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quality Temperature Control Solutions with Nanjing Shiheng Elec MF55 103F3435 Thin Film NTC Thermistor Series factory
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quality Temperature Control Solutions with Nanjing Shiheng Elec MF55 103F3435 Thin Film NTC Thermistor Series factory
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Specifications
Resistance @ 25℃:
10kΩ
Power(Watts):
50mW
Pitch:
2mm
Operating Temperature:
-40℃~+125℃
Tolerance:
±1%
B Constant (25℃/100℃):
-
Steady State Current (Max):
-
Thermal Time Constant:
5s
B Constant (25℃/85℃):
3435K
B Constant (25℃/75℃):
-
B Constant (25℃/50℃):
-
B Constant Tolerance:
±1%
Mfr. Part #:
MF55 103F3435
Package:
Through Hole,P=2mm
Key Attributes
Model Number: MF55 103F3435
Product Description

NTC Thermistors - MF55 Series

Product Overview
The MF55 Thin Film NTC Thermistor series from Nanjing Shiheng Electronics Technology Co., Ltd. is designed for temperature measurement and control applications. These thermistors offer precise resistance values and B-values, ensuring accurate temperature sensing. The series is suitable for various industrial and electronic applications where reliable temperature monitoring is critical. Key features include a wide operating temperature range and robust performance.

Product Attributes

  • Brand: Shiheng
  • Origin: Nanjing, China
  • Product Type: Thin Film NTC Thermistor
  • Certifications: ISO9001:2015, IATF16949:2016, ISO14001:2015

Technical Specifications

Item Symbol Test Condition Unit Performance Requirement
Zero-power resistance at 25 R25 T=250.01, Test Power 0.1mW K 10K1%
B Value B25/85 Ta=250.01, Tb=850.01 K 34351%
Dissipation Factor Still air mW/ 0.8
Time Constant Still air sec 5
Operating Temperature Range / / -40 ~ 125
Max. Rated Power Pmax / mW 50
Lead Pull Test / Fix the thermistor probe, apply 1 Newton force to the lead, maintain for (101)s / No appearance damage
Solderability Test / Soldering temperature (24510), immersion time: (31) s / Tinning area 95%
Soldering Heat Resistance Test / Soldering temperature (2605), immersion time: (51)s / R25 R/R 2%
High Temperature Storage Test / 1255, 100024 hours / R25 R/R 3%
Low Temperature Storage Test / -405, 100024 hours / R25 R/R 3%
Steady State Damp Heat Test / 402, 90-95%RH, 240 hours / R25 R/R 3%
Rapid Temperature Change Test / Cycle five times under the conditions below / R25 R/R 3%
Temperature Cycle Conditions / Step 1: -405 (303 min); Step 2: Room Temp (21 min); Step 3: 1255 (303 min); Step 4: Room Temp (21 min) / /

Product Details

Model: MF55 103F3435

Model Breakdown:

  • 103: Zero-power resistance at 25 is 10K
  • 3435: B25/85 value is 3435K

Usage Precautions

  • Intended Use: Temperature measurement and control.
  • Avoid excessive current that may cause self-heating and measurement errors.
  • For soldering, maintain a distance of at least 2mm from the film. Soldering temperature should be below 360, with a duration of less than 3 seconds.
  • Storage Conditions: Temperature: -10 ~ 40; Humidity: 75% RH.
  • Avoid storage in environments with corrosive gases or direct sunlight.
  • Reseal packaging after opening and store. Shelf life is 1 year. Products exceeding the shelf life can be re-inspected according to the standard requirements and can still be used if they meet the requirements.
  • When using heat shrink tubing during processing, do not use a hot air gun for shrinking. Recommended process: Place the product with the heat shrink tubing into a constant temperature oven and heat shrink at 110 for 10-12 minutes.

Contact Information

Company: Nanjing Shiheng Electronics Technology Co., Ltd.

Address: No. 18 Jinyang Road, Hushu Town, Jiangning District, Nanjing City, China

Postal Code: 211121

Tel: 025-52121868

Fax: 025-52122373

Email: sales@shiheng.com.cn

Website: Http://www.shiheng.com.cn


1912111437_Nanjing-Shiheng-Elec-MF55-103F3435_C394026.pdf
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