Product Overview
The HBP401 series is a silicon piezoresistive pressure sensor utilizing a MEMS pressure chip with a Wheatstone bridge structure. Four resistors are diffused on a circular silicon diaphragm. When force is applied, the crystal lattice deforms, altering carrier mobility and resistivity, resulting in a linear voltage output. This product offers good linearity, repeatability, stability, and high sensitivity. Customers can integrate standard amplification circuits like instrumentation amplifiers for output and temperature drift compensation to achieve high-precision, stable, and reliable pressure measurements. The sensor comes in a standard SOP6 package for ease of use and has broad application prospects in healthcare, smart home appliances, and industrial control.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Material: MEMS (Silicon Piezoresistive MEMS)
Technical Specifications
| Feature | Specification |
| Technology | Silicon Piezoresistive MEMS |
| Sensitivity | High |
| Stability | High |
| Measurement Range | -100kPa ~ +1000kPa selectable, Gauge Pressure |
| Package | Standard SOP6 |
| Application Areas | Smart Home Appliances (coffee machines, beer dispensers, vacuum cleaners), Medical Devices (electronic sphygmomanometers, ventilators, oxygen concentrators), Automotive (tire pressure gauges, suspension systems, MAP sensors), Industrial Control (pressure instruments, pneumatic systems) |
| Operating Conditions (for Table 1 data) | Measurement Medium: Air; Atmospheric Pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g(1m/s); Humidity: (50%10%) RH; Constant Current Test: (10.001)mA DC; Constant Voltage Test: (50.005)V DC |
| Pin Definitions (Example) | 1: GND, 2: Vout-, 3: NC, 4: VDD, 5: Vout+, 6: GND (Definition 1) OR 1: Vout-, 2: GND, 3: NC, 4: Vout+, 5: VDD, 6: Vout- (Definition 2) |
| SMT Reflow Soldering Temperature Curve (Figure 4) | Preheating Rate: Max 3C/sec; Preheat Min Temp: 150C; Preheat Max Temp: 200C; Preheat Time (ts): 60-180 sec; Reflow Temp (TL): 217C; Reflow Time (tL): 60-150 sec; Peak Temp (TP): 260C; Peak Temp +/-5C Hold Time (tP): 20-40 sec; Drop Rate (TP to TMAX): Max 6C/sec; Time from 25C to Peak Temp: Max 8 min |
| Reflow Soldering Parameters (Table 3) | Lead-free; Average heating rate (TSMAX to TP): Max 3C/sec; Preheat zone min temp (TSMIN): 150C; Preheat zone max temp (TSMAX): 200C; TSMIN to TSMAX (ts): 60~180 sec; Reflow zone temp (TL): 217C; Reflow zone time (tL): 60~150 sec; Peak temp (TP): 260C; Peak temp +/-5C hold time (tP): 20~40 sec; Drop rate (TP to TSMAX): Max 6C/sec; Time from 25C to peak temp: Max 8 minutes |
| Recommended Reflow Cycles | Not more than 3 times |
| Pressure Conversion | 10kPa = 100hPa = 100mBar 75mmHg 100mmH2O 1.45PSI |
| Customization Services | Available for different ranges, package sizes, and application scopes. Contact info@haobang-smt.com for details. |
| Version History | 1.0: Initial Release (June 2022); 1.1: Updated Pin Definitions (September 2023) |
2506201720_HAOBANG-HI-TECH-HBP401G040S6B_C49229979.pdf
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