Product Overview
The HBP401 series is a piezoresistive silicon pressure sensor utilizing a MEMS pressure chip with a Wheatstone bridge structure. Four resistors are diffused on a circular silicon diaphragm. When force is applied, the crystal lattice deforms, altering carrier mobility and thus the silicon's resistivity, resulting in a linear voltage output. This sensor offers good linearity, repeatability, stability, and high sensitivity. Customers can integrate standard amplifier circuits for output and temperature drift compensation to achieve high-precision, stable, and reliable pressure measurements. The product comes in a standard SOP6 package for ease of use and is widely applicable in healthcare, smart home appliances, and industrial control sectors.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Material: MEMS (Piezoresistive Silicon MEMS)
Technical Specifications
| Model | Pressure Type | Measurement Range | Sensitivity | Stability | Package | Operating Temperature | Drive Method |
| HBP401 Series | Gauge Pressure | -100kPa ~ +1000kPa (Optional) | High Sensitivity | High Stability | SOP6 | 252C (Test Condition) | Constant Current (10.001)mA DC or Constant Voltage (50.005)V DC |
Application Scenarios
- Smart Home Appliances: Coffee machines, beer dispensers, vacuum cleaners.
- Medical Devices: Electronic sphygmomanometers, ventilators, oxygen concentrators.
- Automotive: Tire pressure gauges, vehicle suspension systems, MAP sensors.
- Industrial Control: Pressure instruments, pneumatic systems.
Basic Performance Test Conditions
- Measurement Medium: Air
- Atmospheric Pressure: (101325500)Pa
- Temperature: (252)C
- Vibration: <0.1g (1m/s)
- Humidity: (50%10%) RH
- Constant Current Test: DC (10.001)mA
- Constant Voltage Test: Voltage (50.005)V DC
SMT Reflow Soldering Curve Parameters
| Curve Feature | Parameter |
| Average Heating Rate (TSMAX to TP) | Max 3C/sec |
| Preheat Zone Min Temperature (TSMIN) | 150C |
| Preheat Zone Max Temperature (TSMAX) | 200C |
| Preheat Time (ts) (TSMIN to TSMAX) | 60~180 seconds |
| Reflow Zone Temperature (TL) | 217C |
| Reflow Zone Time (tL) | 60~150 seconds |
| Peak Temperature (TP) | 260C |
| Peak Temperature +/-5C Holding Time (tP) | 20~40 seconds |
| Falling Rate (TP to TSMAX) | Max 6C/sec |
| Time from 25C to Peak Temperature | Max 8 minutes |
SMT Reflow Soldering Notes
- Minimize external heat influence to avoid thermal deformation.
- Use non-corrosive rosin flux.
- Prevent flux from entering the product.
- Avoid flux or cleaning agents from entering the product during post-reflow cleaning.
- Do not expose the product to ultrasonic treatment or cleaning.
- Recommended reflow times: Not exceeding 3 times.
Pressure Conversion
- 10kPa = 100hPa = 100mBar 75mmHg 100mmH2O 1.45PSI
Version Revision Record
| Version | Description | Date |
| 1.0 | Initial Release | June 2022 |
| 1.1 | Updated product pin definition | September 2023 |
2506201720_HAOBANG-HI-TECH-HBP401G101S6B_C49229982.pdf
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