Product Overview
The HBP411 product series is a piezoresistive MEMS pressure sensor. The sensor chip utilizes a Wheatstone bridge structure with four resistors diffused on a circular silicon diaphragm. When force is applied to the silicon crystal, lattice deformation occurs, causing carrier scattering and changes in carrier mobility. This perturbs the average longitudinal and transverse carrier movement, altering the silicon's resistivity and producing a linearly related voltage output signal. This product offers good linearity, repeatability, stability, and high sensitivity. Customers can select standard amplification circuits, such as instrumentation amplifiers, to adjust and compensate for output and temperature drift, achieving high-precision, high-stability, and high-reliability pressure measurements. The product features a standard DIP6 package for ease of use and is suitable for non-corrosive gas pressure detection, with broad application prospects in healthcare, smart home appliances, and industrial control.
Product Attributes
- Brand: (Haobang)
- Origin: (Wuxi)
- Technology: MEMS (Piezoresistive MEMS)
- Packaging: DIP6 (Standard DIP6)
- Application Medium: (Non-corrosive gases or liquids)
Technical Specifications
| Feature | Specification | Notes |
|---|---|---|
| Sensing Technology | Piezoresistive MEMS | High sensitivity, high stability |
| Pressure Range | -100kPa ~ +1000kPa selectable | Gauge pressure |
| Package | Standard DIP6 | Easy to use |
| Application Areas | Smart home appliances (coffee machines, beer dispensers, vacuum cleaners), Medical devices (blood pressure monitors, ventilators, oxygen concentrators), Healthcare equipment (air mattresses, massage chairs), Industrial control (pressure instruments, pneumatic systems) | For non-corrosive gases or liquids |
| Reference Amplification Circuit | Instrumentation Amplifier | Differential input, single-ended output, high input impedance, high common-mode rejection ratio, low drift, low noise |
| Reflow Soldering Curve Parameters | Preheating Zone Min Temp (TSMIN) | 150C |
| Reflow Soldering Curve Parameters | Preheating Zone Max Temp (TSMAX) | 200C |
| Reflow Soldering Curve Parameters | Preheating Time (tS) | 60~180 seconds |
| Reflow Soldering Curve Parameters | Reflow Zone Temp (TL) | 217C |
| Reflow Soldering Curve Parameters | Reflow Zone Time (tL) | 60~150 seconds |
| Reflow Soldering Curve Parameters | Peak Temp (TP) | 260C |
| Reflow Soldering Curve Parameters | Peak Temp Holding Time (tP) | 20~40 seconds |
| Reflow Soldering Curve Parameters | Max Ramp Down Rate (TP to TSMIN) | 6C/second |
| Reflow Soldering Curve Parameters | Time from 25C to Peak Temp | Max 8 minutes |
| Soldering Precautions | Flux Type | Non-corrosive rosin-based flux recommended |
| Soldering Precautions | Cleaning | Avoid cleaning agents from entering the product; do not expose to ultrasonic cleaning |
| Soldering Precautions | Reflow Cycles | Recommended not to exceed 3 times |
| Pressure Conversion | 10kPa = 100hPa = 100mBar 75mmHg 100mmH2O 1.45PSI |
2506201720_HAOBANG-HI-TECH-HBP411G040D6R_C49229988.pdf
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