Product Overview
The 700 Series Platinum RTD (Resistance Temperature Detector) is an economical, miniature temperature sensor designed for a wide range of applications. Available in leaded and Surface Mount Technology (SMT) configurations, including industry-standard 0805 and 1206 packages for SMT, these sensors offer linear resistance versus temperature characteristics, high accuracy, interchangeability, excellent stability, and fast response times. They are compliant with RoHS directives and suitable for applications in HVAC, electronic assemblies, process control, appliances, automotive, and instrumentation.
Product Attributes
- Brand: Honeywell
- Series: 700 Series Platinum RTD
- Certifications: RoHS compliant (EU Directive 2002/95/EC)
- Material: Pt-clad Ni wire (leads), galvanic tin-plated with Ni barrier layer (SMT termination)
Technical Specifications
| Model | Temperature Range (C) | Nominal Resistance at 0 C | Temperature Coefficient | Tolerance | Long-term Stability (max. R0 drift) | Response Time (Water/Air) | Measuring Current | Package Style and Size | Termination |
|---|---|---|---|---|---|---|---|---|---|
| 700-* (Class B & 2B) | -70 to 500 (continuous) | 100 | 3850 ppm/K | Class B, Class 2B | 0.04% after 1000 h at 500 C | Water (v=0.4 m/s): t0.5=0.05 s; t0.9=0.15 s Air (V=2 m/s): t0.5=3.0 s; t0.9=10.0 s | 100 : 0.3 mA to 1.0 mA 1000 : 0.1 mA to 0.3 mA | Leaded | Pt-clad Ni wire |
| 700-* (Class A) | -30 to 300 | Class A | N/A | Leaded | Pt-clad Ni wire | ||||
| 701-* (Class B & 2B) | -70 to 500 (continuous) | 100 | 3850 ppm/K | Class B, Class 2B | 0.04% after 1000 h at 500 C | Water (v=0.4 m/s): t0.5=0.04 s; t0.9=0.12 s Air (V=2 m/s): t0.5=2.2 s; t0.9=7.0 s | 100 : 0.3 mA to 1.0 mA 1000 : 0.1 mA to 0.3 mA | Leaded | Pt-clad Ni wire |
| 701-* (Class A) | -30 to 300 | Class A | N/A | Leaded | Pt-clad Ni wire | ||||
| 702-* (Class B) | -50 to 130 (continuous) | 100 | 3850 ppm/K | Class B | 0.06 % after 1000 h at 130 C | Water (v=0.4 m/s): t0.5=0.10 s; t0.9=0.25 s Air (V = 2 m/s): t0.5=2.5 s; t0.9=8.0 s | 100 : 0.3 mA to 1.0 mA 1000 : 0.1 mA to 0.3 mA | SMD 0805 (1.4 w x 2.3 l x 0.52 thk) | Galvanic Sn-plated with Ni barrier layer |
| 703-* (Class B) | -50 to 130 (continuous) | Class B | Water (v=0.4 m/s): t0.5=0.15 s; t0.9=0.30 s Air (V = 2 m/s): t0.5=3.5 s; t0.9=10.0 s | SMD 1206 (1.65 w x 3.25 l x 0.6 thk) | Galvanic Sn-plated with Ni barrier layer | ||||
| 700-101BAA-B00 | -70 to 500 | 100 | 3850 ppm/K | DIN EN 60751, class A (R0: 0.06 %) | N/A | N/A | N/A | chip, 2.1 w x 2.3 l x 0.9 thk | bare Pt-clad Ni wire, adjacent leads |
| 700-101BAB-B00 | -70 to 500 | 100 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | N/A | N/A | N/A | chip, 2.1 w x 2.3 l x 0.9 thk | bare Pt-clad Ni wire, adjacent leads |
| 700-102AAB-B00 | -70 to 500 | 1000 | 3750 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | N/A | N/A | N/A | chip, 2.1 w x 2.3 l x 0.9 thk | bare Pt-clad Ni wire, adjacent leads |
| 700-102AAC-B00 | -70 to 500 | 1000 | 3750 ppm/K | DIN EN 60751, class 2B (R0: 0.24 %) | N/A | N/A | N/A | chip, 2.1 w x 2.3 l x 0.9 thk | bare Pt-clad Ni wire, adjacent leads |
| 700-102BAA-B00 | -70 to 500 | 1000 | 3850 ppm/K | DIN EN 60751, class A (R0: 0.06 %) | N/A | N/A | N/A | chip, 2.1 w x 2.3 l x 0.9 thk | bare Pt-clad Ni wire, adjacent leads |
| 700-102BAB-B00 | -70 to 500 | 1000 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | N/A | N/A | N/A | chip, 2.1 w x 2.3 l x 0.9 thk | bare Pt-clad Ni wire, adjacent leads |
| 701-101BAA-B00 | -70 to 500 | 100 | 3850 ppm/K | DIN EN 60751, class A (R0: 0.06 %) | N/A | N/A | N/A | chip, 1.25 w x 1.7 l x 0.8 thk | bare Pt-clad Ni wire, adjacent leads |
| 701-101BAB-B00 | -70 to 500 | 100 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | N/A | N/A | N/A | chip, 1.25 w x 1.7 l x 0.8 thk | bare Pt-clad Ni wire, adjacent leads |
| 701-102AAB-B00 | -70 to 500 | 1000 | 3750 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | N/A | N/A | N/A | chip, 1.25 w x 1.7 l x 0.8 thk | bare Pt-clad Ni wire, adjacent leads |
| 701-102BAB-B00 | -70 to 500 | 1000 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | N/A | N/A | N/A | chip, 1.25 w x 1.7 l x 0.8 thk | bare Pt-clad Ni wire, adjacent leads |
| 702-101BBB-A00 | -50 to 130 | 100 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | 0.06 % after 1000 h at 130 C | Water (v=0.4 m/s): t0.5=0.10 s; t0.9=0.25 s Air (V = 2 m/s): t0.5=2.5 s; t0.9=8.0 s | 100 : 0.3 mA to 1.0 mA 1000 : 0.1 mA to 0.3 mA | SMD 0805, 1.4 w x 2.3 l x 0.52 thk | end termination, galvanic Sn-plated with Ni barrier layer |
| 702-102BBB-A00 | -50 to 130 | 1000 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | 0.06 % after 1000 h at 130 C | Water (v=0.4 m/s): t0.5=0.10 s; t0.9=0.25 s Air (V = 2 m/s): t0.5=2.5 s; t0.9=8.0 s | 100 : 0.3 mA to 1.0 mA 1000 : 0.1 mA to 0.3 mA | SMD 0805, 1.4 w x 2.3 l x 0.52 thk | end termination, galvanic Sn-plated with Ni barrier layer |
| 703-101BBB-A00 | -50 to 130 | 100 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | 0.06 % after 1000 h at 130 C | Water (v=0.4 m/s): t0.5=0.15 s; t0.9=0.30 s Air (V = 2 m/s): t0.5=3.5 s; t0.9=10.0 s | 100 : 0.3 mA to 1.0 mA 1000 : 0.1 mA to 0.3 mA | SMD 1206, 1.65 w x 3.25 l x 0.6 thk | end termination, galvanic Sn-plated with Ni barrier layer |
| 703-102BBB-A00 | -50 to 130 | 1000 | 3850 ppm/K | DIN EN 60751, class B (R0: 0.12 %) | 0.06 % after 1000 h at 130 C | Water (v=0.4 m/s): t0.5=0.15 s; t0.9=0.30 s Air (V = 2 m/s): t0.5=3.5 s; t0.9=10.0 s | 100 : 0.3 mA to 1.0 mA 1000 : 0.1 mA to 0.3 mA | SMD 1206, 1.65 w x 3.25 l x 0.6 thk | end termination, galvanic Sn-plated with Ni barrier layer |
2411261542_Honeywell-700-102AAB-B00_C17583716.pdf
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