Product Overview
The HBP401 series is a piezoresistive silicon MEMS pressure sensor. It utilizes a Wheatstone bridge structure with four diffused resistors on a circular silicon diaphragm. When force is applied, the silicon crystal deforms, altering carrier mobility and resistivity, resulting in a linear voltage output. This sensor offers good linearity, repeatability, stability, and high sensitivity. Customers can integrate standard amplification circuits to adjust and compensate for output and temperature drift, achieving high-precision, stable, and reliable pressure measurements. The product comes in a standard SOP6 package for ease of use and has broad application prospects in healthcare, smart home appliances, and industrial control.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Material: MEMS (Piezoresistive Silicon MEMS)
Technical Specifications
| Feature | Specification | Notes |
|---|---|---|
| Technology | Piezoresistive MEMS | High sensitivity, high stability |
| Measurement Range | -100kPa ~ +1000kPa (gauge pressure) | Selectable ranges |
| Package | Standard SOP6 | Easy to use, high integration |
| Application Areas | Smart home appliances (coffee machines, beer dispensers, vacuum cleaners), Medical devices (electronic sphygmomanometers, ventilators, oxygen concentrators), Automotive (tire pressure gauges, suspension systems, MAP), Industrial control (pressure instruments, pneumatic systems) | |
| Basic Performance Test Conditions | Measurement medium: Air; Atmospheric pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g (1m/s); Humidity: (50%10%) RH; Constant current test: DC (10.001)mA; Constant voltage test: DC (50.005)V | Unless otherwise specified |
| SMT Reflow Soldering Curve | Preheating rate: Max 3C/sec; Preheat zone min temp: 150C; Preheat zone max temp: 200C; Preheat time (ts): 60-180 sec; Reflow zone temp (TL): 217C; Reflow zone time (tL): 60-150 sec; Peak temp (TP): 260C; Peak temp +/-5C hold time (tP): 20-40 sec; Cooling rate: Max 6C/sec; Time from 25C to peak temp: Max 8 minutes | Lead-free |
| Reflow Soldering Recommendations | Minimize external heat influence; use non-corrosive rosin flux; avoid flux intrusion; avoid ultrasonic cleaning; max 3 reflow cycles recommended. | |
| Pin Definitions | 1: GND, 2: Vout-, 3: NC, 4: VDD, 5: Vout+, 6: GND (Definition 1) 1: Vout-, 2: GND, 3: NC, 4: Vout+, 5: VDD, 6: Vout- (Definition 2) | Refer to Diagram 2 for pinout |
2506201720_HAOBANG-HI-TECH-HBP401G101S6_C49229983.pdf
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