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quality Standard SOP6 packaged HAOBANG HI-TECH HBP401G040S6N silicon MEMS pressure sensor for smart home and industrial automation factory
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quality Standard SOP6 packaged HAOBANG HI-TECH HBP401G040S6N silicon MEMS pressure sensor for smart home and industrial automation factory
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Specifications
Pressure range:
-1bar~1Mpa
Module:
No
Mfr. Part #:
HBP401G040S6N
Package:
SOP-6
Key Attributes
Model Number: HBP401G040S6N
Product Description

Product Overview

The HBP401 series is a silicon piezoresistive pressure sensor utilizing a MEMS pressure chip with a Wheatstone bridge structure. Four resistors are diffused onto a circular silicon diaphragm. When force is applied, the crystal lattice deforms, altering carrier mobility and resistivity, resulting in a linear voltage output. This sensor offers good linearity, repeatability, stability, and high sensitivity. Customers can integrate standard amplification circuits for output and temperature drift compensation to achieve high-precision, stable, and reliable pressure measurements. The product uses a standard SOP6 package for ease of use and has broad application prospects in healthcare, smart home appliances, and industrial control.

Product Attributes

  • Brand: (Haobang)
  • Origin: (Wuxi)
  • Material: Silicon piezoresistive MEMS

Technical Specifications

FeatureSpecificationNotes
TechnologySilicon Piezoresistive MEMS
Sensitivity & StabilityHigh
Measurement Range-100kPa ~ +1000kPa (gauge pressure)Selectable ranges
PackageStandard SOP6Easy to use, high integration
Application AreasSmart Home Appliances, Medical Machinery, Automotive, Industrial Pressure Controle.g., Coffee machines, blood pressure monitors, tire gauges, pneumatic systems
Pressure Sensor TypeMEMS Pressure Chip with Wheatstone Bridge
Output SignalLinear voltage outputRequires amplification and compensation for high precision
Operating Conditions (for Table 1 data)Measuring medium: Air; Atmospheric pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g (1m/s); Humidity: (50%10%) RH; Constant current test: DC (10.001)mA; Constant voltage test: DC (50.005)V
Reflow Soldering CurveRefer to Figure 4Max heating rate: 3C/s; Preheating temp: 150-200C; Reflow temp: 217C; Peak temp: 260C
Reflow Soldering ParametersPreheating time (ts): 60-180s; Reflow time (tL): 60-150s; Peak temp hold time (tP): 20-40s; Cooling rate: Max 6C/s; Total time from 25C to peak: Max 8 minsLead-free
Recommended Reflow CyclesMax 3 times
Pressure Conversion10kPa = 100hPa = 100mBar 75mmHg 100mmH2O 1.45PSI

2506201720_HAOBANG-HI-TECH-HBP401G040S6N_C49229978.pdf

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