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quality Electronic thermistor DGCX NTC2.5D-9KBF20E with 7.5 millimeter lead pitch and tinned CP wire bent leads factory
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quality Electronic thermistor DGCX NTC2.5D-9KBF20E with 7.5 millimeter lead pitch and tinned CP wire bent leads factory
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Specifications
Mfr. Part #:
NTC2.5D-9KBF20E
Package:
Through Hole,P=7.5mm
Key Attributes
Model Number: NTC2.5D-9KBF20E
Product Description

Product Overview

This document details the NTC 2.5D-9/P=7.5 thermistor with an internal bent lead, model NTC2.5D-9KBF20E. It is designed for various electronic applications requiring precise temperature sensing and current limiting. The thermistor features a phenolic resin body in black and tinned CP wire leads with an internal bent configuration.

Product Attributes

  • Brand: (Chengxi Electronics)
  • Origin: Dongguan, China
  • Material: Phenolic Resin (body), Tinned CP Wire (leads)
  • Color: Black

Technical Specifications

ModelR25 (Ω)Max. Steady Current (A)Approx. Resistance at Max. Current (Ω)Dissipation Factor (mW/℃)Thermal Time Constant (S)Operating Temperature (℃)DmaxØ9.5mmTmax5.0mmW ±0.57.5mmHmax11mmLmin18mmd ±0.08ø0.6mm
MF72-2.5D-92.5Ω±20%40.1201135-55~+2002.5D-9Ø9.5mm5.0mm7.5mm11mm18mmø0.6mm

Electrical Performance

ItemStandard RequirementTest Conditions & Method
Nominal Resistance (R25)2.5Ω±20%DC resistance measured at 25±3℃ after 2 hours in still air at 25±3℃, with sufficiently low power consumption.
Max. Steady Current (A)4AA current meter, adjustable resistor, and test sample are connected in series. The product is thermostatted to 25&#8451;, and a 220V voltage is applied. The test sample should not be damaged.

Mechanical Performance

ItemTest MethodTechnical Requirements
Lead StrengthExperiment u according to GB2423-29No mechanical damage
Vibration TestSimple harmonic vibration with frequency from 10Hz-55Hz-10Hz and amplitude of 0.75. According to GB10193-88 Section 4.16.No mechanical damage
SolderabilityExperiment Ta according to GB2423-28. Using solder bath method, temperature 230±5&#8451;; immersion time 5±0.5 seconds; immersion depth 2±0.5mm.At least 95% of the terminal surface shall be continuously covered with new solder.

Packaging

Inner packaging: Bulk in plastic bags.
Outer packaging: Cardboard boxes.


2512091725_DGCX-NTC2-5D-9KBF20E_C53133403.pdf

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