Product Overview
The NTC Thermistor (Negative Temperature Coefficient Resistor) is a device whose resistance decreases as ambient temperature increases. It is manufactured by shaping and sintering metal oxides of iron, nickel, cobalt, manganese, or copper at high temperatures. This thermistor is designed for applications requiring temperature-dependent resistance.
Product Attributes
- Color: Black
- Wrapper Material: Phenolic aldehyde
- Lead Wire Material: Tinned Electron Wire
Technical Specifications
| Item | Specification Request | Test Conditions | Specification Request |
| Nominal Resistance (251) | 2.520% | ||
| Max Steady State Current (25) | 5A | ||
| Thermal Time Constant (approx.) | 43S | ||
| Thermal Dissipation Constant (approx.) | 17mW | ||
| Operating Range | -40~+200 | ||
| Approximate Resistance Value at Maximum Current | 0.095 | ||
| Max Shock Capacity | 680f/240V | ||
| Zero Power Resistance | At 25, when resistance change due to internal heating is negligible compared to total measurement error. | See Electrical Parameters | |
| B-Value | Calculated using zero power resistance at 25 and 50. | See Electrical Parameters | |
| Thermal Dissipation Constant | Ratio of change in dissipated power to corresponding change in temperature at specified temperature (mW/). | See Electrical Parameters | |
| Thermal Time Constant | Time required to reach 63.2% of the temperature difference between initial and final temperatures under zero power condition. | See Electrical Parameters | |
| Lead Terminal Tensile Strength | No visible damage, Resistance change: 20% | Apply 1.0kg tensile force to each lead terminal for 10 seconds. | |
| Lead Terminal Bend Strength | No visible damage, Resistance change: 20% | Fix body, hang 0.5kg on one terminal, bend 90, return, then bend 90 in opposite direction. | |
| Vibration | No substantial damage | Frequency: 10~50Hz, Amplitude: 1.55mm, Direction and time: X, Y, Z axes for 2 hours each. | |
| Solderability | Covered termination: 98% | Solder bath temperature: 2355, Time: 3S. | |
| Resistance to Soldering Heat | Resistance change: 10% | Dip lead wires in molten solder at 35010 for 3.00.5 seconds up to 4.00.8mm depth. Leave at room temperature for 24 hours before measurement. | |
| Dry Heat (High Temperature Storage) | Resistance change: 10% | Subject to ambient of 1252 for 1000+48 hours. Leave at room ambient for 1 to 2 hours before measurement. | |
| Cold (Low Temperature Storage) | Resistance change: 10% | Subject to ambient of -403 for 1000+48 hours. Leave at room ambient for 1 to 2 hours before measurement. | |
| Humidity Test | Resistance change: 10% | 402, 95% RH, 1000 HR. | |
| Temperature Cycle Test | Resistance change: 20% | -40/30min 25/5min +125/30min 25/5min. | |
| Operating Temperature | -40 to +200 | Allowable temperature range for long-term continuous operation. | |
| Storage Conditions | -10~40, RH75% |
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