NTC Thermistors - Chip Type
Product Overview
This document outlines the specifications for the CMFB series of Chip NTC Thermistors manufactured by Nanjing Shiheng Electronics Technology Co., Ltd. These thermistors are designed for temperature sensing applications, offering precise resistance values at specified temperatures and reliable performance across a wide operating temperature range. They are suitable for various industrial and electronic applications requiring accurate temperature monitoring and control.
Product Attributes
- Brand: Shiheng
- Origin: Nanjing, China
- Product Type: Chip NTC Thermistor
- Series: CMFB
Technical Specifications
General Specifications
| Parameter | Value |
|---|---|
| Part Number | CMFB 503F3950 |
| Date | 2020-07-15 |
| Rated Power (25) | 100 mW |
| Operating Ambient Temperature | -40 to +125 |
| Nominal Zero-Power Resistance at 25 (R25) | 50 k |
| B Constant (25/50) | 3950 K |
| B Constant (25/85) | 3950 K |
| Permissible Operating Current (25) | < 5 mA |
| Dissipation Factor (mW/) | 0.19 |
| Thermal Time Constant (s) | 1.0 |
Dimensions (Table 1)
| Type | L (inch[mm]) | W (inch[mm]) | T (inch[mm]) | a (inch[mm]) | A (inch[mm]) | B (inch[mm]) | C (inch[mm]) |
|---|---|---|---|---|---|---|---|
| [0805] | 0.0790.008 [2.00.2] | 0.0490.008 [1.250.2] | 0.0330.008 [0.850.2] | 0.0200.012 [0.50.3] | [1.0-1.1] | [0.6-0.7] | [1.0-1.2] |
Product Identification (Part Number Breakdown)
| Component | Description |
|---|---|
| Type | CMF: Chip NTC Thermistor |
| External Dimensions (LW) | A[0603] 1.600.800.80, B[0805] 2.001.250.85 |
| 25 Zero-Power Resistance | 222 (2.2k), 503 (50k), 104 (100k) |
| Tolerance of Resistance | F (1%), G (2%), H (3%), J (5%) |
| B Constant | 3470 (3470K), 3950 (3950K), 4050 (4050K) |
Test Conditions
Standard Atmospheric Conditions for Measurement/Test:
Ambient Temperature: 2015
Relative Humidity: 6520%
Air Pressure: 86 kPa to 106 kPa
Conditions for Doubtful Results:
Ambient Temperature: 252
Relative Humidity: 655%
Air Pressure: 86 kPa to 106 kPa
Inspection Equipment
- Visual Examination: 20magnifier
- Resistance value test: Thermistor resistance tester
Reliability Test Summary
| Item | Standard | Requirements |
|---|---|---|
| Terminal Strength | IEC 60068-2-21 | No removal or split of the termination or other defects shall occur. |
| Resistance to Flexure | IEC 60068-2-21 | No visible damage. |R25/R25| 5% |
| Vibration | IEC 60068-2-80 | No visible damage. |
| Dropping | IEC 60068-2-32 | No visible damage. |
| Solderability | IEC 60068-2-58 | No visible damage. Wetting shall exceed 95% coverage. |
| Resistance to Soldering Heat | IEC 60068-2-58 | No visible damage. |R25/R25| 5%, |B/B| 2% |
| Temperature Cycling | IEC 60068-2-14 | No visible damage. |R25/R25| 3%, |B/B| 2% |
| Resistance to Dry Heat | IEC 60068-2-2 | No visible damage. |R25/R25| 5%, |B/B| 2% |
| Resistance to Cold | IEC 60068-2-1 | No visible damage. |R25/R25| 5%, |B/B| 2% |
| Resistance to Damp Heat | IEC 60068-2-78 | No visible damage. |R25/R25| 3%, |B/B| 2% |
| Resistance to High Temperature Load | IEC 60539-1 5.25.4 | No visible damage. |R25/R25| 5%, |B/B| 2% |
Taping Specifications
| Type | Tape Thickness (mm) | Tape Material | Quantity per Reel |
|---|---|---|---|
| 0201 | 0.50.15 | Paper Tape | 15K |
| X | 0.50.15 | Paper Tape | 10K |
| A | 0.80.15 | Paper Tape | 4K |
| B | 0.850.2 | Paper Tape | 4K |
Storage Conditions
- Storage Temperature: -10 to 40
- Relative Humidity: 75%RH
- Keep away from corrosive atmosphere and sunlight.
- Period of Storage: 6 Months
Notes & Warnings
- Do not operate or store under corrosive or deoxidized atmospheres (e.g., chlorine, sulfurated hydrogen, ammonia, sulfuric acid, nitric oxide), volatile or inflammable atmospheres, dusty conditions, excessively high or low pressure, humid sites, places with brine, oil, chemical liquid or organic solvent, or intense vibration.
- The ceramic body is fragile; avoid excessive pressure or impact.
- Do not operate beyond the specified "Operating Temperature Range".
Recommended Soldering Technologies
Re-flowing Profile:
Ramp: 1~2/sec.
Pre-heating: 150~170/9030 sec.
Time above 240: 20~40 sec.
Peak temperature: 260 Max./10 sec.
Solder paste: Sn/3.0Ag/0.5Cu
Max. 2 times for re-flowing.
Iron Soldering Profile:
Iron soldering power: Max. 20W
Pre-heating: 150/60sec.
Soldering Tip temperature: 280 Max.
Soldering time: 3 sec Max.
Solder paste: Sn/3.0Ag/0.5Cu
Max. 1 time for iron soldering.
Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.
R-T Table (Partial)
| Temperature () | R_Min (Kohm) | R_Cent (Kohm) | R_Max (Kohm) | Res TOL. | Temp. TOL.() |
|---|---|---|---|---|---|
| -40 | 1,649.637 | 1,726.374 | 1,806.500 | 4.64% | 0.67 |
| -39 | 1,543.253 | 1,613.954 | 1,687.726 | 4.57% | 0.66 |
| ... | ... | ... | ... | ... | ... |
| 25 | 49.500 | 50.000 | 50.500 | 1.00% | 0.23 |
| ... | ... | ... | ... | ... | ... |
| 125 | 1.631 | 1.705 | 1.781 | 4.47% | 1.77 |
2410121534_Nanjing-Shiheng-Elec-CMFB-503F3950_C2889058.pdf
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