Product Overview
The CMFX 103F3435 is a chip NTC thermistor manufactured by Nanjing Shiheng Electronics Technology Co., Ltd. Designed for precise temperature sensing, this component offers a nominal resistance of 10 k at 25C with a tolerance of 1%. It features a B constant of 34351% (25/50C) and a wide operating temperature range of -40C to +125C. Ideal for applications requiring accurate temperature monitoring and control, it is available in a compact 0402 package size.
Product Attributes
- Brand: Shiheng
- Origin: Nanjing, China
- Product Type: Chip NTC Thermistor
Technical Specifications
| Part Number | Resistance (25C) | Resistance Tolerance | B Constant (25/50C) | B Constant Tolerance (25/50C) | B Constant (25/85C) | Permissible Operating Current (25C) | Dissipation Factor (mW/C) | Thermal Time Constant (s) | Rated Electric Power (25C) | Operating Ambient Temperature (C) | Dimensions (LWT) |
|---|---|---|---|---|---|---|---|---|---|---|---|
| CMFX 103F3435 | 10 k | 1% | 3435 K | 1% | 3480 K | 0.31 mA | 1.0 mW/C | <3 s | 100 mW | -40 ~ +125 | 1.0 0.50 0.50 mm (0402) |
Dimensions and PCB Pattern
| Type | L (inch[mm]) | W (inch[mm]) | T (inch[mm]) | a (inch[mm]) | A (inch[mm]) | B (inch[mm]) | C (inch[mm]) |
|---|---|---|---|---|---|---|---|
| [0402] | 0.0390.006 [1.00.15] | 0.0200.006 [0.50.15] | 0.0200.006 [0.50.15] | 0.0100.004 [0.250.1] | [0.45-0.55] | [0.4-0.5] | [0.45-0.55] |
Reliability Test Summary
| Item | Standard | Requirements |
|---|---|---|
| Terminal Strength | IEC 60068-2-21 | No removal or split of the termination or other defects. |
| Resistance to Flexure | IEC 60068-2-21 | No visible damage; |R25/R25| 5% |
| Vibration | IEC 60068-2-80 | No visible damage. |
| Dropping | IEC 60068-2-32 | No visible damage. |
| Solderability | IEC 60068-2-58 | No visible damage; Wetting shall exceed 95% coverage. |
| Resistance to Soldering Heat | IEC 60068-2-58 | No visible damage; |R25/R25| 5%; |B/B| 2% |
| Temperature Cycling | IEC 60068-2-14 | No visible damage; |R25/R25| 3%; |B/B| 2% |
| Resistance to Dry Heat | IEC 60068-2-2 | No visible damage; |R25/R25| 5%; |B/B| 2% |
| Resistance to Cold | IEC 60068-2-1 | No visible damage; |R25/R25| 5%; |B/B| 2% |
| Resistance to Damp Heat | IEC 60068-2-78 | No visible damage; |R25/R25| 3% |
| Resistance to High Temperature Load | IEC 60539-1 5.25.4 | No visible damage; |R25/R25| 5%; |B/B| 2% |
Taping Specifications
| Type | Tape Thickness (mm) | Tape Material | Quantity per Reel |
|---|---|---|---|
| 0201 | 0.50.15 | Paper Tape | 15K |
| X | 0.50.15 | Paper Tape | 10K |
| A | 0.80.15 | Paper Tape | 4K |
| B | 0.850.2 | Paper Tape | 4K |
Storage Conditions
- Storage Temperature: -10C to 40C
- Relative Humidity: 75%RH
- Conditions to Avoid: Dust, corrosive atmosphere, sunlight.
- Period of Storage: 6 Months
Recommended Soldering Technologies
Reflow Soldering Profile:
- Ramp: 1~2C/sec.
- Pre-heating: 150~170C / 9030 sec.
- Time above 240C: 20~40 sec.
- Peak temperature: 260C Max. / 10 sec.
- Solder paste: Sn/3.0Ag/0.5Cu
- Max. re-flowing cycles: 2 times
Iron Soldering Profile:
- Iron soldering power: Max. 20W
- Pre-heating: 150C / 60 sec.
- Soldering Tip temperature: 280C Max.
- Soldering time: 3 sec Max.
- Solder paste: Sn/3.0Ag/0.5Cu
- Max. iron soldering cycles: 1 time
- Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.
R-T Table (Partial Data)
| Temperature (C) | R_Min (Kohm) | R_Cent (Kohm) | R_Max (Kohm) | Resistance Tolerance | Temperature Tolerance (C) |
|---|---|---|---|---|---|
| -40 | 192.371 | 200.225 | 208.380 | 4.07% | 0.69 |
| -39 | 182.189 | 189.524 | 197.134 | 4.02% | 0.69 |
| ... | ... | ... | ... | ... | ... |
| 25 | 9.900 | 10.000 | 10.100 | 1.00% | 0.26 |
| ... | ... | ... | ... | ... | ... |
| 125 | 0.628 | 0.652 | 0.677 | 3.80% | 1.63 |
2410121534_Nanjing-Shiheng-Elec-CMFX-103F3435_C2889040.pdf
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