part #:
HNTC0402-103F3380FB
Package:
0402
Key Attributes
Model Number:
HNTC0402-103F3380FB
Product Description
Product Overview
The HNTC0402 Series Chip NTC Thermistor is a leadless, SMD-type thermistor designed for high-density mounting. It offers a B constant tolerance of 1% and excellent solderability. With an operating temperature range of -40 to +125, it is RoHS compliant, Lead-Free, and Halogen-Free. This thermistor is suitable for a wide range of applications including consumer electronics (mobile phones, wearable devices, TWS headphones), office automation (printers, facsimiles, word processors), industrial power supplies, medical electronics, and IoT sensor nodes.
Product Attributes
- Brand: HJC
- Origin: Zhuhai Hongjiacheng Technology co., Ltd
- Certifications: RoHS compliant, Lead-Free, Halogen Free
Technical Specifications
| Parameter | Condition | Value | Unit |
| Rated Zero-Power Resistance | Ta=250.1 | 10 | K |
| B Constant (Material Constant) | 25/50 | 3380 | K |
| B Constant Tolerance | 1% | ||
| Permissible Operating Current | Ta=250.1 | 0.31 | mA |
| Thermal Dissipation Constant | Ta=250.1 | 1.0 | mW/ |
| Thermal Time Constant | Ta=250.1 | <3 | sec |
| Rated Electric Power | Ta=250.1 | 100 | mW |
| Operating Temperature Range | -40 to +125 | ||
| Chip Size | 0402 |
Recommended Soldering Conditions (Reflow)
| Item | Condition |
| Pre-heat Temperature Min | +150 |
| Pre-heat Temperature Max | +170 |
| Pre-heat Time | 9030 secs. ramp up rate 3/sec. Max |
| Time above 240 | 20~40 secs |
| Peak Temperature | +26010 secs. Max |
| Ramp-down Rate | 6/sec. Max |
| Time 25 to Peak Temp (TP) | 8 min. Max |
Recommended Soldering Conditions (Iron)
| Item | Conditions |
| Temperature of Soldering Iron-tip | 280Max |
| Soldering Time | 3 secs. Max |
| Times for iron soldering | 1 time Max |
Reliability Test Summary
| Reliability Test Item | Standard Test Methods | Requirements |
| Terminal Strength | IEC 60068-2-21 | No removal or split of the termination or other defects shall occur. |
| Resistance to Flexure | IEC 60068-2-21 | No visible damage. R25/R25 5% |
| Dropping | IEC 60068-2-32 | No visible damage. |
| Solderability | IEC 60068-2-58 | No visible damage. Wetting shall exceed 95% coverage. |
| Resistance to Soldering Heat | IEC 60068-2-58 | No visible damage. R25/R25 5%, B/B 2% |
| Temperature cycling | IEC 60068-2-14 | No visible damage. R25/R25 3%, B/B 2% |
| Resistance to dry heat | IEC 60068-2-2 | No visible damage. R25/R25 5%, B/B 2% |
| Resistance to cold | IEC 60068-2-1 | No visible damage. R25/R25 5%, B/B 2% |
| Resistance to damp heat | IEC 60068-2-78 | No visible damage. R25/R25 3%, B/B 2% |
| Resistance to high temperature load | IEC 60539-1 5.25.4 | No visible damage. R25/R25 5%, B/B 2% |
Physical Dimensions
| Part | Package | L (mm) | W (mm) | H (mm) | L1 (mm) |
| 0402 | 1.000.15 | 0.500.15 | 0.500.15 | 0.250.10 |
Storage Conditions
| Item | Condition |
| Storage temperature | -10 to +40 |
| Storage Conditions | Light-proof, Hermetically Sealed, Moisture-proof; Components should be left in their original packing. |
| Relative humidity | < 75 % RH |
| Storage period | Within 6 months after delivery |
2508041620_R-O-HNTC0402-103F3380FB_C49247681.pdf
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