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quality Silicon MEMS pressure sensor HAOBANG HI-TECH HBP401G101S6N with stable voltage output and SOP6 package factory
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quality Silicon MEMS pressure sensor HAOBANG HI-TECH HBP401G101S6N with stable voltage output and SOP6 package factory
>
Specifications
Pressure range:
-1bar~1Mpa
Module:
No
Mfr. Part #:
HBP401G101S6N
Package:
SOP-6
Key Attributes
Model Number: HBP401G101S6N
Product Description

Product Overview

The HBP401 series is a silicon piezoresistive pressure sensor utilizing a MEMS pressure chip with a Wheatstone bridge structure. Four resistors are diffused on a circular silicon diaphragm. When force is applied, the crystal lattice deforms, altering carrier mobility and resistivity, resulting in a linear voltage output. This product offers good linearity, repeatability, stability, and high sensitivity. Customers can select standard amplification circuits like instrumentation amplifiers for output and temperature drift adjustment and compensation, achieving high-precision, stable, and reliable pressure measurements. The sensor is available in a standard SOP6 package for ease of use and has broad application prospects in healthcare, smart home appliances, and industrial control.

Product Attributes

  • Brand: (Haobang)
  • Origin: (Wuxi)
  • Material: MEMS (Silicon Piezoresistive MEMS)
  • Packaging: SOP6 (Standard SOP6)

Technical Specifications

FeatureSpecificationNotes
TechnologySilicon Piezoresistive MEMS
SensitivityHigh
StabilityHigh
Pressure Range-100kPa ~ +1000kPa (Gauge Pressure)Optional ranges available
Operating Conditions (for Table 1 data)Measurement Medium: Air; Atmospheric Pressure: (101325500)Pa; Temperature: (252)C; Vibration: <0.1g(1m/s); Humidity: (50%10%) RH; Constant Current Test: DC (10.001)mA; Constant Voltage Test: DC (50.005)VUnless otherwise specified
SMT Reflow Soldering Temperature CurveSee Figure 4
SMT Reflow Soldering Parameters (Lead-free)Max Heating Rate (TSMAX to TP): 3C/sec; Preheat Min Temp (TSMIN): 150C; Preheat Max Temp (TSMAX): 200C; Preheat Time (ts): 60-180 sec; Reflow Temp (TL): 217C; Reflow Time (tL): 60-150 sec; Peak Temp (TP): 260C; Peak Temp +/-5C Hold Time (tP): 20-40 sec; Cooling Rate (TP to TSMAX): Max 6C/sec; Time from 25C to Peak Temp: Max 8 minSee Table 3
SMT Reflow Soldering RecommendationsMinimize external heat; Use non-corrosive rosin flux; Avoid flux intrusion; Max 3 reflow cycles recommended
Cleaning PrecautionsAvoid cleaning agent intrusion; Do not expose to ultrasonic treatmentTo prevent damage and performance degradation
Pin Definitions (Example - refer to Figure 2 and Table 2 for full details)Pin 1: GND, Pin 2: Vout-, Pin 3: NC, Pin 4: VDD, Pin 5: Vout+, Pin 6: GNDDefinitions may vary (see Table 2 for alternative definitions)
Reference Amplification CircuitConstant current or constant voltage driveRefer to Figure 3 for circuit diagram
Customization ServicesAvailable for different ranges, package sizes, and application areasContact info@haobang-smt.com for details
Version History1.0: Initial Release (June 2022); 1.1: Updated Pin Definitions (September 2023)

2506201720_HAOBANG-HI-TECH-HBP401G101S6N_C49229981.pdf

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