Product Overview
The HBP401 series is a silicon piezoresistive pressure sensor utilizing a MEMS pressure chip with a Wheatstone bridge structure. Four resistors are diffused onto a circular silicon diaphragm. When force is applied, the silicon crystal deforms, altering carrier mobility and resistivity, resulting in a linear voltage output. This product offers good linearity, repeatability, stability, and high sensitivity. Customers can integrate standard amplification circuits like instrumentation amplifiers for output and temperature drift compensation, achieving high-precision, stable, and reliable pressure measurements. The sensor is available in a standard SOP6 package for ease of use and is suitable for healthcare, smart home appliances, and industrial control applications.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Material: Silicon
- Technology: Silicon Piezoresistive MEMS
- Packaging: Standard SOP6
Technical Specifications
| Feature | Specification |
| Sensing Technology | Silicon Piezoresistive MEMS |
| Sensitivity | High |
| Stability | High |
| Measurement Range | -100kPa ~ +1000kPa (Gauge Pressure, selectable ranges) |
| Package | SOP6 |
| Application Areas | Smart Home Appliances (coffee machines, beer dispensers, vacuum cleaners), Medical Devices (electronic sphygmomanometers, ventilators, oxygen concentrators), Automotive (tire pressure gauges, suspension systems, MAP sensors), Industrial Control (pressure instruments, pneumatic systems) |
| Operating Conditions (for Table 1 data) | Measurement Medium: Air; Atmospheric Pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g (1m/s); Humidity: (50%10%) RH; Constant Current Test: (10.001)mA DC; Constant Voltage Test: (50.005)V DC |
| SMT Reflow Soldering Curve (Figure 4) | Preheating Rate: Max 3C/sec; Preheat Min Temp (TSMIN): 150C; Preheat Max Temp (TSMAX): 200C; Preheat Time (ts): 60-180 sec; Reflow Temp (TL): 217C; Reflow Time (tL): 60-150 sec; Peak Temp (TP): 260C; Peak Temp +/-5C Hold Time (tP): 20-40 sec; Cooling Rate (TP to TSMAX): Max 6C/sec; Time from 25C to Peak Temp: Max 8 min |
| Reflow Soldering Parameters (Table 3) | Lead-free; Average heating rate (TSMAX to TP): Max 3C/sec; Preheat zone minimum temperature (TSMIN): 150C; Preheat zone maximum temperature (TSMAX): 200C; TSMIN to TSMAX (ts): 60~180 seconds; Reflow zone temperature (TL): 217C; Reflow zone time (tL): 60~150 seconds; Peak temperature (TP): 260C; Peak temperature +/-5C holding time (tP): 20~40 seconds; Falling speed (TP to TSMAX): Max 6C/sec; Time from 25C to peak temperature: Max 8 minutes |
| Pin Definitions (Table 2) | Pin 1: GND / Vout- ; Pin 2: Vout- / GND ; Pin 3: NC ; Pin 4: VDD / Vout+ ; Pin 5: Vout+ / VDD ; Pin 6: GND / Vout- |
| Version History (Table 4) | 1.0: Initial Release (June 2022); 1.1: Updated Product Pin Definitions (September 2023) |
2506201720_HAOBANG-HI-TECH-HBP401G102S6_C49229985.pdf
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