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quality DIP6 Package MEMS Pressure Sensor HAOBANG HI-TECH HBP411G101D6RB for Smart Home and Healthcare Devices factory
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quality DIP6 Package MEMS Pressure Sensor HAOBANG HI-TECH HBP411G101D6RB for Smart Home and Healthcare Devices factory
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Specifications
Pressure range:
-1bar~1Mpa
Module:
No
Mfr. Part #:
HBP411G101D6RB
Package:
DIP-6
Key Attributes
Model Number: HBP411G101D6RB
Product Description

Product Overview

The HBP411 product series is a piezoresistive MEMS pressure sensor. Utilizing a Wheatstone bridge structure on a circular silicon diaphragm with four diffused resistors, it converts pressure into a linear voltage output. This technology offers excellent linearity, repeatability, stability, and high sensitivity. The sensor is available in a standard DIP6 package, suitable for non-corrosive gases and liquids. It finds wide applications in medical healthcare, smart home appliances, and industrial control systems.

Product Attributes

  • Brand: (Haobang)
  • Origin: (Wuxi)
  • Technology: MEMS (Piezoresistive MEMS)
  • Packaging: DIP6 (Standard DIP6)

Technical Specifications

FeatureDetails
Sensing TechnologyPiezoresistive MEMS
SensitivityHigh
StabilityHigh
Measurement Range-100kPa ~ +1000kPa (Gauge Pressure, selectable ranges)
Application MediumNon-corrosive gases or liquids
Application AreasSmart home appliances (coffee machines, beer dispensers, vacuum cleaners), Medical equipment (blood pressure monitors, ventilators, oxygen concentrators), Healthcare devices (air mattresses, massage chairs), Industrial control (pressure instruments, pneumatic systems)
Package TypeStandard DIP6
Operating Conditions (for basic performance data)Medium: Air; Atmospheric Pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g (1m/s); Humidity: (50%10%) RH; Constant Current Test: (10.001)mA DC; Constant Voltage Test: (50.005)VDC
Reflow Soldering Curve ParametersPreheating Min Temp: 150C; Preheating Max Temp: 200C; Preheating Time (tS): 60~180s; Reflow Temp (TL): 217C; Reflow Time (tL): 60~150s; Peak Temp (TP): 260C; Peak Temp Holding Time (tP): 20~40s; Cooling Rate (TP to TSMIN): Max 6C/s; Time from 25C to Peak Temp: Max 8 minutes
Pin DefinitionsGND, Vout-, NC, VDD, Vout+ (Refer to pin definition diagram for specific pin numbers and function variations)
Pressure Conversion Factors10kPa=100hPa=100mBar75mmHg100mmH2O1.45PSI

2506201720_HAOBANG-HI-TECH-HBP411G101D6RB_C49229990.pdf

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